Superconductor interconnection apparatus

Claim 2

Electrical interconnection apparatus comprising: a first substrate, a plurality of contact areas consisting of metallic electrically conductive material affixed to said first substrate, and superconducting material deposited on said first substrate for forming a signal transmission path and making electrical contact with said contact areas; a second substrate, a plurality of contact areas consisting of a metallic electrically conductive material affixed to said second substrate, and superconducting material deposited on said second substrate for forming a signal transmission path and making electrical contact with said contact areas on said second substrate; and retaining means for applying mechanical force to said substrates for maintaining said contact areas of said first substrate and said second substrate in electrical contact; said apparatus further comprising spacer means consisting of electrically insulating material disposed between said first and said second substrates and having apertures in said spacer means in registration with said contact areas of said first and said second substrates, and electrically conducting contact devices selectively inserted in certain of said apertures for making electrical contact between contact areas of said first and said second substrates to selectively establish electrical contact between predetermined ones of said contact areas of said first and said second substrates.

Claim 3

Electrical interconnection apparatus comprising: a first substrate, a plurality of contact areas consisting of metallic electrically conductive material affixed to said first substrate, and superconducting material deposited on said first substrate for forming a signal transmission path and making electrical contact with said contact areas; a second substrate, a plurality of contact areas consisting of a metallic electrically conductive material affixed to said second substrate, and superconducting material deposited on said second substrate for forming a signal transmission path and making electrical contact with said contact areas on said second substrate; and retaining means for applying mechanical force to said substrates for maintaining said contact areas of said first substrate and said second substrate in electrical contact; wherein said first and said second substrates are separated by a space, certain of said contact areas of said first substrate are disposed on one surface of said first substrate and certain of said contact areas of said second substrate are disposed on a surface of said second substrate positioned in opposing relationship to said one surface of said first substrate, said apparatus further comprising a circuit chip carrier substrate having first and second surfaces, circuit chip connector means on one of said surfaces of said carrier substrate, metallic electrically conducting contact areas on said first and said second surfaces, and electrical conductor means for interconnecting said circuit chip connector means and said contact areas on said first and second surfaces; said carrier substrate positioned in said space between said opposing surfaces of said first and said second substrates, certain of said contact areas of said carrier substrate positioned substantially in alignment with at least one of said contact areas of each of said first and said second substrates, whereby electrical contact is made between said first and said second substrates and said circuit chip carrier substrate to provide the carrier substrate with access to superconducting transmission paths on said first and said second substrates when said apparatus is submerged in cryogenic fluid.

Claim 4

Electrical interconnection apparatus comprising: a first substrate, a plurality of contact areas consisting of metallic electrically conductive material affixed to said first substrate, and superconducting material deposited on said first substrate for forming a signal transmission path and making electrical contact with said contact areas; a second substrate, a plurality of contact areas consisting of a metallic electrically conductive material affixed to said second substrate, and superconducting material deposited on said second substrate for forming a signal transmission path and making electrical contact with said contact areas on said second substrate; and retaining means for applying mechanical force to said substrates for maintaining said contact areas of said first substrate and said second substrate in electrical contact; wherein said first and said second substrates are separated by a space, certain of said contact areas of said first substrate are disposed on one surface of said first substrate and certain of said contact areas of said second substrate are disposed on a surface of said second substrate positioned in opposing relationship to said one surface of said first substrate, said apparatus further comprising a circuit chip carrier substrate having first and second surfaces, circuit chip connector means on one of said surfaces of said carrier substrate, metallic electrically conducting contact areas on said first and said second surfaces, and electrical conductor means for interconnecting said circuit chip connector means and said contact areas on said first and second surfaces; said carrier substrate positioned in said space between said opposing surfaces of said first and said second substrates, certain of said contact areas of said carrier substrate positioned substantially in alignment with at least one of said contact areas of each of said first and said second substrates, whereby electrical contact is made between said first and said second substrates and said circuit chip carrier substrate to provide the carrier substrate with access to superconducting transmission paths on said first and said second substrates when said apparatus is submerged in cryogenic fluid.

