← Back to Patent Explorer
US4527007A Expired / Lapsed US ⏱️ 0.0 years remaining

Process for forming passivation film on photoelectric conversion device and the device produced thereby

Assignee: Fujifilm Business Innovation Corp
•
Filing: 1984-01-25
•
Granted: 1985-07-02
•
Expires: 2004-01-25
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract In a process for producing a photoelectric conversion device having a junction between hydrogenated amorphous silicon and an electrode made of ITO or the like, on the surface of which a passivation film made of silicon oxide is provided, the passivation film being formed by the plasma CVD method in an atmosphere of mixed gas prepared by admixing an excess of oxygen-containing gas, such as nitrous oxide, carbon dioxide, oxygen, or the like, with silane gas. The surface of the photoelectric conversion device is covered with a silicon oxide film formed in accordance with the plasma CVD method at a temperature of less than 300° C. in an atmosphere of mixed gas consisting of silane gas and an excess of oxygen-containing gas.

Inventors

  • 👤 Mario Fuse

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-26 19:52
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/60; H10P14/69; H10P14/692; H10P14/6921; H10P14/69215; H10F; H10F77/00; H10F77/20; H10F77/244; H10F77/247; H10F77/30; H10P14/63; H10P14/6326; H10P14/6328; H10P14/6334; H10P14/6336; H10P14/66; H10P14/668; H10P14/6681; H10P14/6682; Y; Y10; Y10S; Y10S438/00; Y10S438/958

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 95 words
A process for forming a passivation film made of silicon oxide on the surface of a photoelectric conversion device having a layer of hydrogenated amorphous silicon between a transparent upper conductive electrode and a lower electrode on a substrate, and having a junction between said layer of hydrogenated amorphous silicon and said upper transparent conductive electrode, comprising the step of forming said passivation film by the plasma chemical vapor deposition method at a temperature lower than 300° C. in an atmosphere of mixed gas prepared by admixing an excess of oxygen-containing gas with silane gas.
Claim 2
Dependent Claim 95 words
A process for forming a passivation film made of silicon oxide on the surface of a photoelectric conversion device having a layer of hydrogenated amorphous silicon between a transparent upper conductive electrode and a lower electrode on a substrate, and having a junction between said layer of hydrogenated amorphous silicon and said upper transparent conductive electrode, comprising the step of forming said passivation film by the plasma chemical vapor deposition method at a temperature lower than 300° C. in an atmosphere of mixed gas prepared by admixing an excess of oxygen-containing gas with silane gas.
Claim 3
Dependent Claim 29 words
A process for forming a passivation film as claimed in claim 1, wherein said oxygen-containing gas is selected from the group consisting of nitrous oxide, carbon dioxide, and oxygen.
Claim 4
Dependent Claim 30 words
A process for forming a passivation film as claimed in claim 1, wherein said oxygen-containing gas is admixed with said silane gas in a mixing ratio of 20:1 to 80:1.
Claim 5
Dependent Claim 22 words
A process for forming a passivation film as claimed in claim 1, wherein said transparent conductive electrode is made of indium-tin oxide.
Claim 6
Dependent Claim 31 words
A process for forming a passivation film as claimed in claim 1, wherein said mixed gas contains an inert gas such as argon, helium, or the like as a carrier gas.
Claim 7
Dependent Claim 85 words
A photoelectric conversion device having a layer of hydrogenated amorphous silicon between a transparent upper indium-tin oxide electrode and a lower electrode on a substrate, and having a junction between said layer of hydrogenated amorphous silicon and said indium-tin oxide electrode, comprising a silicon oxide film covering the surface of said photoelectric conversion device formed by the plasma chemical vapor deposition method at a temperature lower than 300° C. in an atmosphere of mixed gas consisting of silane gas and an excess of oxygen-containing gas.
Claim 8
Dependent Claim 85 words
A photoelectric conversion device having a layer of hydrogenated amorphous silicon between a transparent upper indium-tin oxide electrode and a lower electrode on a substrate, and having a junction between said layer of hydrogenated amorphous silicon and said indium-tin oxide electrode, comprising a silicon oxide film covering the surface of said photoelectric conversion device formed by the plasma chemical vapor deposition method at a temperature lower than 300° C. in an atmosphere of mixed gas consisting of silane gas and an excess of oxygen-containing gas.

References Cited (Backward Citations)

US3990100A Cited
JPS5643776A Cited
US4410558A Cited
US4379943A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1988-07-01 1988-12-31 1989-07-02 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1992-07-01 1992-12-31 1993-07-02 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1996-07-01 1996-12-31 1997-07-02 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag