US5012325A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thermoelectric cooling via electrical connections
Assignee: International Business Machines Corp
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Filing: 1990-04-24
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Granted: 1991-04-30
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Expires: 2010-04-24
Abstract
Abstract A thermoelectrically cooled integrated circuit package is provided which includes a thermally conductive dielectric substrate, an input connecting portion and an output connecting portion supported by the dielectric substrate, and an integrated circuit chip including an input terminal and output terminal. The input terminal is electrically connected to the input connecting portion via a first conductive material, and the output terminal is electrically connected to the output connecting portion via a second conductive material. The first conductive material and the second conductive material thermoelectrically cool the integrated circuit chip when a signal passes through the first conductive material and the second conductive material.
Inventors
- 👤 Mohanlal S. Mansuria
- 👤 Joseph M. Mosley
- 👤 Richard D. Musa
- 👤 Vito J. Tuozzolo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 19:36
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/28; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10S; Y10S257/00; Y10S257/93
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
105 words
A thermoelectrically cooled integrated circuit package comprising a thermally conductive dielectric substrate, an input connecting portion supported by said dielectric substrate, an output connecting portion supported by said dielectric substrate, and an integrated circuit chip including an input terminal and an output terminal, said input terminal being electrically connected to said input connecting portion via a first conductive material, and said output terminal being electrically connected to said output connecting portion via a second conductive material said first conductive material and said second conductive material thermoelectrically cooling said integrated circuit chip when a signal passes through said first conductive material and said second conductive material.
Claim 2
Dependent Claim
105 words
A thermoelectrically cooled integrated circuit package comprising a thermally conductive dielectric substrate, an input connecting portion supported by said dielectric substrate, an output connecting portion supported by said dielectric substrate, and an integrated circuit chip including an input terminal and an output terminal, said input terminal being electrically connected to said input connecting portion via a first conductive material, and said output terminal being electrically connected to said output connecting portion via a second conductive material said first conductive material and said second conductive material thermoelectrically cooling said integrated circuit chip when a signal passes through said first conductive material and said second conductive material.
Claim 3
Dependent Claim
41 words
The integrated circuit package of claim 1 further comprising a plurality of input terminals, and a plurality of input connecting portions said plurality of input terminals being electrically connected to said plurality of input connecting portions via said first conductive material.
Claim 4
Dependent Claim
31 words
The integrated circuit package of claim 2 wherein at least one input terminal is a signal input terminal, and at least one input connecting portion is a signal input connecting portion.
Claim 5
Dependent Claim
31 words
The integrated circuit package of claim 2 wherein at least one input terminal is a power input terminal, and at least one input connecting portion is a power input connecting portion.
Claim 6
Dependent Claim
41 words
The integrated circuit package of claim 1 further comprising a plurality of output terminals, and a plurality of output connecting portions said plurality of output terminals being electrically connected to said plurality of output connecting portions via said second conductive material.
Claim 7
Dependent Claim
30 words
The integrated circuit package of claim 5 wherein at least one output terminal is a signal output terminal, at least one output connecting portion is a signal output connecting portion.
Claim 8
Dependent Claim
31 words
The integrated circuit package of claim 5 wherein at least one output terminal is a power output terminal, and at least one output connecting portion is a power output connecting portion.
Claim 9
Dependent Claim
27 words
The integrated circuit package of claim 1 wherein said first conductive material is a first semiconductor material, and said second conductive material is a second semiconductor material.
Claim 10
Dependent Claim
23 words
The integrated circuit package of claim 8 wherein said first semiconductor material is p-type material, and said second semiconductor material is n-type material.
Claim 11
Dependent Claim
31 words
The integrated circuit package of claim 2 wherein at least one input terminal is a shunt input terminal, and at least one input connecting portion is a shunt input connecting portion.
Claim 12
Dependent Claim
31 words
The integrated circuit package of claim 10 wherein as least one output terminal is a shunt output terminal, and at least one output connecting portion is a shunt output connecting portion.
Claim 13
Dependent Claim
24 words
The integrated circuit package of claim 11 wherein said shunt input terminal is electrically connected to said shunt output terminal via a shunt line.
Claim 14
Dependent Claim
106 words
A thermoelectrically cooled integrated circuit package comprising a heat dissipating material, an input connecting portion supported by said heat dissipating material, an output connecting portion supported by said heat dissipating material, and an integrated circuit chip including an input terminal and an output terminal, said input terminal being electrically connected to said input connecting portion via a first conductive material, and said output terminal being electrically connected to said output connecting portion via a second conductive material said first conductive material and said second conductive material thermoelectrically cooling said integrated circuit chip when a signal passes through said first conductive material and said second conductive material.
Claim 15
Dependent Claim
106 words
A thermoelectrically cooled integrated circuit package comprising a heat dissipating material, an input connecting portion supported by said heat dissipating material, an output connecting portion supported by said heat dissipating material, and an integrated circuit chip including an input terminal and an output terminal, said input terminal being electrically connected to said input connecting portion via a first conductive material, and said output terminal being electrically connected to said output connecting portion via a second conductive material said first conductive material and said second conductive material thermoelectrically cooling said integrated circuit chip when a signal passes through said first conductive material and said second conductive material.
Claim 16
Dependent Claim
31 words
The integrated circuit package of claim 13 wherein at least one input terminal is a shunt input terminal, and at least one input connecting portion is a shunt input connecting portion.
Claim 17
Dependent Claim
31 words
The integrated circuit package of claim 14 wherein as least one output terminal is a shunt output terminal, and at least one output connecting portion is a shunt output connecting portion.
Claim 18
Dependent Claim
24 words
The integrated circuit package of claim 15 wherein said shunt input terminal is electrically connected to said shunt output terminal via a shunt line.
Claim 19
Dependent Claim
18 words
The integrated circuit package of claim 13 wherein said heat dissipating material includes a thermally conductive dielectric substrate.
Claim 20
Dependent Claim
20 words
The integrated circuit package of claim 13 wherein said heat dissipating material includes a cover covering said integrated circuit chip.
Claim 21
Dependent Claim
20 words
The integrated circuit package of claim 13 wherein said heat dissipating material includes a cover covering said integrated circuit chip.
Claim 22
Dependent Claim
16 words
The integrated circuit package of claim 13 wherein said heat dissipating material includes a heat sink.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-04-29 | 1994-10-29 | 1995-04-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-04-29 | 1998-10-29 | 1999-04-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-04-29 | 2002-10-29 | 2003-04-30 | $7700.00 | Window Closed / Lapsed |