Claim 5

The electrical interconnection apparatus in accordance with claim 2 and further comprising an additional substrate having two surfaces, at least one electrical contact area on each of said two surfaces of said additional substrate, superconducting material deposited on at least one of said surfaces of said additional substrate for forming a signal transmission path connected to certain of said contact areas of said additional substrate and a portion of said carrier substrate being positioned to occupy a first portion of said space between said first and second substrates, and said additional substrate positioned between said first and second substrates to occupy a second portion of said space, and at least one of said certain contact areas of said additional substrate aligned with at least one contact area of said contact areas on said two opposing surfaces of said first and said second substrates, to provide additional signal path access to said carrier chip via one of said first and said second substrates.

Claim 6

The interconnection apparatus in accordance with claim 3 and further comprising electrically insulating spacer means disposed between said carrier substrate and said first and said second substrates and disposed between said additional substrate in said first and said second substrates, said spacer means comprising apertures in registration with contact areas of said first and said second substrates, said carrier substrate and said additional substrate; and electrical contact devices selectively inserted in certain of said apertures to selectively establish electrical contact paths between said carrier substrate and said first and said second substrates and between said additional substrate and said first and said second substrates.

Claim 7

Apparatus for connecting superconducting transmission paths to an integrated circuit chip, comprising: a plurality of interconnection substrates and at least one integrated circuit chip carrier substrate; each of said interconnection substrates comprising metallic contact areas and strips of superconducting material, said strips composed essentially of brittle superconductive material that is superconductive at a temperature of the boiling point of nitrogen, deposited thereon in electrical contact with said contact areas to form signal transmission paths on said interconnection substrates; at least one carrier substrate comprising connection means for connecting to an integrated circuit chip, metallic contact areas, and conductor means for establishing electrical connection between said connection means and said contact areas on said carrier substrate, said carrier substrate and said interconnection substrates positioned adjacent to one another with contact areas on each of said substrates aligned with a contact area of at least one other substrate; and retainer means for applying force to force aligned contact areas in electrical contact; and further comprising spacer means disposed between said substrates to provide separation between said substrates in locations other than said contact areas to allow for the flow of cryogenic fluid between said substrates for the cooling of said superconducting material.

Claim 8

Apparatus for connecting superconducting transmission paths to an integrated circuit chip, comprising: a plurality of interconnection substrates and at least one integrated circuit chip carrier substrate; each of said interconnection substrates comprising metallic contact areas and strips of superconducting material, said strips composed essentially of brittle superconductive material that is superconductive at a temperature of the boiling point of nitrogen, deposited thereon in electrical contact with said contact areas to form signal transmission paths on said interconnection substrates; at least one carrier substrate comprising connection means for connecting to an integrated circuit chip, metallic contact areas, and conductor means for establishing electrical connection between said connection means and said contact areas on said carrier substrate, said carrier substrate and said interconnection substrates positioned adjacent to one another with contact areas on each of said substrates aligned with a contact area of at least one other substrate; and retainer means for applying force to force aligned contact areas in electrical contact; and further comprising spacer means disposed between said substrates to provide separation between said substrates in locations other than said contact areas to allow for the flow of cryogenic fluid between said substrates for the cooling of said superconducting material.

Claim 9

The apparatus in accordance with claim 5 wherein said spacer means disposed between said substrates comprise apertures in registration with said contact areas, and said apparatus further comprising contact devices inserted in certain of said apertures to selectively provide electrical contact between said aligned contact areas.

Claim 10

Apparatus for connecting superconducting transmission paths to an integrated circuit chip, comprising: a plurality of interconnection substrates and at least one integrated circuit chip carrier substrate; each of said interconnection substrates comprising metallic contact areas and strips of superconducting material, said strips composed essentially of brittle superconductive material that is superconductive at a temperature of the boiling point of nitrogen, deposited thereon in electrical contact with said contact areas to form signal transmission paths on said interconnection substrates; at least one carrier substrate comprising connection means for connecting to an integrated circuit chip, metallic contact areas, and conductor means for establishing electrical connection between said connection means and said contact areas on said carrier substrate, said carrier substrate and said interconnection substrates positioned adjacent to one another with contact areas on each of said substrates aligned with a contact area of at least one other substrate; and retainer means for applying force to force aligned contact areas in electrical contact; wherein each of said interconnection substrates comprises two surfaces, said signal transmission paths being deposited on one of said two surfaces and a ground plane consisting of superconducting material deposited on the other of said two surfaces on each of said interconnection substrates to form stripline transmission lines on said interconnecting substrates, and contact areas in electrical contact with said superconducting ground plane.

