Semi conductor device and process for fabrication of same

Claim 1

A method for fabricating a semiconductor device as an document reading device of the type wherein a plurality of sandwich type photoelectric conversion elements are juxtaposed, said semiconductor device being prepared by the steps of: forming a plurality of first electrodes on a substrate; forming a continuous strip of hydrogenated amorphous silicon layer on said first electrodes as a photoelectric conversion layer; converting a portion of said hydrogenated amorphous silicon layer corresponding to each region between adjacent ones of said first electrodes into an insulating silicon oxide layer by optically assisted anodization, and forming a second electrode on said insulating silicon oxide layer.

Claim 2

A method for fabricating a semiconductor device as an document reading device of the type wherein a plurality of sandwich type photoelectric conversion elements are juxtaposed, said semiconductor device being prepared by the steps of: forming a plurality of first electrodes on a substrate; forming a continuous strip of hydrogenated amorphous silicon layer on said first electrodes as a photoelectric conversion layer; converting a portion of said hydrogenated amorphous silicon layer corresponding to each region between adjacent ones of said first electrodes into an insulating silicon oxide layer by optically assisted anodization, and forming a second electrode on said insulating silicon oxide layer.

Claim 5

A method for fabricating a semiconductive device comprising the steps of: (a) forming a thin chromium film on an insulated ceramic substrate; (b) processing said film to form a plurality of chromium electrodes using a photolitho-etching technique; (c) depositing a hydrogenated amorphous silicon layer in the form of strips over said chromium electrodes using the plasma CVD method; (d) depositing a resist over said hydrogenated amorphous silicon layer; (e) forming a pattern in said resist; (f) placing said substrate with said members disposed on it in an aqueous electrolytic solution; (g) optically anodizing said amorphous silicon by: (i) exposing it to radiation while (ii) electrically connecting it to a metallic member disposed in said electrolytic solution; and (h) applying a transparent electrode over said photoanodized layer whereby a transparent electrode covers a plurality of amorphous silicon electrodes separated by insulative oxidized material.

Claim 6

A method for fabricating a semiconductive device comprising the steps of: (a) forming a thin chromium film on an insulated ceramic substrate; (b) processing said film to form a plurality of chromium electrodes using a photolitho-etching technique; (c) depositing a hydrogenated amorphous silicon layer in the form of strips over said chromium electrodes using the plasma CVD method; (d) depositing a resist over said hydrogenated amorphous silicon layer; (e) forming a pattern in said resist; (f) placing said substrate with said members disposed on it in an aqueous electrolytic solution; (g) optically anodizing said amorphous silicon by: (i) exposing it to radiation while (ii) electrically connecting it to a metallic member disposed in said electrolytic solution; and (h) applying a transparent electrode over said photoanodized layer whereby a transparent electrode covers a plurality of amorphous silicon electrodes separated by insulative oxidized material.

Claim 7

A method for fabricating a semiconductive device comprising the steps of: (a) forming a thin chromium film on an insulated substrate; (b) processing said film to form a plurality of metallic electrodes using a photolitho-etching technique; (c) depositing a hydrogenated amorphous silicon layer in the form of strips over said metallic electrodes; (d) depositing a resist over said amorphous silicon layer; (e) forming a pattern in said resist; (f) placing said substrate with said members disposed on it in an electrolytic solution; (g) optically anodizing said amorphous silicon by: (i) exposing it to radiation while (ii) electrically connecting it to a metallic member disposed in said electrolytic solution; and (h) applying a transparent electrode over said photoanodized layer whereby a transparent electrode covers a plurality of amorphous silicon electrodes separated by insulative oxidized material.

Claim 8

A method for fabricating a semiconductive device comprising the steps of: (a) forming a thin chromium film on an insulated substrate; (b) processing said film to form a plurality of metallic electrodes using a photolitho-etching technique; (c) depositing a hydrogenated amorphous silicon layer in the form of strips over said metallic electrodes; (d) depositing a resist over said amorphous silicon layer; (e) forming a pattern in said resist; (f) placing said substrate with said members disposed on it in an electrolytic solution; (g) optically anodizing said amorphous silicon by: (i) exposing it to radiation while (ii) electrically connecting it to a metallic member disposed in said electrolytic solution; and (h) applying a transparent electrode over said photoanodized layer whereby a transparent electrode covers a plurality of amorphous silicon electrodes separated by insulative oxidized material.

Claim 9

A method for fabricating an image sensor comprising a plurality of sandwich type photoelectric conversion elements juxtaposed to each other on a substrate, said image sensor being prepared by the steps of: (a) forming a plurality of first electrodes on said substrate; (b) forming a hydrogenated amorphous semiconductor layer in the shape of a continuous stripe on said first electrodes as a photoelectric conversion layer; (c) converting selectively a portion of said hydrogenated amorphous semiconductor layer corresponding to each region between adjacent ones of said first electrodes into an insulating semiconductor oxide layer by optical anodization, said insulating semiconductor layer isolating adjacent photoelectric conversion element; and (d) forming a second electrode on said hydrogenated semiconductor layer.

Claim 10

A method for fabricating an image sensor comprising a plurality of sandwich type photoelectric conversion elements juxtaposed to each other on a substrate, said image sensor being prepared by the steps of: (a) forming a plurality of first electrodes on said substrate; (b) forming a hydrogenated amorphous semiconductor layer in the shape of a continuous stripe on said first electrodes as a photoelectric conversion layer; (c) converting selectively a portion of said hydrogenated amorphous semiconductor layer corresponding to each region between adjacent ones of said first electrodes into an insulating semiconductor oxide layer by optical anodization, said insulating semiconductor layer isolating adjacent photoelectric conversion element; and (d) forming a second electrode on said hydrogenated semiconductor layer.