Method for manufacturing a resin encapsulated semiconductor device

Claim 1

A method of manufacturing a resin encapsulated semiconductor device comprising: mounting a semiconductor chip including electrodes on a die pad of a unitary lead frame, the lead frame including a plurality of leads disposed peripherally around the die pad, an outer frame member peripherally disposed around said die pad from which said plurality of leads extend, supporting leads extending from the outer frame member to and supporting the die pad, and resin guide means extending toward the die pad from the outer frame member and having a width; electrically connecting the electrodes of the semiconductor chip to respective leads of the lead frame; positioning the lead frame on which the semiconductor chip is mounted between a pair of mold halves, each mold half including a parting surface and, when the parting surfaces of the mold halves are brought together, forming a cavity including a gate for supplying a molten resin to the cavity, the gate having a width no wider than the width of the resin guide means; bringing the mold halves together to form the cavity with the semiconductor chip and die pad therein and the resin guide means extending across the width of the gate and disposed centrally within the gate, dividing the gate into substantially similar first and second portions lying on opposite sides of the resin guide means, the resin guide means extending from the gate into the cavity; injecting a molten resin into the cavity through the gate, the resin guide means dividing the molten resin into two separated streams in the gate and in the cavity adjacent the gate and guiding the two streams of molten resin flowing through the gate to opposite sides of the die pad and the semiconductor chip without intermixing of the two streams in the gate and adjacent the gate in the cavity, whereby deformation of the lead frame during resin encapsulation is avoided; solidifying the resin; separating the mold halves from each other; and removing the encapsulated semiconductor chip from the mold halves.

Claim 2

A method of manufacturing a resin encapsulated semiconductor device comprising: mounting a semiconductor chip including electrodes on a die pad of a unitary lead frame, the lead frame including a plurality of leads disposed peripherally around the die pad, an outer frame member peripherally disposed around said die pad from which said plurality of leads extend, supporting leads extending from the outer frame member to and supporting the die pad, and resin guide means extending toward the die pad from the outer frame member and having a width; electrically connecting the electrodes of the semiconductor chip to respective leads of the lead frame; positioning the lead frame on which the semiconductor chip is mounted between a pair of mold halves, each mold half including a parting surface and, when the parting surfaces of the mold halves are brought together, forming a cavity including a gate for supplying a molten resin to the cavity, the gate having a width no wider than the width of the resin guide means; bringing the mold halves together to form the cavity with the semiconductor chip and die pad therein and the resin guide means extending across the width of the gate and disposed centrally within the gate, dividing the gate into substantially similar first and second portions lying on opposite sides of the resin guide means, the resin guide means extending from the gate into the cavity; injecting a molten resin into the cavity through the gate, the resin guide means dividing the molten resin into two separated streams in the gate and in the cavity adjacent the gate and guiding the two streams of molten resin flowing through the gate to opposite sides of the die pad and the semiconductor chip without intermixing of the two streams in the gate and adjacent the gate in the cavity, whereby deformation of the lead frame during resin encapsulation is avoided; solidifying the resin; separating the mold halves from each other; and removing the encapsulated semiconductor chip from the mold halves.