Metallization utilizing a catalyst which is removed or deactivated from undesired surface areas

Claim 1

A process of electroplating an adherent electrically conductive coating onto a catalyzed nonconductive surface wherein the improvement comprises plating the conductive coating on at least one catalyzed through hole wall in a conductive layer and an insulating layer to form an electrically conductive pathway through the hole and plating the conductive coating in a pattern on a surface of the conductive layer comprising the steps of: (a) forming at least one through hole through two layers of an article comprising a conductive layer and an insulating layer; (b) forming a resist image on the surface of the conductive layer; (c) applying all essential components of a catalyst system to the resist, exposed surface of the conductive layer and through hole wall; (d) applying a removing or deactivating substance to the surface of the resist which does not substantially penetrate into the through hole and which removes or deactivates catalyst on the surface of the resist without substantially affecting the catalyst present on the surface of the through hole; (e) electroplating the through hole with an adherent conductive layer to form an electrically conductive pathway without plating an adherent conductive layer on the resist.