US5134094A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Single inline packaged solid state relay with high current density capability
Assignee: Crydom Inc
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Filing: 1991-07-22
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Granted: 1992-07-28
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Expires: 2011-07-22
Abstract
Abstract An AC solid state relay in a single inline package (SIP) comprised of dual silicon controlled rectifiers (SCRs) with a supporting circuitry mounted directly on an alumina substrate with molecularly bonded copper metalization layers and heat spreader all coated in a thermally conductive epoxy. And a DC solid state relay in a single inline package (SIP) comprised of an NPN power transistor with a supporting circuitry mounted directly on an alumina substrate with molecularly bonded copper metalization layers and heat spreader all coated in a thermally conductive epoxy.
Inventors
- 👤 Lada Schovanec
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 16:57
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K1/0209; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/65; H05K1/03; H05K1/0306; H05K1/05; H05K1/053; H05K1/14; H05K1/141; H05K1/16; H05K1/167; H05K1/18; H05K1/181; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09781; H05K3/00; H05K3/22; H05K3/28; H05K3/284; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
130 words
A method of increasing the current handling capability of a given solid state relay, comprising the steps of: splitting an AC current load into a first DC branch and a second DC branch, the direction of DC in the first branch being opposite to that of the second branch; controlling said first DC branch with a first semiconductor device; controlling said second DC branch with a second semiconductor device; firing a flat ceramic substrate with a metallization layer such that a molecular bond is formed between the material of the ceramic substrate and the metal; mounting said first and second semiconductor devices to the flat ceramic substrate having metallic heat spreader means; and encapsulating said flat ceramic substrate and said first and second semiconductor devices with a thermally conductive epoxy.
Claim 2
Independent Claim
130 words
A method of increasing the current handling capability of a given solid state relay, comprising the steps of: splitting an AC current load into a first DC branch and a second DC branch, the direction of DC in the first branch being opposite to that of the second branch; controlling said first DC branch with a first semiconductor device; controlling said second DC branch with a second semiconductor device; firing a flat ceramic substrate with a metallization layer such that a molecular bond is formed between the material of the ceramic substrate and the metal; mounting said first and second semiconductor devices to the flat ceramic substrate having metallic heat spreader means; and encapsulating said flat ceramic substrate and said first and second semiconductor devices with a thermally conductive epoxy.
Claim 3
Dependent Claim
19 words
The method of claim 1, wherein: the firing of the metallization layer comprises copper on an alumina ceramic substrate.
Claim 4
Dependent Claim
15 words
The method of claim 1, wherein: the firing of the metallization layer comprises palladium silver.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-07-28 | 1996-01-27 | 1996-07-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-07-28 | 2000-01-27 | 2000-07-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-07-28 | 2004-01-27 | 2004-07-28 | $7700.00 | Window Closed / Lapsed |