US4977441A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device and tape carrier
Assignee: Hitachi Ltd
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Filing: 1990-04-30
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Granted: 1990-12-11
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Expires: 2010-04-30
Abstract
Abstract According to the present invention, a tape carrier is prepared which comprises a power trunk line including an electric connection as a branch of a power lead for each tape carrier unit and a ground trunk line having an electric connection as a branch of a ground lead for each tape carrier unit, the power and trunk lines being continuously formed along the longitudinal direction of the tape carrier, and a lead for a control signal for establishing an electric conduction along the longitudinal direction of the tape carrier via an aging wiring for semiconductor pellets to conduct a simultaneous multipoint (gang) bonding on the tape carrier, the control signal lead being formed on the tape carrier. By mounting the semiconductor pellets having the aging wiring on the tape carrier, it is enabled to apply the power voltage and to supply the control signal to each of the plurality of the semiconductor pellets, and hence the operation test can be simultaneously conducted for the semiconductor pellets mounted on the tape carrier having an arbitrary length. This provision enables a plurality of semiconductor devices mounted on the tape carrier to be subjected to an aging, namely, a reliability test under a thermal environment and in the operating state, and hence an efficient reliability test can be achieved with an effect of the mass production. Consequently, a highly reliable semiconductor device can be provided.
Inventors
- 👤 Hideya Ohtani
- 👤 Toshimitsu Momoi
- 👤 Eiji Ooi
- 👤 Shuhei Sakuraba
- 👤 Masayuki Morita
- 👤 Yoshiaki Wakashima
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 20:18
CPC Classifications
H; H10; H10P; H10P74/00; H10P74/27; H10P74/273; H10W; H10W70/00; H10W70/099; H10W70/40; H10W70/453; H10W70/60; H10W70/67; H10W70/688; H10W72/00; H10W72/071; H10W72/077; H10W72/701; H10W72/0711; H10W72/07173; H10W90/00; H10W90/10
Claims Analysis
Total Claims: 29
Claim 1
Independent Claim
136 words
A tape carrier for a semiconductor device comprising: (a) an insulation tape having a longitudinal shape on which a plurality of tape carrier units are provided, each tape carrier unit having a wiring pattern with a plurality of leads, the tape carrier units being uniformly spaced along a length of the tape, the length being in the direction of the longitudinal shape, the plurality of leads including control signal leads, the control signal leads of adjacent tape carrier units being electrically connected by conductive lines; and (b) at least one trunk lead disposed along the entire length of the tape, with a plurality of branched leads branched from the at least one trunk lead, a respective branched lead of the plurality of branched leads being electrically connected to a lead of a corresponding tape carrier unit.
Claim 2
Dependent Claim
136 words
A tape carrier for a semiconductor device comprising: (a) an insulation tape having a longitudinal shape on which a plurality of tape carrier units are provided, each tape carrier unit having a wiring pattern with a plurality of leads, the tape carrier units being uniformly spaced along a length of the tape, the length being in the direction of the longitudinal shape, the plurality of leads including control signal leads, the control signal leads of adjacent tape carrier units being electrically connected by conductive lines; and (b) at least one trunk lead disposed along the entire length of the tape, with a plurality of branched leads branched from the at least one trunk lead, a respective branched lead of the plurality of branched leads being electrically connected to a lead of a corresponding tape carrier unit.
Claim 3
Dependent Claim
28 words
A tape carrier according to claim 1 wherein the control signal leads and conductive lines extend between adjacent tape carrier units, in the direction of the longitudinal shape.
Claim 4
Dependent Claim
44 words
A semiconductor device according to claim 1, wherein the tape carrier has opposed sides extending in the direction of the longitudinal shape, and wherein the at least one trunk lead is disposed adjacent at least one of the opposed sides of the tape carrier.
