EP0294190A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
A resin sealed semiconductor device and a method for making the same
Assignee: Denso Corp
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Filing: 1988-06-02
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Granted: —
•
Expires: 2008-06-02
Abstract
Abstract This invention provides a resin sealed IC regulator (1), which comprises a first connecting terminal (113) electrically connected to a generator, a second connecting terminal (115) electrically connected to a device other than the generator, a monolithic IC (16) which controls an operation of the generator, mounted on a conductive member (11), and connected to both the first connecting terminal and the second connecting terminal, a resin molded portion (13) of an electric insulating resin sealing the monolithic IC and at least a portion of the first and second connecting terminals (113, 114, 115) connected to the monolithic IC. Thus an IC regulator which can be effectively used with an electrical load can be obtained, and further, an IC regulator having a more reliable control performance and able to be produced at low production cost can be obtained.
Inventors
- 👤 Hiroshi Shibata
- 👤 Fuyuki Maehara
- 👤 Akira Shintai
- 👤 Hidetoshi Kato
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 18:54
CPC Classifications
H; H02; H02J; H02J7/00; H02J7/14; H02J7/16; H02J7/24; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W90/00; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 54
Claim 1
Independent Claim
89 words
A resin sealed IC regulator, which comprises a first connecting terminal electrically connected to a generator, a second connecting terminal electrically connected to a device other than said generator, a monolithic IC which controls an operation of said generator mounted on a conductive member and electrically connected to both said first connecting terminal and said second connecting terminal and a resin molded portion of an electric insulating resin sealing said monolithic IC and at least a portion of said first and second connecting terminals connected to said monolithic IC.
Claim 2
Dependent Claim
89 words
A resin sealed IC regulator, which comprises a first connecting terminal electrically connected to a generator, a second connecting terminal electrically connected to a device other than said generator, a monolithic IC which controls an operation of said generator mounted on a conductive member and electrically connected to both said first connecting terminal and said second connecting terminal and a resin molded portion of an electric insulating resin sealing said monolithic IC and at least a portion of said first and second connecting terminals connected to said monolithic IC.
Claim 3
Dependent Claim
26 words
A resin sealed IC regulator according to claim 1, wherein said first and second connecting terminals and said conductive member are made of the same material.
Claim 4
Dependent Claim
38 words
A resin sealed IC regulator according to claim 2, wherein said resin molded portion further has a connector housing portion integrally formed thereon by molding resin in such a way that said second connecting terminals are surrounded therewith.
Claim 5
Dependent Claim
68 words
A resin sealed IC regulator according to claim 3, wherein said resin molded portion comprises a first molded portion molded with a first resin for sealing said monolithic IC and at least a portion of said first and second connecting terminals connected to said monolithic IC, and a second molded portion molded with a second resin, and externally covering at least a portion of said first molded portion.
Claim 6
Dependent Claim
95 words
A resin sealed IC regulator according to claim 4, wherein said resin molded portion comprises a first molded portion molded with a first resin sealing said monolithic IC and at least a portion of said first and second connecting terminals connected to said monolithic IC and a second molded portion integrated with a connector housing portion integratingly molded with a second resin, and externally covering at least a portion of said first molded portion, and wherein said connector housing portion is also molded in such a way that said second connecting terminals are surrounded therewith.
Claim 7
Dependent Claim
23 words
A resin sealed IC regulator according to claim 5, wherein the first resin and the second resin are the same kind of resin.
Claim 8
Dependent Claim
22 words
A resin sealed IC regulator according to claim 5, wherein the first resin and the second resin are different kinds of resin.
Claim 9
Dependent Claim
21 words
A resin sealed IC regulator according to claim 7, wherein the first resin and the second resin are different in strength.
Claim 10
Dependent Claim
24 words
A resin sealed IC regulator according to claim 8, wherein the strength of the second resin is higher than that of the first resin.
Claim 11
Dependent Claim
33 words
A resin sealed IC regulator according to claim 5, wherein a tip end of said second connecting terminal is disposed inside of a cavity provided in said connector housing portion surrounding said terminal.
Claim 12
Dependent Claim
55 words
A resin sealed IC regulator according to claim 6, wherein each of said first resin and said second resin has a characteristic such that, when molding, said first resin has a lower viscosity than that of said second resin and after molding, said second resin has a higher strength than that of the first resin.
Claim 13
Dependent Claim
29 words
A resin sealed IC regulator according to claim 7, wherein said first resin is made of a thermosetting resin and said second resin in made of a thermoplastic resin.
Claim 14
Dependent Claim
42 words
A resin sealed IC regulator according to claim 4, wherein said second resin is molded in such a way that at least a root portion of said second connecting terminal extending from said first molded portion is covered by said second resin.
