Patent US5026752A successfully refreshed from Google Patents.
US5026752A
Expired / Lapsed
US
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Amorphous-polypropylene-based hot melt adhesive
Assignee: 3M Co
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Filing: 1989-08-28
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Granted: 1991-06-25
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Expires: 2009-08-28
Abstract
Abstract A hot melt adhesive consisting essentially of amorphous polypropylene, styrene-based themoplastic elastomer, tackifier and wax having a dissipation factor of about 0.010 or less at 1 kilohertz at 23° C., and a volume resistivity of at least about 1×10 14 ohm-cm at 23° C. Such adhesives exhibit good shear strength and shock resistance.
Inventors
- 👤 Toshinori Wakabayashi
- 👤 Shinji Sugii
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:08
CPC Classifications
C; C09; C09J; C09J123/00; C09J123/02; C09J123/10; C09J123/12; C09J153/00; C09J153/02; C08; C08L; C08L2666/00; C08L2666/02; C08L2666/04; H; H05; H05K; H05K3/00; H05K3/30; H05K3/303
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
94 words
A composition consisting essentially of the following: (a) between about 10 and about 70 weight percent of amorphous polypropylene; (b) between about 2 and about 70 weight percent of styrene-based thermoplastic elastomer, said elastomer being styrene-diene block copolymer or hydrogenated styrene-diene block copolymer; (c) between about 1 and about 35 weight percent of tackifier: and (d) up to about 24 weight percent of wax; and having a dissipation factor of about 0.010 or less at 1 kilohertz at 23° C., and a volume resistivity of at least about 1×10 14 ohm-cm at 23° C.
Claim 2
Dependent Claim
94 words
A composition consisting essentially of the following: (a) between about 10 and about 70 weight percent of amorphous polypropylene; (b) between about 2 and about 70 weight percent of styrene-based thermoplastic elastomer, said elastomer being styrene-diene block copolymer or hydrogenated styrene-diene block copolymer; (c) between about 1 and about 35 weight percent of tackifier: and (d) up to about 24 weight percent of wax; and having a dissipation factor of about 0.010 or less at 1 kilohertz at 23° C., and a volume resistivity of at least about 1×10 14 ohm-cm at 23° C.
Claim 3
Dependent Claim
59 words
The composition of claim 1 consisting essentially of the following: (a) between about 14 and about 50 weight percent of said amorphous polypropylene; (b) between about 2 and about 60 weight percent of said styrene-based elastomer; (c) between about 1 and about 25 weight percent of said tackifier; and (d) up to about 24 weight percent of said wax.
Claim 4
Dependent Claim
21 words
The composition of claim 1 wherein said amorphous polypropylene has a weight average molecular weight between about 10,000 and about 100,000.
Claim 5
Dependent Claim
21 words
The composition of claim 1 wherein said amorphous polypropylene has a weight average molecular weight between about 10,000 and about 50,000.
Claim 6
Dependent Claim
25 words
The composition of claim 1 wherein said amorphous polypropylene comprises at least one of: atactic polypropylene, and propylene copolymerized with a low molecular weight alkene.
Claim 7
Dependent Claim
29 words
The composition of claim 1 wherein said styrene-based elastomer has a repeating structure of A-B or A-B-A wherein A is polystyrene and B is a compatible soft segment copolymer.
Claim 8
Dependent Claim
22 words
The composition of claim 6 wherein said A blocks have a weight average molecular weight of between about 5,000 and about 125,000.
Claim 9
Dependent Claim
22 words
The composition of claim 6 wherein said A blocks have a weight average molecular weight of between about 8,000 and about 45,000.
Claim 10
Dependent Claim
22 words
The composition of claim 7 wherein said B blocks has a weight average molecular weight of between about 30,000 and about 125,000.
Claim 11
Dependent Claim
22 words
The composition of claim 6 wherein said B blocks have a weight average molecular weight of between about 50,000 and about 100,000.
Claim 12
Dependent Claim
24 words
The composition of claim 6 wherein the weight ratio of said A blocks to said B blocks is between about 1:4 and about 4:1.
Claim 13
Dependent Claim
26 words
The composition of claim 1 wherein said styrene-based thermoplastic elastomer comprises blocks of hard segments and blocks of soft segments, said soft segments being substantially saturated.
Claim 14
Dependent Claim
35 words
The composition of claim 1 wherein said tackifier is at least one of the following: polyterpenes, rosins, rosin esters and derivatives thereof, aliphatic and aromatic resins, modified terpenes, coumarone-indenes, polyesters, alkyl phenols, or styrene oligomers.
Claim 15
Dependent Claim
26 words
The composition of claim 1 wherein said wax is at least one of the following: low molecular weight polyethylene, microcrystalline wax, Fischer-Tropsch wax, or paraffin wax.
Claim 16
Dependent Claim
19 words
The composition of claim 1 further comprising at least one of the following: crystalline polyolefin, filler, colorant, or stabilizer.
Claim 17
Dependent Claim
82 words
The composition of claim 1 wherein said composition has a volume resistivity of between about 10 14 and about 10 17 ohm-cm at 23° C., a dielectric strength of between about 25 and about 50 kilovolts/millimeter, a dielectric constant of between about 2.3 and about 3.0 at 1 kilohertz, a dissipation factor of between about 0.0008 and about 0.010 at a 1 kilohertz at 23° C., and electrolytic corrosion after 1000 hours of between about 10 10 and about 10 12 ohms.
Claim 18
Independent Claim
95 words
A method of bonding electronic components said method comprising using a composition consisting essentially of the following: (a) between about 10 and about 70 weight percent of amorphous polypropylene; (b) between about 2 and about 70 weight percent of styrene-based thermoplastic elastomer; (c) between about 1 and about 35 weight percent of tackifier; and (d) up to about b 24 weight percent of wax; wherein said composition has a dissipation factor of about 0.010 or less at 1 kilohertz at 23° C., and a volume resistivity of at least about 1×10 14 ohm-cm at 23°C.
Claim 19
Independent Claim
95 words
A method of bonding electronic components said method comprising using a composition consisting essentially of the following: (a) between about 10 and about 70 weight percent of amorphous polypropylene; (b) between about 2 and about 70 weight percent of styrene-based thermoplastic elastomer; (c) between about 1 and about 35 weight percent of tackifier; and (d) up to about b 24 weight percent of wax; wherein said composition has a dissipation factor of about 0.010 or less at 1 kilohertz at 23° C., and a volume resistivity of at least about 1×10 14 ohm-cm at 23°C.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-06-24 | 1994-12-24 | 1995-06-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-06-24 | 1998-12-24 | 1999-06-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-06-24 | 2002-12-24 | 2003-06-25 | $7700.00 | Window Closed / Lapsed |