Lead frame

Abstract

Abstract PURPOSE:To obtain a small size high power semiconductor device by integrally providing a wire heat radiation fin between tab and tab suspending lead. CONSTITUTION:The lead positioning holes 2 are provided with a constant interval to the external frame 1 and the pellet setting tab 5 integrally having a heat radiation fin is provided through a tab suspending lead. Thereby, a couple of pins can be provided more than the case where the tab suspending lead is independently provided in this frame. This fin 4 is branched to three portions by a resin filling hole 6 at the area near the mold line. The one becomes the tab suspending lead, and the other two is in the same shape as the outer lead at the outside of dam tie-bar 7. A pair of fins 4 are provided with dam tie-bar 7 in such a way as surrounding the tab 5 with a constant interval and this tie-bar 7 is provided with may inner lead 8 and outer leads 9. Moreover, the base portion of fin 4 is sufficiently wider than the lead 8 and it becomes wider toward the base, showing excellent heat radiation and heat conduction property.

Inventors

• 👤 Kazuo Shimizu
• 👤 一男 清水
• 👤 Kazuo Hoya
• 👤 保谷　和男

Bibliographic Details