Claim 15
Dependent Claim
39 words
A resin sealed IC regulator according to claim 4, wherein said second molded portion is molded in such way that at least a portion of said first molded portion is held by said second resin and fixedly engaged therein.
Claim 16
Dependent Claim
27 words
A resin sealed IC regulator according to claim 14, wherein at least one of the contacting surfaces of said first and said second molded portion is roughened.
Claim 17
Dependent Claim
18 words
A resin sealed IC regulator according to claim 15, wherein said roughened surface consists of concaves and convexes.
Claim 18
Dependent Claim
35 words
A resin sealed IC regulator according to claim 3, wherein said second connecting terminal is bent at a predetermined angle to a surface direction defined by said first molded portion molded with the first resin.
Claim 19
Dependent Claim
110 words
A resin sealed IC regulator, which comprises a first connecting terminal electrically connected to a generator, a second connecting terminal connected to a device other than said generator, a monolithic IC which controls an operation of said generator mounted on a conductive member and connected to both said first connecting terminal and said second connecting terminal, a resin molded portion with electric insulating resin sealing said monolithic IC and at least a portion of said first and second connecting terminals connected to said monolithic IC and a heat sink made of a high thermal conductive material fixed in a proximity of said monolithic IC by molding with said first resin.
Claim 20
Dependent Claim
110 words
A resin sealed IC regulator, which comprises a first connecting terminal electrically connected to a generator, a second connecting terminal connected to a device other than said generator, a monolithic IC which controls an operation of said generator mounted on a conductive member and connected to both said first connecting terminal and said second connecting terminal, a resin molded portion with electric insulating resin sealing said monolithic IC and at least a portion of said first and second connecting terminals connected to said monolithic IC and a heat sink made of a high thermal conductive material fixed in a proximity of said monolithic IC by molding with said first resin.
Claim 21
Dependent Claim
38 words
A resin sealed IC regulator according to claim 18, wherein said resin molded portion further has a connector housing portion integrally formed thereon by molding resin in such a way that said second connecting terminals are surrounded therewith.
Claim 22
Dependent Claim
68 words
A resin sealed IC regulator according to claim 18, wherein said resin molded portion comprises a first molded portion molded with a first resin sealing, said monolithic IC, and at least a portion of said first and second connecting terminals electrically connected to said monolithic IC, and a second molded portion molded with a second resin and externally covering at least a portion of said first molded portion.
Claim 23
Dependent Claim
33 words
A resin sealed IC regulator according to claim 19, wherein a tip end of said second connecting terminal is disposed inside of a cavity provided in said connector housing portion surrounding said terminal.
Claim 24
Dependent Claim
29 words
A resin sealed IC regulator according to claim 20, wherein said first resin is made of a thermosetting resin and said second resin in made of a thermoplastic resin.
Claim 25
Dependent Claim
36 words
A resin sealed IC regulator according to claim 18, wherein said heat sink is fixed over one surface of said molded portion in the same direction as that in which said second connecting terminal is bent.
Claim 26
Dependent Claim
100 words
A resin sealed semiconductor device, which comprises a plurality of a first connecting terminal electrically connected to an electrical load, a second connecting terminal electrically connected to a device other than said electrical load, a monolithic IC which controls an operation of said electrical load mounted on a conductive member and connected to both said first connecting terminal and said second connecting terminal and a resin molded portion of an electric insulating resin sealing said monolithic IC and firmly fixing said monolithic IC and at least a portion of said first and second connecting terminals connected to said monolithic IC.
Claim 27
Dependent Claim
100 words
A resin sealed semiconductor device, which comprises a plurality of a first connecting terminal electrically connected to an electrical load, a second connecting terminal electrically connected to a device other than said electrical load, a monolithic IC which controls an operation of said electrical load mounted on a conductive member and connected to both said first connecting terminal and said second connecting terminal and a resin molded portion of an electric insulating resin sealing said monolithic IC and firmly fixing said monolithic IC and at least a portion of said first and second connecting terminals connected to said monolithic IC.
Claim 28
Dependent Claim
25 words
A resin sealed semiconductor device according to claim 24, wherein said first and second connecting terminals and said conductive member made of a same material.
Claim 29
Dependent Claim
39 words
A resin sealed semiconductor device according to claim 25, wherein said resin molded portion further has a connector housing portion integrally formed thereon by molding a resin in such a way that said second connecting terminals are surrounded therewith.
