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US5090356A Expired / Lapsed US ⏱️ 0.0 years remaining

Chemically active isolation passageway for deposition chambers

Assignee: United Solar Systems Corp
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Filing: 1991-06-28
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Granted: 1992-02-25
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Expires: 2011-06-28
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Abstract

Abstract An improved gas gate (34) is adapted to operatively interconnect to adjacent chambers in which process gases are introduced for depositing a first layer (16) upon a substrate (11) in a first chamber (28) and different process gases are introduced for depositing a second layer (18) in the second chamber (30) in continuous low pressure glow dicharge deposition process. A plurality of electrodes (60) and grounded shields (62) are positioned in the isolation passageway (92) of gas gate (34). The electrodes (60) have a potential sufficient to create a plasma from any gas molecule escaping from one of the deposition chambers. After the plasma is formed it is attracted to and captured or plated on the shield (62) preventing the gas plasma from landing on the substrate material (11) or passing through the gas gate. The present invention reduces the back diffusion of gases through the gas gate by actively eliminating free gas molecules by ionizing them to form a plasma and capturing the plasma ions in a permanent fashion.

Inventors

  • 👤 Prem Nath
  • 👤 Jon Call
  • 👤 Gary M. DiDio
  • 👤 Kevin Hoffman

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 13:34
CPC Classifications
C; C23; C23C; C23C16/00; C23C16/44; C23C16/54; C23C16/545

