Method for resin sealing of semiconductor device and apparatus thereof

Abstract

Abstract PURPOSE:To enable to uniformly fill resin in each cavity as well as to enable to improve the yield of production by a method wherein an injection gate is formed by arrangement in such a manner that resin material will be poured in from the side reverse to the bonding wire assembling side. CONSTITUTION:The bottom force 31 and the top force 32 of a molding mold 30 are opened, a lead frame 17 is placed and arranged on the bottom force 31 in such a manner that a wire 19 will be positioned on the side reverse to the gate 35, and then the bottom force 31 and the top force 32 are butted together and arranged. Subsequently, the prescribed quantity of preheated resin material is supplied to each supply pot 33 respectively, the resin material supplied by a plunger 34 is pressure-injected to a cavity 36, and sealing resin is molded. A gate 35 from which resin will be injected into the cavity 36 is provided on the lower side of the lead frame 17, which is the assembled side of the bonding wire 19, and the resin material is pressure-injected from the lower side of the wire 19.

Inventors

• 👤 Toyoshige Kawashima
• 👤 川島　豊茂
• 👤 Akihiro Kubota
• 👤 昭弘 窪田
• 👤 Masao Takehiro
• 👤 武広　正雄
• 👤 Eiji Yokota
• 👤 横田　栄二

Bibliographic Details