US5138433A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multi-chip package type semiconductor device
Assignee: Toshiba Corp
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Filing: 1991-03-15
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Granted: 1992-08-11
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Expires: 2011-03-15
Abstract
Abstract In a multi-chip package type semiconductor device, semiconductor chips are bonded directly on a bed or a package substrate. This feature improves the head radiation characteristic of the device so that heat generated at the semiconductor chips is effectively dissipated.
Inventors
- 👤 Yoichi Hiruta
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 02:14
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/099; H10W70/60; H10W70/611; H10W70/67; H10W70/688; H10W90/00; H10W90/401; H10W70/68; H10W70/682; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5525; H10W74/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
47 words
A semiconductor device in which a plurality of semiconductor chips are mounted on the same package, comprising: semiconductor chips directly bonded onto a bed or a package substrate; and an insulative resin filled between said plurality of semiconductor chips mounted on the bed or the package substrate.
Claim 2
Dependent Claim
47 words
A semiconductor device in which a plurality of semiconductor chips are mounted on the same package, comprising: semiconductor chips directly bonded onto a bed or a package substrate; and an insulative resin filled between said plurality of semiconductor chips mounted on the bed or the package substrate.
Claim 3
Dependent Claim
24 words
The semiconductor device according to claim 1, wherein said package substrate is in contact with an inner lead of at least one lead terminal.
Claim 4
Dependent Claim
27 words
The semiconductor device according to claim 1, wherein said plurality of semiconductor chips are interconnected through wiring patterns formed on said resin filled between the semiconductor chips.
Claim 5
Dependent Claim
31 words
The semiconductor device according to claim 3, wherein at least part of the interconnections of said plurality of wiring patterns and said plurality of semiconductor chips are effected by bonding wires.
Claim 6
Dependent Claim
31 words
The semiconductor device according to claim 3, wherein at least part of the interconnections of said plurality of wiring patterns and said plurality of chips are effected by tape automated bonding.
Claim 7
Dependent Claim
37 words
The semiconductor device according to claim 3, wherein the interconnections between said semiconductor chips are effected by tape automated bonding, and the interconnections between the semiconductor chips and externally extending leads are effected by tape automated bonding.
Claim 8
Dependent Claim
34 words
The semiconductor device according to any one of claims 1, 2, 3, 4, 5, or 6, wherein said plurality of semiconductor chips are mounted on both surfaces of said bed or said package substrate.
Claim 9
Dependent Claim
40 words
The semiconductor device according to any one of claims 1, 2, 3, 4, 5, or 6, wherein said bed or said package substrate is insulative and sandwiched by inner leads connected to the semiconductor chips mounted on both surfaces thereof.
Claim 10
Dependent Claim
26 words
The semiconductor device according to any one of claims 1, 2, 3, 4, 5, or 6, wherein said semiconductor chips are sealed by an organic resin.
Claim 11
Dependent Claim
17 words
The semiconductor device according to claim 7, wherein said semiconductor chips are sealed by an organic resin.
Claim 12
Dependent Claim
17 words
The semiconductor device according to claim 8, wherein said semiconductor chips are sealed by an organic resin.
Claim 13
Dependent Claim
26 words
The semiconductor device according to any one of claims 1, 2, 3, 4, 5, or 6, wherein said semiconductor chips are sealed in a ceramic package.
Claim 14
Dependent Claim
17 words
The semiconductor device according to claim 7, wherein said semiconductor chips are sealed in a ceramic package.
Claim 15
Dependent Claim
17 words
The semiconductor device according to claim 8, wherein said semiconductor chips are sealed in a ceramic package.
Claim 16
Dependent Claim
21 words
The semiconductor device according to claim 12, wherein a heat radiation fin is provided on a surface of said ceramic package.
References Cited (Backward Citations)
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Cited
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-08-11 | 1996-02-10 | 1996-08-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-08-11 | 2000-02-10 | 2000-08-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-08-11 | 2004-02-10 | 2004-08-11 | $7700.00 | Window Closed / Lapsed |