Position detection method and apparatus

Claim 2

A position detecting method for detecting the position of a substrate by use of a mark provided on the substrate and having an optical power dependent upon wavelength, said method comprising the steps of: irradiating the mark with first and second radiation beams having different wavelengths; and receiving the first and second radiation beams from the mark by use of a sensor to determine the position of the substrate on the basis of the position of incidence of each of the first and second radiation beams on the sensor.

Claim 3

A method according to claim 1, wherein the position of the substrate with respect to a direction substantially perpendicular to the surface of the substrate is detected.

Claim 4

A method according to claim 1, wherein the position of the substrate with respect to a direction substantially parallel to the surface of the substrate is detected.

Claim 5

A method according to claim 2 or 3, wherein the position of incidence of each of the first and second radiation beams upon the sensor is determined on the basis of the position of a gravity center of an intensity distribution of each radiation beam upon a light receiving surface of the sensor.

Claim 6

A method according to claim 2 or 3, wherein the position of incidence of each of the first and second radiation beams upon the sensor is determined on the basis of the position of a peak of an intensity distribution of each radiation beam upon a light receiving surface of the sensor.

Claim 7

A method according to claim 1, wherein the mark comprises a Fresnel zone plate.

Claim 8

A method according to claim 6, wherein the mark is adapted to diffract the first and second radiation beams so that they are converged at predetermined positions, respectively.

Claim 9

A method according to claim 1, wherein the first and second radiation beams are projected in sequence to the grating pattern.

Claim 10

A method according to claim 1, wherein the first and second radiation beams are projected to the grating pattern simultaneously.

Claim 11

A method according to claim 8 or 9, wherein the first and second radiation beams are received by the sensor in sequence.

Claim 12

A method according to claim 9, wherein the first and second radiation beams are received by first and second, separate sensors, independently of each other.

Claim 15

A method according to claim 12, wherein the first substrate is a mask having an integrated circuit pattern formed thereon, and wherein the second substrate is a semiconductor wafer.

Claim 16

A method according to claim 12, wherein the first substrate is a semiconductor wafer and the second substrate is a mask having an integrated circuit pattern formed thereon.

Claim 17

A method according to claim 12, wherein the first mark has a positive power and the second mark has a negative power.

Claim 18

A method according to claim 12, wherein the first mark has a negative power and the second mark has a positive power.

Claim 19

A method according to claim 12, wherein each of the first and second marks has a positive power.

Claim 20

A method according to claim 12, wherein the first and second radiation beams are projection to sequence to the first mark.

Claim 21

A method according to claim 12, wherein the first and second radiation beams are projected to the first mark simultaneously.

Claim 22

A method according to claim 18 or 19, wherein the first and second diffraction beams are received by the sensor in sequence.

Claim 23

A method according to claim 19, wherein the first and second diffraction beams are received by first and second, separate sensors, independently of each other.

Claim 24

A method according to claim 12, wherein each of the first and second marks is provided by a grating pattern.

Claim 25

A method according to claim 22, wherein the diffraction pattern comprises a Fresnel zone plate.

Claim 26

A method according to claim 12, wherein the position of incidence of each of the first and second diffraction beams upon the sensor is determined on the basis of the position of a gravity center of an intensity distribution of each diffraction beam upon a light receiving surface of the sensor.

Claim 27

A method according to claim 12, wherein the position of incidence of each of the first and second diffraction beams upon the sensor is determined on the basis of the position of a peak of an intensity distribution of each diffraction beam upon a light receiving surface of the sensor.

Claim 30

A method according to claim 26, wherein the position of incidence of each of the first and second diffraction beams upon the sensor is determined on the basis of the position of a gravity center of an intensity distribution of each diffraction beam upon a light receiving surface of the sensor.

Claim 31

A method according to claim 26, wherein the position of incidence of each of the first and second diffraction beams upon the sensor is determined on the basis of the position of a peak of an intensity distribution of each diffraction beam upon a light receiving surface of the sensor.

