Multi-chip module

Abstract

Abstract PURPOSE:To omit low-melting-point glass and a potting frame for bonding and to simplify a fabricating process, by providing a unitary structure of a base and a lead frame with a plastic molding member. CONSTITUTION:A semiconductor element 6 is bonded to the rear surface of a wiring substrate 8 through the bonding of salient electrodes 7. The wiring substrate 8 and inner leads 2A of a lead frame 2 are connected with bonding wires 9. A plastic molding member 3 is formed as follows: the lead frame 2 is mounted on a base 1; said device is put in a die such as transfer-mold forming die; and a resin, e.g., an epoxy resin, is molded.

Inventors

• 👤 Hiroshi Tate
• 👤 宏 舘
• 👤 Takayuki Okinaga
• 👤 隆幸 沖永
• 👤 Kanji Otsuka
• 👤 寛治 大塚

Bibliographic Details