Claim 11

Apparatus for connecting superconducting transmission paths to an integrated circuit chip, comprising: a plurality of interconnection substrates and at least one integrated circuit chip carrier substrate; each of said interconnection substrates comprising metallic contact areas and strips of superconducting material, said strips composed essentially of brittle superconductive material that is superconductive at a temperature of the boiling point of nitrogen, deposited thereon in electrical contact with said contact areas to form signal transmission paths on said interconnection substrates; at least one carrier substrate comprising connection means for connecting to an integrated circuit chip, metallic contact areas, and conductor means for establishing electrical connection between said connection means and said contact areas on said carrier substrate, said carrier substrate and said interconnection substrates positioned adjacent to one another with contact areas on each of said substrates aligned with a contact area of at least one other substrate; and retainer means for applying force to force aligned contact areas in electrical contact; wherein each of said interconnection substrates comprises two surfaces, said signal transmission paths being deposited on one of said two surfaces and a ground plane consisting of superconducting material deposited on the other of said two surfaces on each of said interconnection substrates to form stripline transmission lines on said interconnecting substrates, and contact areas in electrical contact with said superconducting ground plane.

Claim 12

The apparatus in accordance with claim 7 and further comprising contact devices disposed between said interconnection substrates for electrically interconnecting contact areas of said first and said second interconnection substrates connected to said superconducting ground planes.

Claim 13

The apparatus in accordance with claim 8, further comprising: spacer means disposed between said substrates to provide separation between said substrates in locations other than said contact areas to allow for the flow of cryogenic fluid between said substrates for the cooling of said superconducting material; wherein said substrates, said spacer means and said contact devices are removable from said retainer means to allow for replacement of substrates and rearrangement of interconnections.

Claim 14

Apparatus for connecting superconducting transmission paths to an integrated circuit chip, comprising: a plurality of interconnection substrates and at least one integrated circuit chip carrier substrate; each of said interconnection substrates comprising metallic contact areas and strips of superconducting material, said strips composed essentially of brittle superconductive material that is superconductive at a temperature of the boiling point of nitrogen, deposited thereon in electrical contact with said contact areas to form signal transmission paths on said interconnection substrates; at least one carrier substrate comprising connection means for connecting to an integrated circuit chip, metallic contact areas, and conductor means for establishing electrical connection between said connection means and said contact areas on said carrier substrate, said carrier substrate and said interconnection substrates positioned adjacent to one another with contact areas on each of said substrates aligned with a contact area of at least one other substrate; and retainer means for applying force to force aligned contact areas in electrical contact; wherein each of the interconnection substrates is provided with an aperture in registration with a corresponding aperture in the other interconnection substrate; said carrier substrate is disposed between said interconnection substrates and said connection means of said carrier substrate is positioned in alignment with said aperture in said interconnection substrates and edges of said carrier substrate are overlapping with edges of said apertures in said interconnection substrates; and said carrier substrate and said interconnection substrates each comprise contact areas on said overlapping edges for establishing electrical contact between said carrier substrate and both of said interconnection substrates.

Claim 15

Apparatus for connecting superconducting transmission paths to an integrated circuit chip, comprising: a plurality of interconnection substrates and at least one integrated circuit chip carrier substrate; each of said interconnection substrates comprising metallic contact areas and strips of superconducting material, said strips composed essentially of brittle superconductive material that is superconductive at a temperature of the boiling point of nitrogen, deposited thereon in electrical contact with said contact areas to form signal transmission paths on said interconnection substrates; at least one carrier substrate comprising connection means for connecting to an integrated circuit chip, metallic contact areas, and conductor means for establishing electrical connection between said connection means and said contact areas on said carrier substrate, said carrier substrate and said interconnection substrates positioned adjacent to one another with contact areas on each of said substrates aligned with a contact area of at least one other substrate; and retainer means for applying force to force aligned contact areas in electrical contact; wherein each of the interconnection substrates is provided with an aperture in registration with a corresponding aperture in the other interconnection substrate; said carrier substrate is disposed between said interconnection substrates and said connection means of said carrier substrate is positioned in alignment with said aperture in said interconnection substrates and edges of said carrier substrate are overlapping with edges of said apertures in said interconnection substrates; and said carrier substrate and said interconnection substrates each comprise contact areas on said overlapping edges for establishing electrical contact between said carrier substrate and both of said interconnection substrates.