Claim 5
Dependent Claim
96 words
A semiconductor device according to claim 1, wherein the tape carrier has opposed sides extending in the direction of the longitudinal shape, with edges of the tape carrier forming boundaries for the respective opposed sides, wherein the device further includes feed holes at both sides of the tape carrier, in the direction of the longitudinal shape, and wherein the at least one trunk lead is disposed in the direction of the longitudinal shape at least one of the sides of the tape carrier, between a respective edge forming a boundary thereof and the feed holes thereof.
Claim 6
Dependent Claim
26 words
A tape carrier according to claim 1 wherein the at least one trunk lead includes a power wiring trunk lead and a ground wiring trunk lead.
Claim 7
Dependent Claim
17 words
A tape carrier according to claim 1 wherein said insulation tape is made of a polyimide film.
Claim 8
Dependent Claim
17 words
A tape carrier according to claim 1 wherein said wiring pattern is made of a copper foil.
Claim 9
Dependent Claim
247 words
A semiconductor device comprising: (a) a tape carrier, including an insulation tape having a longitudinal shape on which a plurality of tape carrier units are provided, each tape carrier unit having a wiring pattern with a plurality of leads, the plurality of leads including control signal leads; (b) the control signal leads of adjacent tape carrier units being electrically connected via conductive lines; (c) at least one trunk lead being continuously disposed along an entire length of the tape so as to be connected to the plurality of tape carrier units, in the direction of the longitudinal shape, with a plurality of branched leads branched from the trunk lead and electrically connected respectively to a lead of a corresponding tape carrier unit; and (d) a plurality of semiconductor pellets, respectively for the plurality of tape carrier units, each pellet having a surface with opposed sides, having at least one control signal pad electrode in the vicinity of one side of each semiconductor pellet and at least one control signal pad electrode in the vicinity of the side opposing said one side, and having at least one wiring layer for electrically connecting between said control signal pad electrodes at opposed sides of said semiconductor pellet; wherein said control signal pad electrodes and said control signal leads are bonded respectively, and wherein said tape carrier units provided on said tape carrier are electrically connected with each other through said control signal leads and said at least one trunk lead.
Claim 10
Dependent Claim
247 words
A semiconductor device comprising: (a) a tape carrier, including an insulation tape having a longitudinal shape on which a plurality of tape carrier units are provided, each tape carrier unit having a wiring pattern with a plurality of leads, the plurality of leads including control signal leads; (b) the control signal leads of adjacent tape carrier units being electrically connected via conductive lines; (c) at least one trunk lead being continuously disposed along an entire length of the tape so as to be connected to the plurality of tape carrier units, in the direction of the longitudinal shape, with a plurality of branched leads branched from the trunk lead and electrically connected respectively to a lead of a corresponding tape carrier unit; and (d) a plurality of semiconductor pellets, respectively for the plurality of tape carrier units, each pellet having a surface with opposed sides, having at least one control signal pad electrode in the vicinity of one side of each semiconductor pellet and at least one control signal pad electrode in the vicinity of the side opposing said one side, and having at least one wiring layer for electrically connecting between said control signal pad electrodes at opposed sides of said semiconductor pellet; wherein said control signal pad electrodes and said control signal leads are bonded respectively, and wherein said tape carrier units provided on said tape carrier are electrically connected with each other through said control signal leads and said at least one trunk lead.
Claim 11
Dependent Claim
43 words
A semiconductor device according to claim 8, wherein the semiconductor pellets each have a plurality of pad electrodes, the plurality of pad electrodes being respectively bonded to the plurality of leads of a corresponding tape carrier unit by a wireless simultaneous multipoint bonding.
Claim 12
Dependent Claim
24 words
A semiconductor device according to claim 8 wherein the at least one trunk lead includes a power trunk lead and a ground trunk lead.
Claim 13
Dependent Claim
53 words
A semiconductor device according to claim 8, further comprising a plurality of connection wirings, the connection wirings being provided on the insulation tape so as to electrically connect control signal pad electrodes of semiconductor pellets of adjacent tape carrier units, thereby providing electrical connection of control signal leads of adjacent tape carrier units.