Claim 32

A method according to claim 26, wherein the first substrate is provided with an auxiliary grating pattern, different from the first mentioned grating pattern, and wherein the first and second diffraction beams reflected by the second substrate are diffracted again by the auxiliary grating pattern and are directed to the sensor.

Claim 33

A method according to claim 29, wherein the auxiliary grating pattern has an optical power.

Claim 34

A method according to claim 30, wherein the auxiliary grating pattern comprises a Fresnel zone plate.

Claim 35

A method according to claim 30, wherein the second substrate is provided with a grating pattern and wherein the first and second diffraction beams are directed to the grating pattern of the second substrate.

Claim 36

A method according to claim 26, wherein the first and second radiation beams are projected in sequence to the grating pattern.

Claim 37

A method according to claim 26, wherein the first and second radiation beams are projected to the grating pattern simultaneously.

Claim 38

A method according to claim 33 or 34, wherein the first and second diffraction beams are received by the sensor in sequence.

Claim 39

A method according to claim 36, wherein the first and second diffraction beams are received by first and second, separate sensors, independently of each other.

Claim 42

A method according to claim 37, wherein the position of incidence of each of the first and second radiation beams on the sensor is determined on the basis of the position of a gravity center of an intensity distribution of each radiation beam on a light receiving surface of the sensor.

Claim 43

A method according to claim 39, wherein the position of incidence of each of the first and second radiation beams on the sensor is determined on the basis of the position of a peak of an intensity distribution of each radiation beam on a light receiving surface of the sensor.

Claim 44

A method according to claim 37, wherein the pattern is provided by a grating pattern.

Claim 45

A method according to claim 40, wherein the grating pattern comprises a Fresnel zone plate.

Claim 46

A method according to claim 37, wherein the first and second radiation beams are projected in sequence to the grating pattern.

Claim 47

A method according to claim 37, wherein the first and second radiation beams are projected to the grating pattern simultaneously.

Claim 48

A method according to claim 42 or 43, wherein the first and second diffraction beams are received by the sensor in sequence.

Claim 49

A method according to claim 43, wherein the first and second diffraction beams are received by first and second, separate sensors, independently of each other.

Claim 50

An exposure apparatus for exposing a wafer having an alignment mark with an optical power dependent upon wavelength, said apparatus comprising: a movable stage for carrying the wafer thereon; driving means for moving said stage for alignment of the wafer; projecting means for projecting first and second beams having different wavelengths to the alignment mark of the wafer; detecting means having a detection surface of receiving first and second beam patterns of different wavelengths produced by reflection of the first and second means by the alignment mark of the wafer, and for producing first and second signals corresponding to positions of the first and second beam patterns, respectively, on said detection surface; and control means for detecting a deviation in positional relationship of the first and second beam patterns from a predetermined positional relationship by using the first and second signals, and for producing and applying a correction signal, corresponding to the detected deviation, to said driving means for alignment of the wafer.

Claim 51

An exposure apparatus for exposing a wafer having an alignment mark with an optical power dependent upon wavelength, said apparatus comprising: a movable stage for carrying the wafer thereon; driving means for moving said stage for alignment of the wafer; projecting means for projecting first and second beams having different wavelengths to the alignment mark of the wafer; detecting means having a detection surface of receiving first and second beam patterns of different wavelengths produced by reflection of the first and second means by the alignment mark of the wafer, and for producing first and second signals corresponding to positions of the first and second beam patterns, respectively, on said detection surface; and control means for detecting a deviation in positional relationship of the first and second beam patterns from a predetermined positional relationship by using the first and second signals, and for producing and applying a correction signal, corresponding to the detected deviation, to said driving means for alignment of the wafer.

Claim 52

An apparatus according to claim 46, further comprising supporting means for supporting a mask having an alignment pattern with an optical power dependent upon wavelength, wherein said projecting means projects the first and second beams to the alignment pattern of the mask and then to the alignment mark of the wafer, and wherein said control means produces and applies a correction signal to said driving means for alignment of the mask and the wafer.