Claims Analysis

Total Claims: 19
Claim 1
Independent Claim 114 words
In an isolation passageway adapted to operatively interconnect a first and second adjacent low pressure deposition chamber wherein a first semiconductor layer is deposited on a substrate in said first chamber and a second semiconductor layer is deposited on said substrate in said second chamber, to provide reduced diffusion of gases between said first and second chambers and to provide passage of said substrate therethrough; said improvement characterized by: a plurality of electrodes positioned in said passageway for producing a plasma from any gases in said isolation passageway; a plurality of grounded shields constructed and positioned to be plated by said plasma and preventing plasma within said isolation passageway from depositing on said substrate.
Claim 2
Dependent Claim 114 words
In an isolation passageway adapted to operatively interconnect a first and second adjacent low pressure deposition chamber wherein a first semiconductor layer is deposited on a substrate in said first chamber and a second semiconductor layer is deposited on said substrate in said second chamber, to provide reduced diffusion of gases between said first and second chambers and to provide passage of said substrate therethrough; said improvement characterized by: a plurality of electrodes positioned in said passageway for producing a plasma from any gases in said isolation passageway; a plurality of grounded shields constructed and positioned to be plated by said plasma and preventing plasma within said isolation passageway from depositing on said substrate.
Claim 3
Dependent Claim 43 words
In an isolation passageway as defined in claim 1 further characterized by: said shields each having a substantially U-shaped cross section and elongated to co-extend substantially with said electrode; and said electrode being positioned within the interior space defined by said U-shaped shield.
Claim 4
Dependent Claim 35 words
In an isolation passageway as defined in claim 2 further characterized by: said electrodes and shields each extending transversely across said passageway; said electrodes and shields being spacedly positioned along the length of said passageway.
Claim 5
Dependent Claim 24 words
In an isolation passageway as defined in claim 2 further characterized by: said shields having a midportion interposed between said electrodes and said substrate.
Claim 6
Dependent Claim 54 words
In a isolation passageway as defined in claim 4 further characterized by: said shields having a downwardly facing opening; said substrate enters said passageway at a point below said opening of said shield and passes upwardly above and over said shield and downwardly to a point below said shield where it exits said passageway.
Claim 7
Dependent Claim 35 words
In a isolation passageway as defined in claim 1 further characterized by: said electrodes and shields each extending transversely across said passageway; said electrodes and shields being spacedly positioned along the length of said passageway.
Claim 8
Dependent Claim 21 words
In an isolation passageway as defined in claim 1 further characterized by: said shields interposed between said electrodes and said substrate.
Claim 9
Dependent Claim 54 words
In an isolation passageway as defined in claim 7 further characterized by: said shields having a downwardly facing opening; said substrate enters said passageway at a point below said opening of said shield and passes upwardly above and over said shield and downwardly to a point below said shield where it exits said passageway.
Claim 10
Dependent Claim 23 words
In an isolation passageway as defined in claim 1 further characterized by: said electrodes being connected to a low frequency alternating current potential.
Claim 11
Dependent Claim 47 words
In an isolation passageway as defined in claim 1 further characterized by: said shield each contoured substantially about a perimeter of said electrode and defining a cavity in which said electrode is positioned and said shield having an opening facing away from a portion of said substrate.
Claim 12
Dependent Claim 54 words
In an isolation passageway as defined in claim 10 further characterized by: said shields having a downwardly facing opening; said substrate enters said passageway at a point below said opening of said shield and passes upwardly above and over said shield and downwardly to a point below said shield where it exits said passageway.
Claim 13
Dependent Claim 105 words
In an isolation passageway adapted to operatively interconnect a first and second adjacent low pressure deposition chamber wherein a first semiconductor layer is deposited on a substrate in one of said first chamber and a second semiconductor layer is deposited on said substrate in said second chamber, to provide reduced diffusion of gases between said first and second chambers, and to provide passage of said substrate therethrough; said improvement characterized by: a plasma generating means for converting said process gases in said isolation passageway into a plasma; and an attraction means for electrically attracting said plasma and spatially isolating said plasma away from said substrate.
Claim 14
Dependent Claim 105 words
In an isolation passageway adapted to operatively interconnect a first and second adjacent low pressure deposition chamber wherein a first semiconductor layer is deposited on a substrate in one of said first chamber and a second semiconductor layer is deposited on said substrate in said second chamber, to provide reduced diffusion of gases between said first and second chambers, and to provide passage of said substrate therethrough; said improvement characterized by: a plasma generating means for converting said process gases in said isolation passageway into a plasma; and an attraction means for electrically attracting said plasma and spatially isolating said plasma away from said substrate.
Claim 15
Dependent Claim 40 words
In an isolation passageway as defined in claim 12 further characterized by: a plurality of plasma generating means spacedly positioned along the length of said passageway, each of said generating plasma means being elongated and extending transversely across said passageway.
Claim 16
Dependent Claim 25 words
In an isolation passageway as defined in claim 13 further characterized by: said attraction means being interposed between said plasma generating means and said substrate.
Claim 17
Dependent Claim 31 words
In an isolation passageway as defined in claim 12 further characterized by: a grounded shield for partially defining a space for said spatially isolated plasma and for grounding said plasma thereon.
Claim 18
Dependent Claim 95 words
In an isolation passageway adapted to operatively interconnect a first and second adjacent low pressure deposition chamber wherein a first semiconductor layer is deposited on a substrate in one of said first chamber and a second semiconductor layer is deposited on said substrate in said second chamber, to provide reduced diffusion of gases between said first and second chambers and to provide passage of said substrate therethrough; said improvement characterized by: means for chemically attaching to said gases within said isolation passageway for eliminating free diffusing gaseous molecules, atoms, and ions within said isolation passageway.
Claim 19
Dependent Claim 95 words
In an isolation passageway adapted to operatively interconnect a first and second adjacent low pressure deposition chamber wherein a first semiconductor layer is deposited on a substrate in one of said first chamber and a second semiconductor layer is deposited on said substrate in said second chamber, to provide reduced diffusion of gases between said first and second chambers and to provide passage of said substrate therethrough; said improvement characterized by: means for chemically attaching to said gases within said isolation passageway for eliminating free diffusing gaseous molecules, atoms, and ions within said isolation passageway.

References Cited (Backward Citations)

US4626447A Cited
US4664951A Cited
US4723507A Cited
US4920917A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1995-02-24 1995-08-26 1996-02-25 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1999-02-24 1999-08-26 2000-02-25 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2003-02-24 2003-08-26 2004-02-25 $7700.00 Window Closed / Lapsed

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