Claim 14
Dependent Claim
60 words
A semiconductor device according to claim 11 wherein the plurality of connection wirings extend so as to electrically connect control signal pad electrodes of semiconductor pellets of adjacent tape carrier units along the entire length of the tape, so as to electrically connect in series the control signal pad electrodes of the semiconductor pellets along the length of the tape.
Claim 15
Dependent Claim
67 words
A semiconductor device according to claim 8 wherein each semiconductor pellet includes a plurality of control signal pad electrodes in the vicinity of one side of the semiconductor pellet and a plurality of control signal pad electrodes in the vicinity of the other side opposing said one side, with wiring layers respectively being provided between the control signal pad electrodes at opposed sides of said semiconductor pellet.
Claim 16
Dependent Claim
25 words
A semiconductor device according to claim 13 wherein the wiring layers are layers formed of a same material as multilayer wiring of the semiconductor pellets.
Claim 17
Dependent Claim
23 words
A semiconductor device according to claim 14, wherein the wiring layers are layers formed simultaneously with the multilayer wiring of the semiconductor pellets.
Claim 18
Dependent Claim
31 words
A semiconductor device according to claim 1 wherein the at least one wiring layer is at least one layer formed of a same material as multilayer wiring of the semiconductor pellets.
Claim 19
Dependent Claim
25 words
A semiconductor device according to claim 16 wherein the at least one wiring layer is formed simultaneously with the multilayer wiring of the semiconductor pellets.
Claim 20
Dependent Claim
19 words
A semiconductor device according to claim 8 wherein each of the at least one trunk leads is linearly disposed.
Claim 21
Dependent Claim
24 words
A semiconductor device according to claim 8 wherein the tape carrier units are uniformly spaced from each other along a length of the tape.
Claim 22
Dependent Claim
29 words
A semiconductor device according to claim 8 wherein each semiconductor pellet is provided for a respective tape carrier unit at a central zone of the respective tape carrier unit.
Claim 23
Dependent Claim
37 words
A semiconductor device according to claim 8 wherein the at least one wiring layer, extending between said control signal pad electrodes at opposed sides of said semiconductor pellet, extends in a lengthwise direction of the longitudinal shape.
Claim 24
Dependent Claim
37 words
A semiconductor device according to claim 8 wherein a line between the opposed sides of each semiconductor pellet, having the control signal pad electrodes in the vicinity thereof, extends in a lengthwise direction of the longitudinal shape.
Claim 25
Dependent Claim
44 words
A semiconductor device according to claim 8, wherein the tape carrier has opposed sides extending in the direction of the longitudinal shape, and wherein the at least one trunk lead is disposed adjacent at least one of the opposed sides of the tape carrier.
Claim 26
Dependent Claim
96 words
A semiconductor device according to claim 8, wherein the tape carrier has opposed sides extending in the direction of the longitudinal shape, with edges of the tape carrier forming boundaries for the respective opposed sides, wherein the device further includes feed holes at both sides of the tape carrier, in the direction of the longitudinal shape, and wherein the at least one trunk lead is disposed in the direction of the longitudinal shape at least one of the sides of the tape carrier, between a respective edge forming a boundary thereof and the feed holes thereof.
Claim 27
Dependent Claim
56 words
A semiconductor device according to claim 10, wherein the tape carrier has opposed sides extending in the direction of the longitudinal shape, and wherein the power trunk lead extends along one of the opposed sides of the tape carrier and the ground trunk lead extends along the other of the opposed sides of the tape carrier.
Claim 28
Dependent Claim
16 words
A semiconductor device according to claim 7, wherein said semiconductor pellets each have an integrated circuit.
Claim 29
Dependent Claim
26 words
A semiconductor device according to claim 7 wherein said plurality of semiconductor pellets each include a power input pad electrode and a ground connection pad electrode.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-12-10 | 1994-06-11 | 1994-12-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-12-10 | 1998-06-11 | 1998-12-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-12-10 | 2002-06-11 | 2002-12-11 | $7700.00 | Window Closed / Lapsed |