Claim 16

The apparatus in connection with claim 10 wherein an electro-optical circuit device is positioned on said integrated circuit carrier substrate in alignment with said apertures in said interconnection substrates and an optical signal transmission device is positioned in alignment with said apertures in said interconnection substrates for optical communication with said electro-optical circuit device.

Claim 17

Apparatus for interconnecting superconducting transmission paths to integrated circuit chips comprising: a plurality of interconnection substrates and at least one integrated circuit carrier substrate of predetermined external dimension; each of said interconnection substrates comprising an aperture and said integrated circuit carrier substrate positioned between two of said interconnection substrates, and having surfaces overlapping surfaces of said interconnection substrates; an integrated circuit chip positioned on said integrated circuit chip carrier substrate in alignment with said apertures in said two interconnection substrates; metallic contact areas on said interconnection substrates and superconducting signal paths on said interconnecting substrates in electrical contact with said contact areas; contact areas on said carrier substrate in electrical contact with said integrated circuit chip, certain of said contact areas of said interconnecting substrates and said carrier substrate located on said overlapping surfaces; an additional substrate having an aperture larger than said aperture of said two interconnection substrates and larger than the outside dimension of said integrated circuit carrier substrate, and disposed between said two interconnection carriers; said additional substrate having two surfaces and contact areas on both of said surfaces in alignment with contact areas on said two interconnection substrates; spacer means disposed between said carrier substrate and said two interconnection substrates and disposed between said additional substrate and said two interconnection substrates, said spacer means comprising apertures in registration with contact areas on said carrier substrate aligned with contact areas on said two interconnection substrates and apertures in registration with contact areas on said additional substrate in alignment with contact areas on said two interconnection substrates, said spacer means providing space between substrates to allow for the flow of cryogenic fluid for the cooling of superconducting materials; contact devices selectively inserted in said apertures of said spacer means to provide electrical connecting paths between aligned contact areas on adjacent surfaces; and retainer means to retain said substrates and said spacer means in alignment and to apply force to said substrates to maintain physical contact between said contact areas and said contact devices.

Claim 18

Apparatus for interconnecting superconducting transmission paths to integrated circuit chips comprising: a plurality of interconnection substrates and at least one integrated circuit carrier substrate of predetermined external dimension; each of said interconnection substrates comprising an aperture and said integrated circuit carrier substrate positioned between two of said interconnection substrates, and having surfaces overlapping surfaces of said interconnection substrates; an integrated circuit chip positioned on said integrated circuit chip carrier substrate in alignment with said apertures in said two interconnection substrates; metallic contact areas on said interconnection substrates and superconducting signal paths on said interconnecting substrates in electrical contact with said contact areas; contact areas on said carrier substrate in electrical contact with said integrated circuit chip, certain of said contact areas of said interconnecting substrates and said carrier substrate located on said overlapping surfaces; an additional substrate having an aperture larger than said aperture of said two interconnection substrates and larger than the outside dimension of said integrated circuit carrier substrate, and disposed between said two interconnection carriers; said additional substrate having two surfaces and contact areas on both of said surfaces in alignment with contact areas on said two interconnection substrates; spacer means disposed between said carrier substrate and said two interconnection substrates and disposed between said additional substrate and said two interconnection substrates, said spacer means comprising apertures in registration with contact areas on said carrier substrate aligned with contact areas on said two interconnection substrates and apertures in registration with contact areas on said additional substrate in alignment with contact areas on said two interconnection substrates, said spacer means providing space between substrates to allow for the flow of cryogenic fluid for the cooling of superconducting materials; contact devices selectively inserted in said apertures of said spacer means to provide electrical connecting paths between aligned contact areas on adjacent surfaces; and retainer means to retain said substrates and said spacer means in alignment and to apply force to said substrates to maintain physical contact between said contact areas and said contact devices.

