Method of forming a two piece chip carrier

Claim 1

A method of forming a two-piece chip carrier for hermetically sealing a chip therein by adhering a chip to a die pad of a lead frame which forms part of one-piece of said chip carrier and electrically coupling said chip to said lead frame, clamping said one-piece of said chip carrier to a second-piece of said chip carrier, and heating to a predetermined curing temperature, comprising the steps of: forming said one-piece of said chip carrier by (a) adhering a first surface of a first epoxy B-stage preform to a pre-molded plastic base by heating to a first predetermined temperature sufficient to cause said adhering without curing said first epoxy B-stage preform, and (b) adhering said lead frame to said pre-molded plastic base by clamping said lead frame to said pre-molded plastic base at an opposite second surface of said first epoxy B-stage preform and heating to a second predetermined temperature sufficient to cause said adhering and cure said first epoxy B-stage preform; and forming said second-piece of said chip carrier by adhering a first surface of a second epoxy B-stage preform, having said predetermined curing temperature, to a metal cover, having an aperture therein closed by a pre-poured ultra-violet glass window, by heating to a third predetermined temperature sufficient to cause said adhering without curing said second epoxy B-stage preform.

Claim 2

A method of forming a two-piece chip carrier for hermetically sealing a chip therein by adhering a chip to a die pad of a lead frame which forms part of one-piece of said chip carrier and electrically coupling said chip to said lead frame, clamping said one-piece of said chip carrier to a second-piece of said chip carrier, and heating to a predetermined curing temperature, comprising the steps of: forming said one-piece of said chip carrier by (a) adhering a first surface of a first epoxy B-stage preform to a pre-molded plastic base by heating to a first predetermined temperature sufficient to cause said adhering without curing said first epoxy B-stage preform, and (b) adhering said lead frame to said pre-molded plastic base by clamping said lead frame to said pre-molded plastic base at an opposite second surface of said first epoxy B-stage preform and heating to a second predetermined temperature sufficient to cause said adhering and cure said first epoxy B-stage preform; and forming said second-piece of said chip carrier by adhering a first surface of a second epoxy B-stage preform, having said predetermined curing temperature, to a metal cover, having an aperture therein closed by a pre-poured ultra-violet glass window, by heating to a third predetermined temperature sufficient to cause said adhering without curing said second epoxy B-stage preform.

Claim 3

A method of forming a hermetically sealed chip carrier, comprising the steps of; forming a first sub-assembly by (a) adhering a first surface of a first epoxy B-stage preform to a pre-molded plastic base by heating to a first predetermined temperature sufficient to cause said adhering without curing said first epoxy B-stage preform, and (b) adhering a lead frame to said pre-molded plastic base by clamping said lead frame to said pre-molded plastic base at an opposite second surface of said first epoxy B-stage preform and heating to a second predetermined temperature sufficient to cause said adhering and cure said first epoxy B-stage preform; forming a second sub-assembly by adhering a first surface of a second epoxy B-stage preform to a metal cover, having an aperture therein closed by a pre-poured ultra-violet glass window, by heating to a third predetermined temperature sufficient to cause said ahering without curing said second epoxy B-stage preform; adhering a chip to a die pad of said lead frame and electrically coupling said chip to said lead frame; and adhering said first sub-assembly to said second sub-assembly by clamping said first sub-assembly to said second sub-assembly and heating to a fourth predetermined temperature sufficient to cause said adhering and cure said second epoxy B-stage preform.

Claim 4

A method of forming a hermetically sealed chip carrier, comprising the steps of; forming a first sub-assembly by (a) adhering a first surface of a first epoxy B-stage preform to a pre-molded plastic base by heating to a first predetermined temperature sufficient to cause said adhering without curing said first epoxy B-stage preform, and (b) adhering a lead frame to said pre-molded plastic base by clamping said lead frame to said pre-molded plastic base at an opposite second surface of said first epoxy B-stage preform and heating to a second predetermined temperature sufficient to cause said adhering and cure said first epoxy B-stage preform; forming a second sub-assembly by adhering a first surface of a second epoxy B-stage preform to a metal cover, having an aperture therein closed by a pre-poured ultra-violet glass window, by heating to a third predetermined temperature sufficient to cause said ahering without curing said second epoxy B-stage preform; adhering a chip to a die pad of said lead frame and electrically coupling said chip to said lead frame; and adhering said first sub-assembly to said second sub-assembly by clamping said first sub-assembly to said second sub-assembly and heating to a fourth predetermined temperature sufficient to cause said adhering and cure said second epoxy B-stage preform.