Lead frame having at least two islands and resin molded semiconductor device using it

Claim 2

A lead frame for a multichip type semiconductor device comprising: a rectangular lead frame member having four straight sides and a longitudinal axis; said rectangular lead frame member including a plurality of leads, and further including first and second islands, each having four straight sides and disposed along said longitudinal axis of said rectangular lead frame member; and each of said four straight sides of said first and second islands being inclined relative to an opposing side of said four straight sides of said rectangular lead frame member at an angle θ given by 0°<θ≦45°.

Claim 3

The lead frame according to claim 1, wherein an angle between one of said four straight sides of said first island and an opposing side of said four straight sides of said rectangular lead frame member is the same as that between one of said four straight sides of said second island and an opposing side of said four straight sides of said rectangular lead frame member.

Claim 4

The lead frame according to claim 1, wherein an angle between one of said four straight sides of said first island and an opposing side of said four straight sides of said rectangular lead frame member is different from that between one of said four straight sides of said second island and an opposing side of said four straight sides of said rectangular lead frame member.

Claim 5

The lead frame according to claim 1, wherein said angle θ is given by 18°≦θ≦45°.

Claim 6

The lead frame according to claim 1, wherein said first and second islands are square in configuration.

Claim 7

The lead frame according to claim 1, wherein said first and second islands are rectangular in configuration.

Claim 8

A lead frame for a multichip type semiconductor device comprising: a rectangular lead frame member having four straight sides and first and second longitudinal axes; said rectangular lead frame member including a plurality of leads, and further including both first and second islands, each having four straight sides and disposed along said first longitudinal axis of said rectangular lead frame member, and a third island having four straight sides and disposed along said second longitudinal axis thereof; and each of said four straight sides of said first, second and third islands being inclined relative to an opposing side of said four straight sides of said rectangular lead frame member at an angle θ given by 0°<θ≦45°.

Claim 9

A lead frame for a multichip type semiconductor device comprising: a rectangular lead frame member having four straight sides and first and second longitudinal axes; said rectangular lead frame member including a plurality of leads, and further including both first and second islands, each having four straight sides and disposed along said first longitudinal axis of said rectangular lead frame member, and a third island having four straight sides and disposed along said second longitudinal axis thereof; and each of said four straight sides of said first, second and third islands being inclined relative to an opposing side of said four straight sides of said rectangular lead frame member at an angle θ given by 0°<θ≦45°.

Claim 10

The lead frame according to claim 7, wherein an angle between one of said four straight sides of said first island and an opposing side of said four straight sides of said rectangular lead frame member is the same as that between one of said four straight sides of said second island and an opposing side of said four straight sides of said rectangular lead frame member.

Claim 11

The lead frame according to claim 7, wherein an angle between one of said four straight sides of said first island and an opposing side of said four straight sides of said rectangular lead frame member is different from that between one of said four straight sides of said second island and an opposing side of said four straight sides of said rectangular lead frame member.

Claim 12

The lead frame according to claim 7, wherein an angle between one of said four straight sides of said first island and an opposing side of said four straight sides of said rectangular lead frame member is the same as that between one of said four straight sides of said third island and an opposing side of said four straight sides of said rectangular lead frame member.

Claim 13

The lead frame according to claim 7, wherein an angle between one of said four straight sides of said first island and an opposing side of said four straight sides of said rectangular lead frame member is different from that between one of said four straight sides of said third island and an opposing side of said four straight sides of said rectangular lead frame member.

Claim 14

The lead frame according to claim 7, wherein said angle θ is given by 18°≦θ≦45°.

Claim 15

The lead frame according to claim 7, wherein said first, second and third islands are square in configuration.

Claim 16

The lead frame according to claim 7, wherein said first, second and third islands are rectangular in configuration.

Claim 17

A resin molded semiconductor device comprising: a rectangular lead frame member having four straight sides and a longitudinal axis; said rectangular lead frame member including a plurality of leads, and further including first and second islands, each having four straight sides and disposed along said longitudinal axis of said rectangular lead frame member; each of said four straight sides of said first and second islands being inclined relative to an opposing side of said four straight sides of said rectangular lead frame member at an angle θ given by 0°<θ45°; and semiconductor chips, each having four straight sides and mounted on said first and second islands such that each of said four straight sides of said chips is arranged in parallel to an opposing side of said four straight sides of said first and second islands.

Claim 18

A resin molded semiconductor device comprising: a rectangular lead frame member having four straight sides and a longitudinal axis; said rectangular lead frame member including a plurality of leads, and further including first and second islands, each having four straight sides and disposed along said longitudinal axis of said rectangular lead frame member; each of said four straight sides of said first and second islands being inclined relative to an opposing side of said four straight sides of said rectangular lead frame member at an angle θ given by 0°<θ45°; and semiconductor chips, each having four straight sides and mounted on said first and second islands such that each of said four straight sides of said chips is arranged in parallel to an opposing side of said four straight sides of said first and second islands.

Claim 19

The resin molded semiconductor device according to claim 15, wherein an angle between one of said four straight sides of said first island and an opposing side of said four straight sides of said rectangular lead frame member is the same as that between one of said four straight sides of said second island and an opposing side of said four straight sides of said rectangular lead frame member.

Claim 20

The resin molded semiconductor device according to claim 15, wherein an angle between one of said four straight sides of said first island and an opposing side of said four straight sides of said rectangular lead frame member is different from that between one of said four straight sides of said second island and an opposing side of said four straight sides of said rectangular lead frame member.

Claim 21

The resin molded semiconductor device according to claim 15, wherein said angle θ is given by 18°≦θ≦45°.

Claim 22

The resin molded semiconductor device according to claim 15, wherein each of said chips has a peripheral portion and bonding pads densely and regularly located on said peripheral portion.

Claim 23

The resin molded semiconductor device according to claim 15, wherein each of said chips has a peripheral portion and bonding pads non-densely and irregularly located on said peripheral portion.

Claim 24

The resin molded semiconductor devices according to claim 20, wherein each of said chips are mounted on said first and second islands in such a manner that bonding pads of one of said chips, non-densely and irregularly located at said peripheral portion, are opposed to those of the other of said chips.