US5031029A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Copper device and use thereof with semiconductor devices
Assignee: International Business Machines Corp
•
Filing: 1990-04-04
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Granted: 1991-07-09
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Expires: 2010-04-04
Abstract
Abstract A device that contains a copper substrate; a rigidizing layer and/or a metal layer, and a non-graphitic hard carbon layer deposited on the rigidizing layer; and use as a heat sink or piston for electronic components.
Inventors
- 👤 John Acocella
- 👤 Nanik Bakhru
- 👤 Alfred Grill
- 👤 Egidio Marotta
- 👤 Bernard S. Meyerson
- 👤 Vishnubhai V. Patel
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 07:49
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/255; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/851; H10W72/874; H10W72/877; Y; Y10; Y10S; Y10S165/00; Y10S165/905
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
56 words
A device which comprises a copper substrate; a rigidizing layer about 2 to about 10 microns thick adhered to said copper substrate; and a non-graphitic hard carbon layer deposited on said rigidizing layer having a thickness of about 0.2 to about 5 microns wherein said non-graphitic hard carbon layer is electrically insulating and is thermally noninsulating.
Claim 2
Independent Claim
56 words
A device which comprises a copper substrate; a rigidizing layer about 2 to about 10 microns thick adhered to said copper substrate; and a non-graphitic hard carbon layer deposited on said rigidizing layer having a thickness of about 0.2 to about 5 microns wherein said non-graphitic hard carbon layer is electrically insulating and is thermally noninsulating.
Claim 3
Dependent Claim
26 words
The device of claim 1 wherein said rigidizing layer is selected from the group of silicon, titanium nitride, tungsten, tungsten carbide, aluminum nitride and mixtures thereof.
Claim 4
Dependent Claim
11 words
The device of claim 1 wherein said rigidizing layer is silicon.
Claim 5
Dependent Claim
12 words
The device of claim 3 wherein said rigidizing layer is titanium nitride.
Claim 6
Dependent Claim
44 words
The device of claim 1 which further includes a layer about 50 to about 1000 angstroms thick of a silicide forming metal selected from the group of nickel, chrome, cobalt and titanium and mixtures thereof, located intermediate said copper substrate and said rigidizing layer.
Claim 7
Dependent Claim
10 words
The device of claim 5 wherein said metal is nickel.
Claim 8
Dependent Claim
11 words
The device of claim 5 wherein said rigidizing layer is silicon.
Claim 9
Dependent Claim
92 words
An electronic package which comprises an integrated circuit chip and a heat sink in physical contact with the backside of said chip wherein said heat sink comprises a copper substrate; a rigidizing layer about 2 to about 10 microns thick adhered to said copper substrate; and a non-graphitic hard carbon layer deposited on said rigidizing layer and having a thickness of about 0.2 to about 5 microns and wherein said carbon layer contacts the backside of said chip, and wherein said non-graphitic hard carbon layer is electrically insulating and is thermally noninsulating.
Claim 10
Dependent Claim
92 words
An electronic package which comprises an integrated circuit chip and a heat sink in physical contact with the backside of said chip wherein said heat sink comprises a copper substrate; a rigidizing layer about 2 to about 10 microns thick adhered to said copper substrate; and a non-graphitic hard carbon layer deposited on said rigidizing layer and having a thickness of about 0.2 to about 5 microns and wherein said carbon layer contacts the backside of said chip, and wherein said non-graphitic hard carbon layer is electrically insulating and is thermally noninsulating.
Claim 11
Dependent Claim
26 words
The package of claim 1 wherein said rigidizing layer is selected from the group of silicon, tungsten, tungsten carbide, titanium nitride, aluminum nitride and mixtures thereof.
Claim 12
Dependent Claim
11 words
The package of claim 8 wherein said rigidizing layer is silicon.
Claim 13
Dependent Claim
12 words
The package of claim 10 wherein said rigidizing layer is titanium nitride.
Claim 14
Dependent Claim
40 words
The package of claim 8 which further includes a layer about 50 to about 1000 angstroms thick of a silicide forming metal selected from the group of nickel, chrome, cobalt and titanium intermediate said copper substrate and said rigidizing layer.
Claim 15
Dependent Claim
10 words
The package of claim 12 wherein said metal is nickel.
Claim 16
Dependent Claim
11 words
The device of claim 13 wherein said rigidizing layer is silicon.
Claim 17
Independent Claim
74 words
A device which comprises a copper substrate; a metal layer about 50 to about 1000 angstroms thick adhered to said copper substrate, wherein said metal layer is selected from the group of nickel, chrome, cobalt, titanium and mixtures thereof; and a non-graphitic hard carbon layer deposited on said metal layer having a thickness of about 0.2 to about 5 microns, and wherein said non-graphitic hard carbon layer is electrically insulating and is thermally noninsulating.
Claim 18
Independent Claim
74 words
A device which comprises a copper substrate; a metal layer about 50 to about 1000 angstroms thick adhered to said copper substrate, wherein said metal layer is selected from the group of nickel, chrome, cobalt, titanium and mixtures thereof; and a non-graphitic hard carbon layer deposited on said metal layer having a thickness of about 0.2 to about 5 microns, and wherein said non-graphitic hard carbon layer is electrically insulating and is thermally noninsulating.
Claim 19
Dependent Claim
10 words
The device of claim 15 wherein said metal is nickel.
Claim 20
Dependent Claim
17 words
The device of claim 15 wherein said metal layer is about 500 to about 1500 angstroms thick.
Claim 21
Dependent Claim
30 words
The device of claim 1 wherein the electrical resistance is at least 10 megaohms over a contact area of 0.5 cm 2 at a potential of about 10 volts (D.C.).
Claim 22
Dependent Claim
30 words
The package of claim 8 wherein the electrical resistance is at least 10 megaohms over a contact area of 0.5 cm 2 at a potential of about 10 volts (D.C.).
Claim 23
Dependent Claim
30 words
The device of claim 15 wherein the electrical resistance is at least 10 megaohms over a contact area of 0.5 cm 2 at a potential of about 10 volts (D.C.).
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-07-08 | 1995-01-07 | 1995-07-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-07-08 | 1999-01-07 | 1999-07-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-07-08 | 2003-01-07 | 2003-07-09 | $7700.00 | Window Closed / Lapsed |