Patent US5053280A successfully refreshed from Google Patents.
US5053280A
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Adhesive composition for printed wiring boards with acrylonitrile-butadiene rubber having carboxyl groups and 20 ppm or less metal ionic impurities; an alkyl phenol resin; an epoxy resin; palladium catalyst, and coupling agent
Assignee: Resonac Corp
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Filing: 1989-09-18
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Granted: 1991-10-01
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Expires: 2009-09-18
Abstract
Abstract An adhesive composition for producing printed wiring boards comprising (A) acrylonitrile-butadiene rubber having carboxyl groups in the molecule and containing 20 ppm or less of metal ionic impurities, (B) an alkyl phenol resin, (C) an epoxy resin, (D) a catalyst for electroless plating, and (E) a coupling agent having an ethylene or vinyl group, is useful in a so-called additive process.
Inventors
- 👤 Shin Takanezawa
- 👤 Yorio Iwasaki
- 👤 Hiroshi Takaahashi
- 👤 Toshiro Okamura
- 👤 Saburo Amano
- 👤 Hiroyoshi Yokoyama
- 👤 Noriyoshi Fukuoka
- 👤 Tatsuya Amano
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 16:02
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; C; C09; C09J; C09J113/00; C09J163/00; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1605; C23C18/18; C23C18/20; C23C18/2006; C23C18/2046; C23C18/2053; C23C18/206; C23C18/2066; C23C18/22; C23C18/24; C23C18/28; C23C18/30; C23C18/31; C23C18/38; C08; C08L; C08L2666/00; C08L2666/02; C08L2666/14; H05K3/38; H05K3/386; H05K3/387; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/31504; Y10T428/31511
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
83 words
An adhesive composition for printed wiring boards wherein necessary circuit patterns are formed by electroless plating comprising effective adhesive amounts of (A) acrylonitrile-butadiene rubber having carboxyl groups in the molecule and containing 20 ppm or less of metal ionic impurities, based on weight, (B) an alkyl phenol resin, (C) an epoxy resin, (D) a catalyst for electroless plating selected from metallic palladium or a salt thereof, or a mixture thereof, and (E) a coupling agent having an ethylene group or a vinyl group.
Claim 2
Dependent Claim
83 words
An adhesive composition for printed wiring boards wherein necessary circuit patterns are formed by electroless plating comprising effective adhesive amounts of (A) acrylonitrile-butadiene rubber having carboxyl groups in the molecule and containing 20 ppm or less of metal ionic impurities, based on weight, (B) an alkyl phenol resin, (C) an epoxy resin, (D) a catalyst for electroless plating selected from metallic palladium or a salt thereof, or a mixture thereof, and (E) a coupling agent having an ethylene group or a vinyl group.
Claim 3
Dependent Claim
78 words
An adhesive composition according to claim 1, wherein the component (A) is contained in an amount of 30 to 70% by weight, the component (B) is contained in an amount of 10 to 40% by weight, the component (C) is contained in an amount of 5 to 50% by weight, the component (D) is contained in an amount of 1 to 10% by weight, and the weight ratio of (D)/(E) is in the range of 10/0.05 to 10/5.
Claim 4
Dependent Claim
20 words
An adhesive composition according to claim 1, wherein the component (E) is diisostearoyl ethylene titanate or bis(dioctyl pyrophosphate) ethylene titanate.
Claim 5
Dependent Claim
119 words
A printed wiring board produced by forming an adhesive layer on an insulating substrate containing a catalyst for electroless plating with an adhesive composition comprising effective adhesive amounts of (A) acrylonitrile-butadiene rubber having carboxyl groups in the molecule and containing 20 ppm or less of metal ionic impurities, based on weight, (B) an alkyl phenol resin, (C) an epoxy resin, (D) a catalyst for electroless plating selected from metallic palladium or a salt thereof, or a mixture thereof, and (E) a coupling agent having an ethylene group or a vinyl group, masking portions other than the circuit portions with a resist, chemically roughening non-masked portions, and conducting electroless plating; said printed circuit board exhibiting excellent resistance to electrolytic corrosion.
Claim 6
Dependent Claim
119 words
A printed wiring board produced by forming an adhesive layer on an insulating substrate containing a catalyst for electroless plating with an adhesive composition comprising effective adhesive amounts of (A) acrylonitrile-butadiene rubber having carboxyl groups in the molecule and containing 20 ppm or less of metal ionic impurities, based on weight, (B) an alkyl phenol resin, (C) an epoxy resin, (D) a catalyst for electroless plating selected from metallic palladium or a salt thereof, or a mixture thereof, and (E) a coupling agent having an ethylene group or a vinyl group, masking portions other than the circuit portions with a resist, chemically roughening non-masked portions, and conducting electroless plating; said printed circuit board exhibiting excellent resistance to electrolytic corrosion.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-09-30 | 1995-04-01 | 1995-10-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-09-30 | 1999-04-01 | 1999-10-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-09-30 | 2003-04-01 | 2003-10-01 | $7700.00 | Window Closed / Lapsed |