US5126819A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wiring pattern of semiconductor integrated circuit device
Assignee: Toshiba Corp
•
Filing: 1990-11-06
•
Granted: 1992-06-30
•
Expires: 2010-11-06
Abstract
Abstract As shown in FIG. 4, a wiring pattern of a semiconductor integrated circuit device of the present invention comprises a wiring portion extending from a connection hole and a connection portion located on the connection hole and having a matching allowance with respect to said connection hole on said wiring portion side being formed wider than a predetermined matching allowance by a predetermined width with which a required yield of successful matching can be assured.
Inventors
- 👤 Masahiro Abe
- 👤 Yasukazu Mase
- 👤 Tomie Yamamoto
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 16:45
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/056; H10W20/40; H10W20/41; H10W20/43; H10W20/071; H10W20/081; H10W20/42; H10W72/00; H10W72/90
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
133 words
A wiring pattern of a semiconductor integrated circuit device, comprising: a first wiring portion formed around a rectangular contact hole and having a rectangular shape, said first wiring portion having first to fourth sides which are adjacent to sides of the contact hole; a second wiring portion having an end portion connected to the first side of the first wiring portion, said second wiring portion having a wiring width narrower than the length of the first side of the first wiring portion; and a third portion defined by the first wiring portion, the second wiring portion, and a straight line which passes through one end of the first side of the first wiring portion and forms an angle of θ where (0<θ<π/2) with reference to the first side of the first wiring portion.
Claim 2
Dependent Claim
133 words
A wiring pattern of a semiconductor integrated circuit device, comprising: a first wiring portion formed around a rectangular contact hole and having a rectangular shape, said first wiring portion having first to fourth sides which are adjacent to sides of the contact hole; a second wiring portion having an end portion connected to the first side of the first wiring portion, said second wiring portion having a wiring width narrower than the length of the first side of the first wiring portion; and a third portion defined by the first wiring portion, the second wiring portion, and a straight line which passes through one end of the first side of the first wiring portion and forms an angle of θ where (0<θ<π/2) with reference to the first side of the first wiring portion.
Claim 3
Dependent Claim
21 words
The wiring pattern of a semiconductor integrated circuit device according to claim 1, wherein said contact hole has a square shape.
Claim 4
Dependent Claim
26 words
The wiring pattern of a semiconductor integrated circuit device according to claim 1, wherein said contact hole has a square shape of about 3.0 μm×3.0 μm.
References Cited (Backward Citations)
GB2029097A
Cited
US4381215A
Cited
US4482914A
Cited
JPS57201171A
Cited
JPS59188149A
Cited
JPS60208845A
Cited
EP0166344A2
Cited
JPS61194848A
Cited
JPS6378554A
Cited
EP0289274A2
Cited
JPS63292672A
Cited
JPH01305531A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-06-30 | 1995-12-30 | 1996-06-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-06-30 | 1999-12-30 | 2000-06-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-06-30 | 2003-12-30 | 2004-06-30 | $7700.00 | Window Closed / Lapsed |