US4891686A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor packaging with ground plane conductor arrangement
Assignee: Directed Energy Inc
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Filing: 1988-04-08
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Granted: 1990-01-02
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Expires: 2008-04-08
Abstract
Abstract Packaging techniques are described which provide electrical, thermal, and mechanical advantages. A low-profile semiconductor package is described in which the leads are flat and are present in the same plane. The leads are arranged and positioned in order to eliminate inductance. A semiconductor die is secured to a ceramic substrate, and a plurality of bond wires are secured between the pads on the die and the leads of the package.
Inventors
- 👤 George J. Krausse, III
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 16:28
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/20; H10W40/00; H10W40/60; H10W40/611; H10W42/00; H10W42/60; H10W70/00; H10W70/40; H10W70/481; H10W70/60; H10W70/62; H10W70/65; H10W70/658; H10W90/00; H10W90/701; H10W40/20; H10W40/231; H10W40/235; H10W44/226; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/50; H10W72/531; H10W72/533; H10W72/534; H10W72/541; H10W72/5449; H10W72/547; H10W72/5475; H10W72/90; H10W72/951; H10W72/952
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
138 words
A high power MOSFET semiconductor package comprising: (a) a ceramic substrate having a planar upper surface and opposite side edges; (b) a MOSFET semiconductor die secured to said upper surface of said ceramic substrate; said die including gate, source and drain areas and having connection pads on said gate, source and drain areas; (c) a gate signal carrying conductor electrically connected to said connection pad on said gate area; (d) a drain signal carrying conductor electrically connected to said connection pad on said drain area; (e) ground plane conductors disposed one each side, and separated from, and parallel to each of said signal carrying conductors; wherein each said ground plane conductor is electrically connected to said connection pad on said source area; wherein said ground plane conductors are disposed in the same plane as said signal carrying conductors.
Claim 2
Dependent Claim
138 words
A high power MOSFET semiconductor package comprising: (a) a ceramic substrate having a planar upper surface and opposite side edges; (b) a MOSFET semiconductor die secured to said upper surface of said ceramic substrate; said die including gate, source and drain areas and having connection pads on said gate, source and drain areas; (c) a gate signal carrying conductor electrically connected to said connection pad on said gate area; (d) a drain signal carrying conductor electrically connected to said connection pad on said drain area; (e) ground plane conductors disposed one each side, and separated from, and parallel to each of said signal carrying conductors; wherein each said ground plane conductor is electrically connected to said connection pad on said source area; wherein said ground plane conductors are disposed in the same plane as said signal carrying conductors.
Claim 3
Dependent Claim
15 words
A semiconductor package in accordance with claim 1, wherein said ceramic substrate comprises beryllium oxide.
Claim 4
Dependent Claim
43 words
A semiconductor package in accordance with claim 1, wherein there are two of said ground plane conductors which project from one side edge of said substrate and another two of said ground plane conductors project from the opposite side edge of said substrate.
Claim 5
Dependent Claim
17 words
A semiconductor package in accordance with claim 1, wherein each said conductor includes a stress relief bend.
Claim 6
Dependent Claim
14 words
A semiconductor package in accordance with claim 1, wherein each said conductor is copper.
Claim 7
Dependent Claim
23 words
A semiconductor package in accordance with claim 1, wherein each said ground plane conductor includes a metalization pad disposed on said ceramic substrate.
Claim 8
Dependent Claim
88 words
A semiconductor package in accordance with claim 6, wherein said gate signal carrying conductor and said drain signal carrying conductor project outwardly from opposite side edges of said substrate; wherein there are four said ground plane conductors; wherein two of said ground plane conductors are disposed on opposite sides of and spaced from said gate signal carrying conductor an equal distance, and wherein the other two of said ground plane conductors are disposed on opposite sides of and spaced from said drain signal carrying conductor an equal distance.
Claim 9
Dependent Claim
108 words
A semiconductor package in accordance with claim 1, wherein said gate signal carrying conductor and said drain signal carrying conductor comprise planar conductive strips; wherein said gate signal carrying conductor and said drain signal carrying conductor project outwardly from opposite side edges of said substrate in the same plane; wherein there are four said ground plane conductors; wherein two of said ground plane conductors are disposed on opposite sides of and spaced from said gate signal carrying conductor an equal distance, and wherein the other two of said ground plane conductors are disposed on opposite sides of and spaced from said drain signal carrying conductor an equal distance.
Claim 10
Dependent Claim
15 words
A semiconductor package in accordance with claim 8, wherein each of said conductors is copper.
Claim 11
Dependent Claim
24 words
A semiconductor package in accordance with claim 1, wherein said ground plane conductors are terminated on a single connection pad on said source area.
Claim 12
Dependent Claim
121 words
A semiconductor package in accordance with claim 6, further comprising first, second, third and fourth sets of multiple bond wires each having first and second ends; wherein said first ends of said first and second sets of bond wires are connected, respectively, to said ground plane conductor metalization pads which are adjacent to said gate signal carrying conductor; wherein said first ends of said third and fourth sets of bond wires are connected, respectively, to said ground plane conductor metalization pads which are adjacent to said drain signal carrying conductor; and wherein said second ends of said first, second, third and fourth sets of bond wires converge toward each other and are connected to said connection pad on said source area.
Claim 13
Dependent Claim
16 words
A semiconductor package in accordance with claim 1, wherein all said conductors are non-ferrous, non-magnetic materials.
Claim 14
Dependent Claim
72 words
A circuitry package comprising: (a) a power MOSFET semiconductor package in accordance with claim 1; (b) a printed circuit board; (c) a heat sink; wherein said semiconductor package is positioned on said heat sink in a manner such that said ceramic substrate is in thermal contact with said heat sink; wherein said conductors are operably connected to said printed circuit board; and wherein said semiconductor package is secured to said heat sink.
Claim 15
Dependent Claim
103 words
A circuitry package in accordance with claim 13, wherein each said ground plane conductor includes a metalization pad disposed on said ceramic substrate; and said gate signal carrying conductor and said drain signal carrying conductor project outwardly from opposite side edges of said substrate; wherein there are four said ground plane conductors; wherein two of said ground plane conductors are disposed on opposite sides of and spaced from said gate signal carrying conductor an equal distance, and wherein the other two of said ground plane conductors are disposed on opposite sides of and spaced from said drain signal carrying conductor an equal distance.
Claim 16
Dependent Claim
45 words
A circuitry package in accordance with claim 14, wherein all said conductors are non-ferrous, non-magnetic materials; wherein each said conductor includes a stress relief bend; and wherein said ceramic substrate includes a bottom surface which is polished to facilitate thermal contact with said heat sink.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-01-01 | 1993-07-03 | 1994-01-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-01-01 | 1997-07-03 | 1998-01-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-01-01 | 2001-07-03 | 2002-01-02 | $7700.00 | Window Closed / Lapsed |