US4663650A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Packaged integrated circuit chip
Assignee: Osram Sylvania Inc
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Filing: 1986-09-22
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Granted: 1987-05-05
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Expires: 2006-09-22
Abstract
Abstract An IC chip package comprises a lead frame support on which lead frame segments are disposed. An IC chip is disposed on a pad area on the lead frame support. There is a cover on the support. A sealant material encircles the IC chip within the confines of the support and cover in order to seal the IC chip from the environment.
Inventors
- 👤 Thomas G. Gilder, Jr.
- 👤 Raymond D. O'Dean
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 10:49
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/479; H10W70/421; H10W70/438; H10W70/442; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
143 words
A packaged IC chip comprising: a lead frame support made of electrically insulating material and having a pad area at the center thereof, said pad area being square or rectangular; first raised spaced-apart projections proximate the periphery of said pad area, on all four sides thereof, the spaces between the projections defining slots; and IC chip disposed on said pad area; a plurality of individual lead frame segments disposed around said pad area, each individual segment comprising a plurality of spaced apart leads the inner ends of which converge towards said IC chip, each one of said leads being positioned in one of said slots; a cover made of electrically insulating material disposed on and mating with said support; and a sealant material encircling the IC chip between the support and the cover, the sealant material sealing the IC chip from the environment.
Claim 2
Dependent Claim
143 words
A packaged IC chip comprising: a lead frame support made of electrically insulating material and having a pad area at the center thereof, said pad area being square or rectangular; first raised spaced-apart projections proximate the periphery of said pad area, on all four sides thereof, the spaces between the projections defining slots; and IC chip disposed on said pad area; a plurality of individual lead frame segments disposed around said pad area, each individual segment comprising a plurality of spaced apart leads the inner ends of which converge towards said IC chip, each one of said leads being positioned in one of said slots; a cover made of electrically insulating material disposed on and mating with said support; and a sealant material encircling the IC chip between the support and the cover, the sealant material sealing the IC chip from the environment.
Claim 3
Dependent Claim
20 words
The packaged IC chip of claim 1 wherein the sealant material is disposed in a trough encircling the IC chip.
Claim 4
Dependent Claim
29 words
The packaged IC chip of claim 1 wherein the cover mates with the support by means of posts on one part thereof fitting into holes in the other part.
Claim 5
Dependent Claim
35 words
The packaged IC chip of claim 3, wherein the cover and support are made of a thermoplastic material and wherein the cover can be secured to the support by heat-flowing the ends of the posts.
Claim 6
Dependent Claim
22 words
The packaged IC chip of claim 1 wherein there is a recessed area in said cover to accommodate said raised spaced-apart projections.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-05-04 | 1990-11-03 | 1991-05-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-05-04 | 1994-11-03 | 1995-05-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-05-04 | 1998-11-03 | 1999-05-05 | $7700.00 | Window Closed / Lapsed |