Claim 19

The apparatus in accordance with claim 12, wherein said contact devices comprise indium.

Claim 20

Electrical interconnection apparatus comprising: a first substrate, a plurality of contact areas consisting of metallic electrically conductive material affixed to said first substrate, and superconducting material composed essentially of brittle superconductive material deposited on said first substrate for forming a signal transmission path and making electrical contact with said contact areas; a second substrate, a plurality of contact areas consisting of a metallic electrically conductive material affixed to said second substrate, and superconducting material composed essentially of brittle superconductive material deposited on said second substrate for forming a signal transmission path and making electrical contact with said contact areas on said second substrate; electrically conducting bearing means for separating said first and second substrates at ones of said contact areas of said first and second substrates; and retaining means for applying mechanical force to said substrates for maintaining said contact areas of said first substrate and said second substrate in electrical contact through said bearing means.

Claim 21

Electrical interconnection apparatus comprising: a first substrate, a plurality of contact areas consisting of metallic electrically conductive material affixed to said first substrate, and superconducting material composed essentially of brittle superconductive material deposited on said first substrate for forming a signal transmission path and making electrical contact with said contact areas; a second substrate, a plurality of contact areas consisting of a metallic electrically conductive material affixed to said second substrate, and superconducting material composed essentially of brittle superconductive material deposited on said second substrate for forming a signal transmission path and making electrical contact with said contact areas on said second substrate; electrically conducting bearing means for separating said first and second substrates at ones of said contact areas of said first and second substrates; and retaining means for applying mechanical force to said substrates for maintaining said contact areas of said first substrate and said second substrate in electrical contact through said bearing means.

Claim 22

Apparatus for connecting superconducting transmission paths to an integrated circuit chip, comprising: a plurality of interconnection substrates and at least one integrated circuit chip carrier substrate; each of said interconnection substrates comprising metallic contact areas and strips of superconducting material, said strips composed essentially of brittle superconductive material, deposited thereon in electrical contact with said contact areas to form signal transmission paths on said interconnection substrates; at least one carrier substrate comprising connection means for connecting to an integrated circuit chip, metallic contact areas, and conductor means for establishing electrical connection between said connection means and said contact areas on said carrier substrate, said carrier substrate and said interconnection substrates positioned adjacent to one another with contact areas on each of said substrates aligned with a contact area of at least one other substrate; and electrically conducting bearing means for separating ones of said substrates at ones of said metallic contact areas; and retainer means for applying force to force aligned contact areas into electrical contact through said bearing means.

Claim 23

Apparatus for connecting superconducting transmission paths to an integrated circuit chip, comprising: a plurality of interconnection substrates and at least one integrated circuit chip carrier substrate; each of said interconnection substrates comprising metallic contact areas and strips of superconducting material, said strips composed essentially of brittle superconductive material, deposited thereon in electrical contact with said contact areas to form signal transmission paths on said interconnection substrates; at least one carrier substrate comprising connection means for connecting to an integrated circuit chip, metallic contact areas, and conductor means for establishing electrical connection between said connection means and said contact areas on said carrier substrate, said carrier substrate and said interconnection substrates positioned adjacent to one another with contact areas on each of said substrates aligned with a contact area of at least one other substrate; and electrically conducting bearing means for separating ones of said substrates at ones of said metallic contact areas; and retainer means for applying force to force aligned contact areas into electrical contact through said bearing means.

Claim 24

The apparatus in accordance with claim 15 wherein at least two of the interconnection substrates are each provided with an aperture in registration with a corresponding aperture in another of said at least two interconnection substrates; said carrier substrate is disposed between said interconnection substrates and said connection means of said carrier substrate is positioned in alignment with said aperture in said interconnection substrates and edges of said carrier substrate are overlapping with edges of said apertures in said interconnection substrates; and said carrier substrate and said interconnection substrates each comprise contact areas on said overlapping edges for establishing electrical contact between said carrier substrate and both of said interconnection substrates.

