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US5012047A Expired / Lapsed US ⏱️ 0.0 years remaining

Multilayer wiring substrate

Assignee: NEC Corp
•
Filing: 1990-02-16
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Granted: 1991-04-30
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Expires: 2010-02-16
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Abstract

Abstract A multilayer wiring substrate which includes a plurality of laminated wiring layers, a plurality of insulating layers for providing insulation between the wiring layers, and a plurality of hollows provided within at least one of the insulating layers.

Inventors

  • 👤 Akihiro Dohya

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 16:16
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0237; H05K1/024; H10W44/00; H10W44/601; H10W70/67; H10W70/68; H10W70/685; H05K1/0296; H05K1/0298; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154

Claims Analysis

Total Claims: 16
Claim 1
Independent Claim 45 words
A multilayer wiring substrate comprising: a ground layer of mesh pattern; a signal wiring layer; an insulating layer providing insulation between said ground layer and said signal wiring layer; and a plurality of hollows provided inside said insulating layer and disposed along said mesh pattern.
Claim 2
Dependent Claim 45 words
A multilayer wiring substrate comprising: a ground layer of mesh pattern; a signal wiring layer; an insulating layer providing insulation between said ground layer and said signal wiring layer; and a plurality of hollows provided inside said insulating layer and disposed along said mesh pattern.
Claim 3
Dependent Claim 18 words
A multilayer wiring substrate as claimed in claim 1, wherein said hollows are adjacent to said ground layer.
Claim 4
Dependent Claim 22 words
A multilayer wiring substrate as claimed in claim 1, wherein said insulating layer containing said hollows is made of a ceramic material.
Claim 5
Dependent Claim 20 words
A multilayer wiring substrate as claimed in claim 1, wherein said insulating layer containing said hollows is made of polyimide.
Claim 6
Dependent Claim 14 words
A multilayer wiring substrate as claimed in claim 1, wherein said hollows are cube-shaped.
Claim 7
Dependent Claim 23 words
A multilayer wiring substrate as claimed in claim 5, wherein said cube-shaped hollows have a side dimension of about 150 μm in length.
Claim 8
Dependent Claim 24 words
A multilayer wiring substrate as claimed in claim 1, wherein the volume ratio of said hollows to said insulating layer is about twenty percent.
Claim 9
Dependent Claim 32 words
A multilayer wiring substrate as claimed in claim 1, wherein said multilayer wiring substrate includes a plurality of insulating layers, a plurality of signal wiring layers and a plurality of ground layers.
Claim 10
Dependent Claim 33 words
A multilayer wiring substrate as claimed in claim 8, wherein said hollows are disposed in at least one of said plurality of insulating layers between a ground layer and a signal wiring layer.
Claim 11
Dependent Claim 29 words
A multilayer wiring substrate as claimed in claim 1, wherein the thickness of the insulating layer between a signal wiring layer and a ground layer is about 300 micrometers.
Claim 12
Dependent Claim 26 words
A multilayer wiring substrate as claimed in claim 9, wherein said hollows are disposed at distances corresponding to the mesh pattern of a corresponding ground layer.
Claim 13
Dependent Claim 25 words
A multilayer wiring substrate as claimed in claim 3, wherein the apparent relative dielectric constant of said insulating layer containing said hollows is about 3.5.
Claim 14
Dependent Claim 25 words
A multilayer wiring substrate as claimed in claim 4, wherein the apparent relative dielectric constant of said insulating layer containing said hollows is about 2.3.
Claim 15
Dependent Claim 55 words
A multilayer wiring substrate comprising: a plurality of laminated wiring layers; a plurality of insulating layers providing insulation between said wiring layers; and a plurality of hollows provided within at least one of said insulating layers, wherein said hollows are cube-shaped and said cube-shaped hollows have a side dimension of about 150 μm in length.
Claim 16
Dependent Claim 55 words
A multilayer wiring substrate comprising: a plurality of laminated wiring layers; a plurality of insulating layers providing insulation between said wiring layers; and a plurality of hollows provided within at least one of said insulating layers, wherein said hollows are cube-shaped and said cube-shaped hollows have a side dimension of about 150 μm in length.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1994-04-29 1994-10-29 1995-04-30 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1998-04-29 1998-10-29 1999-04-30 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2002-04-29 2002-10-29 2003-04-30 $7700.00 Window Closed / Lapsed

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