US3695502A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Bonding tool
Assignee: Individual
•
Filing: 1970-09-14
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Granted: 1972-10-03
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Expires: 1990-09-14
Abstract
Abstract A microcircuit wafer or die bonding tool for use in microcircuit bonding apparatus to transport, locate and orient a microcircuit wafer. A working surface within the tip of the tool is characterized by a plurality of inclined facets adapted to engage parametrical edges of an upper surface of the wafer and undercut to provide both positive control of and minimum contact pressure upon the surfaces of the wafer during bonding of the wafer to a substrate.
Inventors
- 👤 Floyd E Gaiser
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 15:19
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0446; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49133
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
147 words
A bonding tool for positioning and orienting a solid state wafer device of the type having substantially flat upper and lower surface and a plurality of individual vertical sides at the parametrical edges, said tool comprising, an upper body portion adapted to connect to a holder; a lower end portion terminating in a tip; a cavernous recess in said tip having a plurality of exposed inwardly converging surfaces adapted to engage corresponding parametrical edges of the upper surface of said wafer device, bore formed in said lower end portion communicating with said recess and adapted to apply a partial vacuum thereto, a ledge formed in each of said surfaces contiguously arranged with respect to the ledges in adjacent surfaces to provide a parametrical ledge, and corner reliefs between adjacent converging surfaces for proper operation of said partial vacuum and accommodation of the corners of said wafer device.
Claim 2
Dependent Claim
147 words
A bonding tool for positioning and orienting a solid state wafer device of the type having substantially flat upper and lower surface and a plurality of individual vertical sides at the parametrical edges, said tool comprising, an upper body portion adapted to connect to a holder; a lower end portion terminating in a tip; a cavernous recess in said tip having a plurality of exposed inwardly converging surfaces adapted to engage corresponding parametrical edges of the upper surface of said wafer device, bore formed in said lower end portion communicating with said recess and adapted to apply a partial vacuum thereto, a ledge formed in each of said surfaces contiguously arranged with respect to the ledges in adjacent surfaces to provide a parametrical ledge, and corner reliefs between adjacent converging surfaces for proper operation of said partial vacuum and accommodation of the corners of said wafer device.
Claim 3
Dependent Claim
26 words
A bonding tool according to claim 1 wherein said tip is formed with a substantially coplanar end face and said parametrical ledge is substantially parallel thereto.
Claim 4
Dependent Claim
40 words
A bonding tool according to claim 1 wherein said parametrical ledge is a substantially closed continuous ledge affording a through opening incapable of permitting passage therethrough of the waver device, said ledge having external dimensions sufficient to accommodate said device.
Claim 5
Dependent Claim
48 words
A bonding tool according to claim 3 wherein said parametrical ledge is sufficiently narrow as compared to the external dimensions and the size of said wafer device to contact said device along a minimal area of one of its surfaces while preventing its passage through said through opening.
Claim 6
Dependent Claim
27 words
A bonding tool according to claim 4 wherein said corner reliefs are sufficiently deep to accommodate sharp corners of a wafer device when contacting said parametrical ledge.
Claim 7
Dependent Claim
46 words
A bonding tool according to claim 5 wherein said converging surfaces form a pyramidal recess converging from an end face on said tip and said parametrical ledge effectively interrupts said pyramidal configuration for retaining said wafer device but only along the edges of a surface thereof.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-10-03 | 1976-04-03 | 1976-10-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-10-03 | 1980-04-03 | 1980-10-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-10-03 | 1984-04-03 | 1984-10-03 | $7700.00 | Window Closed / Lapsed |