Process for manufacturing through-hole contacting plated printed circuit

Claim 2

A process for manufacturing through-hole plated printed circuit boards by direct metal electrodeposition on catalytically activated surfaces of the substrate material, wherein the catalytically activated surfaces are pre-treated prior to electrodepositing the metal with a solution containing one or more nitrogen-containing organic compounds, hydroquinone or ethoxylated alkylphenols and wherein the surfaces are wired as an anode or cathode during or after the pre-treatment, but prior to electrodepositing the metal.

Claim 3

The process according to claim 1, wherein there are used as the organic compounds aliphatic, aromatic, heterocyclic or cycloaliphatic mono-, di- or polyamines, or mono- or polynuclear N-containing heterocyclic compounds, all of which may optionally be substituted with hydroxyl, carboxyl or sulfo groups, and which optionally are present in ethoxylated, propoxylated or quaternized form or in the form of an acid addition salt.

Claim 4

The process according to claim 1, characterized in that there is used as the nitrogen-containing organic compound a polyvinylpyrrolidone, 2,2,6,6-tetramethyl-4-piperidone, pyridiniumpropyl sulfo-betaine or a polymeric poly-quaternary ammonium chloride.

Claim 5

The process according to claim 1, characterized in that the pre-treatment is carried out in the presence of reducing agent.

Claim 6

The process according to claim 1, characterized in that reducing agents are employed prior to the pre-treatment.

Claim 7

The process according to claim 4, characterized in that as the reducing agents there are employed boron hydride, ascorbic acid, oxalic acid, or hypophosphite.

Claim 8

The process according to claim 1, characterized in that ultrasonic action is allowed to take place during the pre-treatment or during the electrodeposition of the metal.

Claim 9

A process for manufacturing through-hole plated printed circuit boards by direct metal electrodeposition comprising (a) catalytically activating the surface of a substrate material, (b) rinsing the catalytically activated substrate obtained from (a) with water, (c) pre-treating the catalytically activated substrate with a solution containing one or more nitrogen-containing organic compounds, hydroquinone, or ethoxylated alkylphenols, (d) wiring the substrate surface as a cathode or anode for a short period of time, and (e) electrodepositing a metal onto the substrate surface; wherein each of steps (a)-(e) is sequentially performed in alphabetical order except that step (d) may be performed simultaneously with or after step (c).

Claim 10

A process for manufacturing through-hole plated printed circuit boards by direct metal electrodeposition comprising (a) catalytically activating the surface of a substrate material, (b) rinsing the catalytically activated substrate obtained from (a) with water, (c) pre-treating the catalytically activated substrate with a solution containing one or more nitrogen-containing organic compounds, hydroquinone, or ethoxylated alkylphenols, (d) wiring the substrate surface as a cathode or anode for a short period of time, and (e) electrodepositing a metal onto the substrate surface; wherein each of steps (a)-(e) is sequentially performed in alphabetical order except that step (d) may be performed simultaneously with or after step (c).

Claim 11

A process according to claim 8, wherein the substrate surface is wired as a cathode or anode for about 3 minutes.