Claim 30
Dependent Claim
67 words
A resin sealed semiconductor device according to claim 26, wherein said resin molded portion comprises a first molded portion molded with a first resin sealing, said monolithic IC, and at least a portion of said first and second connecting terminals connected to said monolithic IC, and a second molded portion molded with a second resin and externally covering at least a portion of said first molded portion.
Claim 31
Dependent Claim
32 words
A resin sealed semiconductor device according to claim 27, wherein a tip end of said second connecting terminal is disposed inside of a cavity provided in said connector portion surrounding said terminal.
Claim 32
Independent Claim
173 words
A method for producing a resin molded IC regulator comprising, forming a lead frame, in which at least a first connecting terminal electrically connected to an electrical load and a second connecting terminal electrically connected to a device other than said electrical load are connected to a frame portion thereof, out of a plate made of an electric conductive material, mounting a monolithic IC controlling an operation of said electrical load on a conductive member and electrically connecting said monolithic IC to said lead frame, sealing said monolithic IC mounted on said conductive member and at least a portion of said first and second connecting terminals electrically connected to said monolithic IC with a first resin having an electrical insulating characteristic to make a first molded portion, separating said frame portion from said lead frame and making a second molded portion by an externally covering molding operation to cover at least a portion of said first molded portion and surround said second connecting terminal with a second resin having an electric insulating characteristic.
Claim 33
Independent Claim
173 words
A method for producing a resin molded IC regulator comprising, forming a lead frame, in which at least a first connecting terminal electrically connected to an electrical load and a second connecting terminal electrically connected to a device other than said electrical load are connected to a frame portion thereof, out of a plate made of an electric conductive material, mounting a monolithic IC controlling an operation of said electrical load on a conductive member and electrically connecting said monolithic IC to said lead frame, sealing said monolithic IC mounted on said conductive member and at least a portion of said first and second connecting terminals electrically connected to said monolithic IC with a first resin having an electrical insulating characteristic to make a first molded portion, separating said frame portion from said lead frame and making a second molded portion by an externally covering molding operation to cover at least a portion of said first molded portion and surround said second connecting terminal with a second resin having an electric insulating characteristic.
Claim 34
Dependent Claim
63 words
A method for producing a resin molded IC regulator according to claim 29, wherein the step of sealing with said first resin is performed before the step of separating said frame portion from said lead frame, and the step of making said second molded portion with said second resin is performed after the step of separating said frame portion from said lead frame.
Claim 35
Dependent Claim
120 words
A method for producing a resin molded IC regulator according to claim 29, wherein the step of making said second molded portion with the second resin is a process for molding resin by an externally covering molding operation to cover at least a portion of said first molded portion with a portion surrounding said second connecting terminal therewithin, and for sealing at least a portion of said first connecting terminal and second connecting terminal and performed before the step of separating said frame portion from said lead frame, and the step of sealing said monolithic IC with said first resin to make said first molded portion is performed after the step of separating said frame portion from said lead frame.
Claim 36
Dependent Claim
27 words
A method for producing a resin molded IC regulator according to claim 30, wherein said first resin and said second resin are the same kind of resin.
Claim 37
Dependent Claim
28 words
A method for producing a resin molded IC regulator according to claim 30, wherein each said first resin and said second resin is a different kind of resin.
Claim 38
Dependent Claim
25 words
A method for producing a resin molded IC regulator according to claim 30, wherein said first resin and said second resin are different in strength.
Claim 39
Dependent Claim
27 words
A method for producing a resin molded IC regulator according to claim 30, wherein said second resin has a higher strength than that of the first resin.
Claim 40
Dependent Claim
33 words
A method for producing a resin molded IC regulator according to claim 33, wherein said first resin is made of a thermosetting resin and said second resin in made of a thermoplastic resin.
Claim 41
Dependent Claim
48 words
A method for producing a resin molded IC regulator according to claim 36, wherein said second resin is molded in such a way that said second resin covers at least a portion of said first molded portion of said first resin to be held by said second resin.
Claim 42
Independent Claim
130 words
A method for producing a resin molded IC regulator comprising, forming a lead frame, in which at least a first connecting terminal electrically connected to an electric load and a second connecting terminal electrically connected to a device other than said electric load are connected to a frame portion thereof, out of a plate made of electric conductive material, mounting a monolithic IC controlling an operation of said electric load on a conductive member and electrically connecting said monolithic IC to said lead frame, sealing said monolithic IC and at least a portion of said first and second connecting terminals with electric insulating resin, and simultaneously, making a molded portion integrated with said sealing portion and surrounding said second connecting terminal and separating said frame portion from said lead frame.
