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US5080730A Expired / Lapsed US ⏱️ 0.0 years remaining

Implantation profile control with surface sputtering

Assignee: Ibis Technology Corp
•
Filing: 1989-04-24
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Granted: 1992-01-14
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Expires: 2009-04-24
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Abstract

Abstract An ion implantation process for producing a buried insulating layer of silicon dioxide in a silicon substrate which takes advantage of the effects of surface erosion and sputtering inherent to the ion implantation process. The process allows the production of an insulating layer buried within a silicon semiconductor wherein the width of the insulating layer can be contoured by controlling the beam energy during implantation.

Inventors

  • 👤 Andrew B. Wittkower

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 19:29
CPC Classifications
H; H10; H10P; H10P30/00; H10P30/20; H10P30/208; H10P30/209; H10P30/22; Y; Y10; Y10S; Y10S148/00; Y10S148/158

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 77 words
A process for producing a buried insulation forming implant layer disposed within a silicon substrate, comprising the steps of: implanting ions into a silicon substrate, from a source of controllable ion energy; simultaneously eroding a surface layer of said silicon substrate through which said implanting ions pass; and reducing the ion energy in compensation for erosion occurring in said eroding step to reduce the depth of ion penetration with respect to the surface erosion of said substrate.
Claim 2
Dependent Claim 77 words
A process for producing a buried insulation forming implant layer disposed within a silicon substrate, comprising the steps of: implanting ions into a silicon substrate, from a source of controllable ion energy; simultaneously eroding a surface layer of said silicon substrate through which said implanting ions pass; and reducing the ion energy in compensation for erosion occurring in said eroding step to reduce the depth of ion penetration with respect to the surface erosion of said substrate.
Claim 3
Dependent Claim 12 words
The process of claim 1 wherein the silicon is of semiconductor grade.
Claim 4
Dependent Claim 17 words
The process of claim 1 wherein the implant is selected from the group comprising oxygen and nitrogen.
Claim 5
Dependent Claim 23 words
The process of claim 1 further including the step of annealing said substrate to create a continuous insulating layer from the implant layer.
Claim 6
Dependent Claim 77 words
A process for producing a buried insulation forming implant layer disposed with a silicon substrate, comprising the steps of: implanting ions into a silicon substrate from a source of controllable ion energy; simultaneously eroding a surface layer of said silicon substrate through which said implanting ions pass; and increasing the ion energy in compensation for erosion occurring in said eroding step to increase the depth of ion penetration with respect to the surface erosion of said substrate.
Claim 7
Dependent Claim 77 words
A process for producing a buried insulation forming implant layer disposed with a silicon substrate, comprising the steps of: implanting ions into a silicon substrate from a source of controllable ion energy; simultaneously eroding a surface layer of said silicon substrate through which said implanting ions pass; and increasing the ion energy in compensation for erosion occurring in said eroding step to increase the depth of ion penetration with respect to the surface erosion of said substrate.
Claim 8
Dependent Claim 11 words
The process of claim 5 wherein the silicon is semiconductor grade.
Claim 9
Dependent Claim 18 words
The process of claim 5 wherein the implant is selected from the group consisting of oxygen and nitrogen.
Claim 10
Dependent Claim 24 words
The process of claim 5 which further includes the steps of annealing said substrate to create a continuous insulating layer from the implant layer.

References Cited (Backward Citations)

US4033788A Cited
JPS5331971A Cited
JPS5459090A Cited
US4241359A Cited
US4394180A Cited
US4452646A Cited
JPS59208851A Cited
US4704302A Cited
FR2581795A1 Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1995-01-13 1995-07-15 1996-01-14 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1999-01-13 1999-07-15 2000-01-14 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2003-01-13 2003-07-15 2004-01-14 $7700.00 Window Closed / Lapsed

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