High-density electronic package comprising stacked sub-modules which are electrically interconnected by solder-filled vias

Claim 2

A high-density electronic package comprising a plurality of sub-modules stacked one on top of the other, each of said sub-modules including a wafer-like substrate having upper and lower planar surfaces, a planar metalization pattern affixed to said upper surface to which an integrated circuit chip is bonded, said metalization pattern consisting of conductive traces, each of which leads from a bonding pad on the chip to at least one substrate via which penetrates the substrate perpendicular to said upper and lower surfaces, and a frame-like spacer which is adhesively bonded to the upper surface of said substrate, said spacer having spacer vias which are coincident and substantially coaxial with the substrate vias, said spacer vias being of larger diameter than said substrate vias, and a capping substrate for capping the upper-most of the stacked sub-modules, said capping substrate having capping vias which are coincident with and substantially coaxial with said substrate vias and said spacer vias, but of larger diameter than said substrate vias, and a plurality of solder columns formed within the resulting stacks of coincident substrate, spacer and capping vias, which electrically interconnect traces of the various sub-modules and provide external electrical connection points on the upper surface of the capping module and the lower surface of the lower-most module.

Claim 3

The electronic package of claim 1, wherein each of said IC chips is an identical memory chip.

Claim 4

A high-density electronic package comprising a plurality of sub-modules, a capping substrate, and a plurality of solder columns which electrically interconnect said sub-modules and provide external electrical connection; each of said submodules including: (a) a rectangular, wafer-like substrate, said substrate having a planar metalization pattern affixed to its upper surface, said metalization pattern including conductive traces, each trace having chip interconnection pad (CIP) and at least one solderable package interconnection pad (PIP), said substrate also having a plurality of substrate vias which penetrate the substrate perpendicularly to said upper surface, each PIP at least partially surrounding a single substrate via; (b) an integrated circuit (IC) chip having a face containing circuitry and exposed bonding pads to access that circuitry, said IC chip being face-bonded to said substrate such that each of said bonding pads is in electrical communication with a single CIP; and (c) a frame-like spacer adhesively bonded to the peripheral upper surface of each substrate, such that said spacer perimetrically surrounds said IC chip, said spacer having a plurality of spacer vias which are substantially coincident and substantially coaxial with said substrate vias, said spacer vias being of larger diameter than said substrate vias; said capping substrate having vias substantially identical in size and location to the substrate vias, each of said sub-modules being adhesively bonded to the others so as to form a stack, with said capping substrate being adhesively bonded to the uppermost sub-module, such that the vias of any sub-module and the vias of said capping substrate are substantially coaxial with the corresponding vias of the other sub-modules, and each of said solder columns filling each of tubes of alternating-diameter sections formed by the stacked, coaxial vias.

Claim 5

A high-density electronic package comprising a plurality of sub-modules, a capping substrate, and a plurality of solder columns which electrically interconnect said sub-modules and provide external electrical connection; each of said submodules including: (a) a rectangular, wafer-like substrate, said substrate having a planar metalization pattern affixed to its upper surface, said metalization pattern including conductive traces, each trace having chip interconnection pad (CIP) and at least one solderable package interconnection pad (PIP), said substrate also having a plurality of substrate vias which penetrate the substrate perpendicularly to said upper surface, each PIP at least partially surrounding a single substrate via; (b) an integrated circuit (IC) chip having a face containing circuitry and exposed bonding pads to access that circuitry, said IC chip being face-bonded to said substrate such that each of said bonding pads is in electrical communication with a single CIP; and (c) a frame-like spacer adhesively bonded to the peripheral upper surface of each substrate, such that said spacer perimetrically surrounds said IC chip, said spacer having a plurality of spacer vias which are substantially coincident and substantially coaxial with said substrate vias, said spacer vias being of larger diameter than said substrate vias; said capping substrate having vias substantially identical in size and location to the substrate vias, each of said sub-modules being adhesively bonded to the others so as to form a stack, with said capping substrate being adhesively bonded to the uppermost sub-module, such that the vias of any sub-module and the vias of said capping substrate are substantially coaxial with the corresponding vias of the other sub-modules, and each of said solder columns filling each of tubes of alternating-diameter sections formed by the stacked, coaxial vias.

Claim 6

The electronic package of claim 3, wherein each of said IC chips is an identical memory chip.

Claim 7

The electronic package of claim 4, wherein external electrical connection is made at the via openings of the lower-most sub-module.

Claim 8

The electronic package of claim 4, wherein external electrical connection is made at the via openings of the capping substrate.

Claim 9

The electronic package of claim 4, wherein external electrical connection is made at the via openings of both the capping substrate and the lower-most sub-module.

Claim 10

The electronic package of claim 4, wherein external electrical connection is made using solder having a lower melting point than the solder used to form the solder columns within the package.

Claim 11

The electronic package of claim 4, wherein said IC chip is face bonded to said substrate with a Z-axis conductive adhesive.

Claim 12

The electronic package of claim 4, wherein said IC chip is face-bonded to said substrate using the C-4 interconnection process.

Claim 13

The electronic package of claim 4, wherein each substrate is fabricated from material having substantially the same TCE as has the semiconductor material from which the IC chips are fabricated.

Claim 14

The electronic package of claim 11, wherein said spacers and said substrates are fabricated from the same material.