Method for forming a field emission device

Claim 1

A method of forming a field emission device comprising the steps of: A) providing a substrate; B) depositing a plurality of layers of material on at least a surface of the substrate, wherein the plurality of layers of material are substantially planarly parallel to the substrate; C) performing at least one preferential etch to selectively remove at least a part of each of the plurality of layers of material and selectively expose at least a part of the substrate surface on which substrate surface the plurality of layers of material are disposed, wherein the etched area of the at least a part of each of the plurality of layers of material and the exposed at least part of the substrate surface are substantially axially symmetric with respect to each other; D) substantially conformally depositing at least a layer of material on exposed transverse surfaces of the plurality of layers of material and the selectively exposed at least part of the substrate surface; E) performing at least one directed etch, wherein at least one sidewall spacer is formed and wherein the selectively exposed at least part of the substrate surface is at least partially exposed, wherein the formation of the at least one sidewall spacer provides an insulating barrier between the at least plurality of layers of material and a centrally located interior cavity which cavity resides at the location of the exposed at least part of the selectively exposed at least part of the substrate surface; F) forming a central conductor within the cavity wherein the central conductor is disposed on the exposed at least part of the substrate; and G) performing an etch wherein the at least one spacer is at least partially removed.

Claim 2

A method of forming a field emission device comprising the steps of: A) providing a substrate; B) depositing a plurality of layers of material on at least a surface of the substrate, wherein the plurality of layers of material are substantially planarly parallel to the substrate; C) performing at least one preferential etch to selectively remove at least a part of each of the plurality of layers of material and selectively expose at least a part of the substrate surface on which substrate surface the plurality of layers of material are disposed, wherein the etched area of the at least a part of each of the plurality of layers of material and the exposed at least part of the substrate surface are substantially axially symmetric with respect to each other; D) substantially conformally depositing at least a layer of material on exposed transverse surfaces of the plurality of layers of material and the selectively exposed at least part of the substrate surface; E) performing at least one directed etch, wherein at least one sidewall spacer is formed and wherein the selectively exposed at least part of the substrate surface is at least partially exposed, wherein the formation of the at least one sidewall spacer provides an insulating barrier between the at least plurality of layers of material and a centrally located interior cavity which cavity resides at the location of the exposed at least part of the selectively exposed at least part of the substrate surface; F) forming a central conductor within the cavity wherein the central conductor is disposed on the exposed at least part of the substrate; and G) performing an etch wherein the at least one spacer is at least partially removed.