Claim 43
Independent Claim
130 words
A method for producing a resin molded IC regulator comprising, forming a lead frame, in which at least a first connecting terminal electrically connected to an electric load and a second connecting terminal electrically connected to a device other than said electric load are connected to a frame portion thereof, out of a plate made of electric conductive material, mounting a monolithic IC controlling an operation of said electric load on a conductive member and electrically connecting said monolithic IC to said lead frame, sealing said monolithic IC and at least a portion of said first and second connecting terminals with electric insulating resin, and simultaneously, making a molded portion integrated with said sealing portion and surrounding said second connecting terminal and separating said frame portion from said lead frame.
Claim 44
Dependent Claim
36 words
A method for producing a resin molded IC regulator according to claim 38, wherein a tip end of said second connecting terminal is disposed inside of a cavity provided in said molded portion surrounding said terminal.
Claim 45
Dependent Claim
94 words
A method for producing a resin molded IC regulator according to claim 29 or 38, wherein said lead frame has a configuration such that said second connecting terminal is connected to said lead frame through a connecting portion connected between said frame and a portion of said second connecting terminal except a tip portion thereof and the sealing operation or the molding operation is carried out in such a way that said connecting portion remains outside of said sealed or molded portion, and the separating operation is carried out by separating said connecting portion.
Claim 46
Dependent Claim
137 words
A method for producing a resin molded IC regulator according to claim 29 or 38, wherein said lead frame has a configuration such that two outermost of said second connecting terminals are connected to said lead frame through a connecting portion connected between said frame and a portion of the second connecting terminal except for a tip portion thereof, and other inner second connecting terminals are connected to one of the first connecting terminals through a intermediate connecting portion connected to a portion of said second connecting terminal except for a tip portion thereof, and the sealing operation or the molding operation is carried out in such a way that said connecting portion remains outside said sealed or molded portion and the separating operation is carried out by separating said connecting portion and said intermediate connecting portion.
Claim 47
Dependent Claim
78 words
A method for producing a resin molded IC regulator according to claim 41, wherein said sealing operation or molding operation is carried out in such a way that said connecting portion remains outside of said sealed or molded portion and said intermediate connecting portion is appeared inside of an aperture provided on said sealed or molded portion, and the separating operation is carried out by separating said connecting portion and said intermediate connecting portion appearing inside said aperture.
Claim 48
Dependent Claim
21 words
A resin sealed IC regulator according to claim 1, wherein a penetrating aperture is further provided on said resin molded portion.
Claim 49
Dependent Claim
21 words
A resin sealed semiconductor device according to claim 24, wherein a penetrating aperture is further provided on said resin molded portion.
Claim 50
Dependent Claim
146 words
A resin sealed semiconductor device, which comprises a plurality of first connecting terminals electrically connected to an electrical load, second connecting terminals connected to a device other than said electrical load, a monolithic IC which controls an operation of said electrical load mounted on a conductive member and connected to both said first connecting terminals and said second connecting terminals and a resin molded portion of an electric insulating resin sealing said monolithic IC and at least a portion of said first and second connecting terminals connected to said monolithic IC, wherein each connecting terminal directly extends from outside of said molded portion into a portion adjacent to said monolithic IC as one piece, and said extended portion of said connecting terminal is rigidly fixed within said resin, and said molded portion further comprises a connector housing integrally mounted thereon and surrounding said second connecting terminals.
Claim 51
Dependent Claim
146 words
A resin sealed semiconductor device, which comprises a plurality of first connecting terminals electrically connected to an electrical load, second connecting terminals connected to a device other than said electrical load, a monolithic IC which controls an operation of said electrical load mounted on a conductive member and connected to both said first connecting terminals and said second connecting terminals and a resin molded portion of an electric insulating resin sealing said monolithic IC and at least a portion of said first and second connecting terminals connected to said monolithic IC, wherein each connecting terminal directly extends from outside of said molded portion into a portion adjacent to said monolithic IC as one piece, and said extended portion of said connecting terminal is rigidly fixed within said resin, and said molded portion further comprises a connector housing integrally mounted thereon and surrounding said second connecting terminals.
Claim 52
Dependent Claim
16 words
A resin sealed semiconductor device according to claim 45, wherein an electrical load is a generator.
Claim 53
Dependent Claim
44 words
A resin sealed semiconductor device according to claim 45, wherein said first connecting terminal is a terminal which can be directly connected to a portion on said electrical load and said second connecting terminal is a terminal which can be used as a connector.
Claim 54
Dependent Claim
30 words
A resin sealed semiconductor device according to claim 45 or 47, wherein said connector housing is bent at a predetermined angle to a surface direction defined by said molded portion.
References Cited (Backward Citations)
No citation records indexed.
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