Mold-type integrated circuit

Abstract

Abstract PURPOSE:To realize the adaptation to the high integration by a method wherein individual chips are mounted face-to-face with each other on both faces of a lead frame. CONSTITUTION:A chip 10 is mounted on one face a of a lead frame; a pad on this chip 10 is connected to individual stiches 15 at the lead frame by using a bonding wire 11. In the same manner, the individual stiches 15 at the lead frame are connected by using bonding wires 11, 21. Accordingly, the pad on the chip 10 and the pad on a chip 20 are connected by using the bonding wires 11, 21 via the stiches 15 at the lead frame. If the chips 10, 20 are mounted on both faces of the lead frame, the area for mounting the chips is almost doubled even with the identical size of a mold by this setup; accordingly, the shape of a mold IC chip is miniaturized; the high integration is realized.

Inventors

• 👤 Katsuharu Kimura
• 👤 克治 木村

Bibliographic Details