Claim 53

An exposure apparatus for exposing a wafer to a mask having a pattern with an optical power dependent upon wavelength, said apparatus comprising: a movable stage for carrying the wafer thereon; driving means for moving said stage for alignment of a surface of the wafer; projecting means for projecting first and second beams having different wavelengths obliquely to the surface of the wafer, such that first and second reflection beams are produced by reflection by the surface of the wafer; detecting means having a detection surface for receiving first and second beam patterns of different wavelengths produced by deflection of the first and second reflection beams by the pattern of the mask, and for producing first and second signals corresponding to positions of the first and second beam patterns, respectively on said detection surface; and control means for detecting a deviation in position relationship of the first and second beam patterns from a predetermined positional relationship by using the first and second signals, and for producing and applying a correction signal, corresponding to the detected deviation, to said driving means for alignment of the surface of the wafer;

Claim 54

An exposure apparatus for exposing a wafer to a mask having a pattern with an optical power dependent upon wavelength, said apparatus comprising: a movable stage for carrying the wafer thereon; driving means for moving said stage for alignment of a surface of the wafer; projecting means for projecting first and second beams having different wavelengths obliquely to the surface of the wafer, such that first and second reflection beams are produced by reflection by the surface of the wafer; detecting means having a detection surface for receiving first and second beam patterns of different wavelengths produced by deflection of the first and second reflection beams by the pattern of the mask, and for producing first and second signals corresponding to positions of the first and second beam patterns, respectively on said detection surface; and control means for detecting a deviation in position relationship of the first and second beam patterns from a predetermined positional relationship by using the first and second signals, and for producing and applying a correction signal, corresponding to the detected deviation, to said driving means for alignment of the surface of the wafer;

Claim 55

A semiconductor device manufacturing method for aligning a wafer having a mark with an optical power dependent upon wavelength by using the mark and for printing a circuit pattern on the thus aligned wafer, comprising the steps of: projecting first and second beams having different wavelengths to the mark of the wafer, whereby first and second beam patterns are produced by the first and second beams from the mark, on a predetermined plane; detecting a positional relationship between the first and second beam pattern on the predetermined plane; and aligning the wafer on the basis of the detected positional relationship.

Claim 56

A semiconductor device manufacturing method for aligning a wafer having a mark with an optical power dependent upon wavelength by using the mark and for printing a circuit pattern on the thus aligned wafer, comprising the steps of: projecting first and second beams having different wavelengths to the mark of the wafer, whereby first and second beam patterns are produced by the first and second beams from the mark, on a predetermined plane; detecting a positional relationship between the first and second beam pattern on the predetermined plane; and aligning the wafer on the basis of the detected positional relationship.

Claim 57

A method according to claim 49, wherein the mark of the wafer is formed by a zone plate pattern.

Claim 58

A semiconductor device manufacturing method for aligning a surface of a wafer by using a matrix pattern of a mask having an optical power dependent upon wavelength and for printing a circuit pattern of the mask on the thus aligned wafer, comprising the steps of: projecting first and second beams having different wavelengths obliquely to the surface of the wafer, such that the first and second beams are reflected by the surface of the wafer and then are deflected by the mark pattern of the mask, whereby first and second beam patterns are formed on a predetermined plane; detecting a positional relationship between the first and second beam pattern on the predetermined plane; and aligning the surface of the wafer on the basis of the detected positional relationship.

Claim 59

A semiconductor device manufacturing method for aligning a surface of a wafer by using a matrix pattern of a mask having an optical power dependent upon wavelength and for printing a circuit pattern of the mask on the thus aligned wafer, comprising the steps of: projecting first and second beams having different wavelengths obliquely to the surface of the wafer, such that the first and second beams are reflected by the surface of the wafer and then are deflected by the mark pattern of the mask, whereby first and second beam patterns are formed on a predetermined plane; detecting a positional relationship between the first and second beam pattern on the predetermined plane; and aligning the surface of the wafer on the basis of the detected positional relationship.

Claim 60

A method according to claim 51, wherein the mark pattern of the mask is formed by a zone plate pattern.