Claim 25

Apparatus for connecting a superconducting signal transmission path to an integrated circuit chip, comprising: an interconnection substrate, a plurality of contact areas consisting of metallic electrically conductive materials affixed to said interconnection substrate, and superconducting material composed essentially of brittle superconductive material deposited on said interconnection substrate for forming a signal transmission path and making an electrical contact with said contact areas; a circuit chip carrier substrate, circuit chip connector means on said carrier substrate for connecting to a circuit chip metallic electrically conducting contact areas on said carrier substrate and electrical conductor means for interconnecting said connector means and said contact areas on said carrier substrate; electrically conducting bearing means for separating ones of said substrates at ones of said metallic contact areas; retaining means for applying force to force aligned contact areas into electrical contact through said bearing means.

Claim 26

Apparatus for connecting a superconducting signal transmission path to an integrated circuit chip, comprising: an interconnection substrate, a plurality of contact areas consisting of metallic electrically conductive materials affixed to said interconnection substrate, and superconducting material composed essentially of brittle superconductive material deposited on said interconnection substrate for forming a signal transmission path and making an electrical contact with said contact areas; a circuit chip carrier substrate, circuit chip connector means on said carrier substrate for connecting to a circuit chip metallic electrically conducting contact areas on said carrier substrate and electrical conductor means for interconnecting said connector means and said contact areas on said carrier substrate; electrically conducting bearing means for separating ones of said substrates at ones of said metallic contact areas; retaining means for applying force to force aligned contact areas into electrical contact through said bearing means.

Claim 27

Apparatus for interconnecting superconducting transmission paths to integrated circuit chips comprising: a plurality of interconnection substrates and at least one integrated circuit carrier substrate of predetermined external dimension; each of said interconnection substrates comprising an aperture and said integrated circuit carrier substrate positioned between two of said interconnection substrates, and having surfaces overlapping surfaces of said interconnection substrates; an integrated circuit chip positioned on said integrated circuit chip carrier substrate in alignment with said apertures in said two interconnection substrates; metallic contact areas on said interconnection substrates and superconducting signal paths composed essentially of brittle superconductive material on said interconnecting substrates in electrical contact with said contact areas; contact areas on said carrier substrate in electrical contact with said integrated circuit chip, certain of said contact areas of said interconnecting substrates and said carrier substrate located on said overlapping surfaces; spacer means disposed between said carrier substrate and said two interconnection substrates, said spacer means comprising apertures in registration with contact areas on said carrier substrate aligned with contact areas on said two interconnection substrates, said spacer means providing space between substrates to allow for the flow of cryogenic fluid for the cooling of superconducting materials; contact devices selectively inserted in said apertures of said spacer means to provide electrical connecting paths between aligned contact areas on adjacent surfaces; and retainer means to retain said substrates and said spacer means in alignment and to apply force to said substrates to maintain physical contact between said contact areas and said contact devices.

Claim 28

Apparatus for interconnecting superconducting transmission paths to integrated circuit chips comprising: a plurality of interconnection substrates and at least one integrated circuit carrier substrate of predetermined external dimension; each of said interconnection substrates comprising an aperture and said integrated circuit carrier substrate positioned between two of said interconnection substrates, and having surfaces overlapping surfaces of said interconnection substrates; an integrated circuit chip positioned on said integrated circuit chip carrier substrate in alignment with said apertures in said two interconnection substrates; metallic contact areas on said interconnection substrates and superconducting signal paths composed essentially of brittle superconductive material on said interconnecting substrates in electrical contact with said contact areas; contact areas on said carrier substrate in electrical contact with said integrated circuit chip, certain of said contact areas of said interconnecting substrates and said carrier substrate located on said overlapping surfaces; spacer means disposed between said carrier substrate and said two interconnection substrates, said spacer means comprising apertures in registration with contact areas on said carrier substrate aligned with contact areas on said two interconnection substrates, said spacer means providing space between substrates to allow for the flow of cryogenic fluid for the cooling of superconducting materials; contact devices selectively inserted in said apertures of said spacer means to provide electrical connecting paths between aligned contact areas on adjacent surfaces; and retainer means to retain said substrates and said spacer means in alignment and to apply force to said substrates to maintain physical contact between said contact areas and said contact devices.