Abstract A method and structure are provided for aligning SMDs to a substrate. The body of an SMD and that portion of a substrate encircled by the electrical interconnect pads each have a mating physical structure such that the SMD may be quickly placed in the general vicinity of its proper location and the mating physical features cause a precise alignment. In one embodiment, the physical features are nonsymmetrical, thereby preventing accidental placement of the SMD in an undesired rotation. In another embodiment, the physical features vary among device types, thereby ensuring that an improper device is not placed in a particular location on the substrate. In another embodiment, a component carrier is provided which includes depressions for the placement of the SMDs. A vacuum is applied to the carrier which holds each of the SMDs in place. The carrier is then placed in a desired physical relationship with the substrate such that each of the devices held in the carrier is properly aligned with the substrate. In another embodiment, a standard substrate is used without the requirement of physical mating features. Those physical mating features are provided by the use of a grid structure which is placed with proper registration on the substrate such that the physical pattern of the grid ensures proper placement of components with respect to the pads on the substrate.
A structure for mounting devices on a substrate comprising: a grid structure for aligning electrical leads of electronic components to be mounted on a printed circuit board with connection pads carried by the board; the gird structure having a plurality of locations each adapted to receive an electronic component; a registration feature at each said location, each registration feature shaped complemental to a registration feature on a component which is to be received at that location; a plurality of openings through the grid structure, the openings positioned such that electrical leads of components positioned at said locations extend through the openings; and means for aligning the grid structure with the printed circuit board such that electrical leads of components positioned at said locations are in alignment with the connection pads on the printed circuit board.
Claim 2
Dependent Claim
135 words
A structure for mounting devices on a substrate comprising: a grid structure for aligning electrical leads of electronic components to be mounted on a printed circuit board with connection pads carried by the board; the gird structure having a plurality of locations each adapted to receive an electronic component; a registration feature at each said location, each registration feature shaped complemental to a registration feature on a component which is to be received at that location; a plurality of openings through the grid structure, the openings positioned such that electrical leads of components positioned at said locations extend through the openings; and means for aligning the grid structure with the printed circuit board such that electrical leads of components positioned at said locations are in alignment with the connection pads on the printed circuit board.
Claim 3
Dependent Claim
19 words
A structure as in claim 1 wherein the registration features are selected from the group comprising depressions and protrusions.
Claim 4
Dependent Claim
36 words
A structure as in claim 1 wherein at least one registration feature is nonsymmetrical, thereby insuring a desired orientation of the component which is to be received at that location with respect to the circuit board.
Claim 5
Dependent Claim
16 words
A structure as in claim 1 wherein the grid structure comprises a plurality of break-away portions.
Claim 6
Dependent Claim
35 words
A structure as in claim 1 wherein the means for aligning the structure with the circuit board comprises a plurality of pins carried by the structure for reception into mating receptacles in the circuit board.