Patent US5047394A successfully refreshed from Google Patents.
US5047394A
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US
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Sputtering method
Assignee: University of Houston System
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Filing: 1989-09-12
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Granted: 1991-09-10
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Expires: 2009-09-12
Abstract
Abstract Combination of a flattened cathode in a cylindrical magnetron sputtering system and positioning of a substrate relatively close to the flattened cathode allows deposition of a uniform film having good composition. The system and method of the present invention is especially suitable for depositing films using YBCO and BCSCO targets.
Inventors
- 👤 John C. Wolfe
- 👤 Yat-lung R. Chau
- 👤 Wong-sik S. Ho
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 12:27
CPC Classifications
C; C23; C23C; C23C14/00; C23C14/22; C23C14/34; C23C14/3407; C23C14/3414; H; H01; H01J; H01J37/00; H01J37/32; H01J37/34; H01J37/3402; H01J37/3405; H10; H10N; H10N60/00; H10N60/01; H10N60/0268; H10N60/0296; H10N60/0408; Y; Y10; Y10S; Y10S505/00; Y10S505/725; Y10S505/73; Y10S505/731; Y10S505/80; Y10S505/815; Y10S505/816
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
123 words
A method of depositing a compound film on a flat substrate, said flat substrate having a face, said method comprising the steps of: providing a cylindrical magnetron sputtering system having a flattened cathode with a flattened target mounted on at least one surface thereof, said flattened target also having a surface; positioning said face of said substrate parallel to and in the immediate vicinity of said surface of said flattened target; applying a magnetic field parallel to said surface of said flattened target; and causing uniform erosion of said target by sputtering thereof; wherein said step of causing uniform sputtering erosion of said target material comprises the steps of employing high temperature superconductor target material and operating the sputtering system at high pressure.
Claim 2
Independent Claim
123 words
A method of depositing a compound film on a flat substrate, said flat substrate having a face, said method comprising the steps of: providing a cylindrical magnetron sputtering system having a flattened cathode with a flattened target mounted on at least one surface thereof, said flattened target also having a surface; positioning said face of said substrate parallel to and in the immediate vicinity of said surface of said flattened target; applying a magnetic field parallel to said surface of said flattened target; and causing uniform erosion of said target by sputtering thereof; wherein said step of causing uniform sputtering erosion of said target material comprises the steps of employing high temperature superconductor target material and operating the sputtering system at high pressure.
References Cited (Backward Citations)
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JPS537585A
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US4126530A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-09-09 | 1995-03-11 | 1995-09-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-09-09 | 1999-03-11 | 1999-09-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-09-09 | 2003-03-11 | 2003-09-10 | $7700.00 | Window Closed / Lapsed |