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US5028986A
Expired / Lapsed
US
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Semiconductor device and semiconductor module with a plurality of stacked semiconductor devices
Assignee: Hitachi Ltd
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Filing: 1988-12-23
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Granted: 1991-07-02
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Expires: 2008-12-23
Abstract
Abstract There is a trend to increase that area of a device requiring a memory of large capacity, which is occupied by a semiconductor memory. This trend obstructs reduction of the size of the device. The present invention contemplates to provide a memory which can have a high integration, a high density and a large capacity while minimizing the mounting area. In order to achieve this memory, the TAB (Tape Automated Bonding) of the prior art is mounted on an electrically conductive connector, and a plurality of structures composed of the TAB and the connector are stacked. Moreover, the connector mounting the TAB thereon is constructed such that the independent terminals of the stacked TABs may not be shorted.
Inventors
- 👤 Toshio Sugano
- 👤 Kohji Nagaoka
- 👤 Seiichiro Tsukui
- 👤 Yoshiaki Wakashima
- 👤 Michio Tanimoto
- 👤 Masayuki Watanabe
- 👤 Suguru Sakaguchi
- 👤 Kunihiko Nishi
- 👤 Aizo Kaneda
- 👤 Kohji Serizawa
- 👤 Michiharu Honda
- 👤 Tohru Yoshida
- 👤 Takeshi Komaru
- 👤 Atsushi Nakamura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 22:43
CPC Classifications
G; G11; G11C; G11C5/00; G11C5/02; G11C5/06; H; H10; H10B; H10B80/00; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/657; H10W90/00; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/144; H05K1/18; H05K1/182; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/36; H05K3/361; H05K3/363; H10W72/00; H10W72/01; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/60; H10W90/20; H10W90/22; H10W90/284; H10W90/297; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 36
Claim 1
Independent Claim
145 words
A semiconductor device comprising: a semiconductor chip formed on its principal face with a plurality of electrodes: a rectangular connector having a principal face, a back face and a through hole within which said semiconductor chip is mounted; a plurality pairs of conductors each formed on the principal and back faces of said connector and means electrically connecting each pair of said plurality of pairs of conductors on the principal and back faces of said connector; a plurality of lead patterns electrically connecting said electrodes of the semiconductor chip and said conductors formed on the principal face of said connector; and a film tape supporting said lead patterns and interposed between said semiconductor chip and said connector; and wherein at least one dummy lead pattern is provided which is supported by said film tape but not electrically connected with said electrodes of the semiconductor chip.
Claim 2
Dependent Claim
145 words
A semiconductor device comprising: a semiconductor chip formed on its principal face with a plurality of electrodes: a rectangular connector having a principal face, a back face and a through hole within which said semiconductor chip is mounted; a plurality pairs of conductors each formed on the principal and back faces of said connector and means electrically connecting each pair of said plurality of pairs of conductors on the principal and back faces of said connector; a plurality of lead patterns electrically connecting said electrodes of the semiconductor chip and said conductors formed on the principal face of said connector; and a film tape supporting said lead patterns and interposed between said semiconductor chip and said connector; and wherein at least one dummy lead pattern is provided which is supported by said film tape but not electrically connected with said electrodes of the semiconductor chip.
Claim 3
Dependent Claim
30 words
A semiconductor device according to claim 1, further comprising: means for positioning the connector relative to another connector formed at the corner portion of the principal face of said connector.
Claim 4
Dependent Claim
15 words
A semiconductor device according to claim 1, wherein said connector is made of glass epoxy.
Claim 5
Dependent Claim
14 words
A semiconductor device according to claim 1, wherein said connector is made of ceramics.
Claim 6
Dependent Claim
16 words
A semiconductor device according to claim 1, wherein said conductors are made of a copper pattern.
Claim 7
Dependent Claim
17 words
A semiconductor device according to claim 1, wherein said film tape is made of a polyimide resin.
Claim 8
Dependent Claim
29 words
A semiconductor device according to claim 1, further compressing a resin for sealing the principal face of said semiconductor chip, said electrodes and a part of said lead patterns.
Claim 9
Dependent Claim
14 words
A semiconductor device according to claim 1 wherein said resin is an epoxy resin.
Claim 10
Dependent Claim
14 words
A semiconductor device according to claim 1, wherein at least two connectors are stacked.
Claim 11
Dependent Claim
16 words
A semiconductor device according to claim 9, further comprising: a substrate for mounting said connector thereon.
Claim 12
Dependent Claim
18 words
A semiconductor device according to claim 10, further comprising: an adhesive for connecting said substrate and said connectors.
Claim 13
Dependent Claim
19 words
A semiconductor device according to claim 11, wherein said adhesive is a solder having a relatively low melting point.
Claim 14
Dependent Claim
15 words
A semiconductor device according to claim 9, further comprising: an adhesive for connecting said connectors.
Claim 15
Dependent Claim
19 words
A semiconductor device according to claim 13, wherein said adhesive is a solder having a relatively high melting point.
Claim 16
Dependent Claim
12 words
A semiconductor device according to claim 1, wherein four connectors are stacked.
Claim 17
Dependent Claim
27 words
A semiconductor device according to claim 15, wherein three dummy lead patterns are formed on said stacked connectors and kept away from electric connection with said electrodes.
Claim 18
Dependent Claim
183 words
A semiconductor module comprising: a plurality of semiconductor chips formed on their principal face with a plurality of electrodes; a plurality of rectangular connectors each having principal faces, back faces and through holes within which respective ones of said semiconductor chips are mounted; a plurality of pairs of conductors each formed on the principal and back faces of each of said plurality of connectors and each pair of said plurality of pairs of conductors on the principal and back faces of the connectors being electrically connected; a plurality of lead patterns electrically connecting said electrodes and the conductors formed on the principal face of said connectors; and a plurality of film tapes supporting said lead patterns and interposed between said semiconductor chip and said connectors; wherein at least two connectors with semiconductor chips mounted in the through holes thereof are stacked to mount said semiconductor chips in stacked relation, and wherein at least one dummy lead pattern is provided which is supported by a film tape but which is not electrically connected with the electrodes of the chip supported within the corresponding connector.
Claim 19
Dependent Claim
183 words
A semiconductor module comprising: a plurality of semiconductor chips formed on their principal face with a plurality of electrodes; a plurality of rectangular connectors each having principal faces, back faces and through holes within which respective ones of said semiconductor chips are mounted; a plurality of pairs of conductors each formed on the principal and back faces of each of said plurality of connectors and each pair of said plurality of pairs of conductors on the principal and back faces of the connectors being electrically connected; a plurality of lead patterns electrically connecting said electrodes and the conductors formed on the principal face of said connectors; and a plurality of film tapes supporting said lead patterns and interposed between said semiconductor chip and said connectors; wherein at least two connectors with semiconductor chips mounted in the through holes thereof are stacked to mount said semiconductor chips in stacked relation, and wherein at least one dummy lead pattern is provided which is supported by a film tape but which is not electrically connected with the electrodes of the chip supported within the corresponding connector.
Claim 20
Dependent Claim
48 words
A semiconductor device according to claim 17, further comprising at least one additional pair of conductors formed on the surfaces and backs of the stacked connectors other than the connector lowermost in the stacked connectors, and wherein the conductors of each additional pair are insulated from one another.
Claim 21
Dependent Claim
90 words
A semiconductor device according to claim 17, wherein at least one of said electrodes at each step of said stack is an independent one in that it is not electrically connected to electrodes of the chips at other steps of said stack whereas the remaining electrodes are electrically connected in common with electrodes of the chips at other steps of said stack, and wherein the lead patterns connected with the independent electrodes of the semiconductor chips are each connected with respective conductors on the back face of the lowermost connector.
Claim 22
Dependent Claim
29 words
A semiconductor device according claim 17, further comprising: means for positioning the connectors relative to one another formed at the corner portions of the principal faces of said connectors.
Claim 23
Dependent Claim
15 words
A semiconductor device according to claim 17, wherein said connectors are made of glass epoxy.
Claim 24
Dependent Claim
14 words
A semiconductor device according to claim 17, wherein said connectors are made of ceramic.
Claim 25
Dependent Claim
16 words
A semiconductor device according to claim 17, wherein said conductors are made of a copper pattern.
Claim 26
Dependent Claim
17 words
A semiconductor device according to claim 17, wherein said film tape is made of a polyimide resin.
Claim 27
Dependent Claim
30 words
A semiconductor device according to claim 17, further comprising a resin for sealing the principal face of said semiconductor chips, said electrodes and a part of said lead patterns, respectively.
Claim 28
Dependent Claim
14 words
A semiconductor device according to claim 25, wherein said resin is an epoxy resin.
Claim 29
Dependent Claim
17 words
A semiconductor device according to claim 17, further comprising: a substrate for mounting said stacked connectors thereon.
Claim 30
Dependent Claim
18 words
A semiconductor device according to claim 27, further comprising: an adhesive for connecting said substrate and said connectors.
Claim 31
Dependent Claim
19 words
A semiconductor device according to claim 28 wherein said adhesive is a solder having a relatively low melting point.
Claim 32
Dependent Claim
15 words
A semiconductor device according to claim 17, further comprising: an adhesive for connecting said connectors.
Claim 33
Dependent Claim
19 words
A semiconductor device according to claim 30, wherein said adhesive is a solder having a relatively high melting point.
Claim 34
Dependent Claim
12 words
A semiconductor device according to claim 17, wherein four connectors are stacked.
Claim 35
Dependent Claim
34 words
A semiconductor device according to claim 32, further comprising: three lead patterns formed on the lowermost connector which are not electrically connected with the electrodes of the lowermost chip supported within the lowermost connector.
Claim 36
Dependent Claim
50 words
A semiconductor module according to claim 17, further comprising at least one additional pair of conductors each formed on the principal and back faces of each of said connectors, except a lowermost connector of said stacked connectors, wherein the conductors of each additional pair are electrically insulated from each other.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-07-01 | 1994-12-31 | 1995-07-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-07-01 | 1998-12-31 | 1999-07-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-07-01 | 2002-12-31 | 2003-07-02 | $7700.00 | Window Closed / Lapsed |