← Back to Patent Explorer
US5009965A Expired / Lapsed US ⏱️ 0.0 years remaining

Colloidal compositions for electroless deposition

Assignee: Individual
•
Filing: 1988-09-26
•
Granted: 1991-04-23
•
Expires: 2008-09-26
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract Metallic surfaces are imparted to non-conductors or dielectric substrates by electroless(chemical) plating process comprised of coating the substrates with colloid(s) of non-precious metals and wherein the colloids are prepared in a manner as to impart resistance towards further deterioration.

Inventors

  • 👤 Nathan Feldstein

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 11:52
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/1851; C23C18/1872; C23C18/1886; C23C18/1889; C23C18/31; C23C18/38; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12014; Y10T428/31504; Y10T428/31678

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 148 words
A colloidal composition useful in the metallization of an electrically non-conductive substrate wherein said colloidal composition is the reaction product resulting from the admixture in a liquid medium comprising at least one primary metal and at least one secondary metal, said metals being in positive oxidation states, and wherein said primary metal is selected from the group consisting of copper, nickel, iron, and cobalt and mixtures thereof and wherein said secondary metal is selected from the group consisting of aluminum, gallium, indium, germanium, lead, antimony, bismuth, chromium, tin, thallium, and mixtures thereof, and further wherein said primary metal and said secondary metal in said resultant colloidal composition are in a reduced oxidation state derived through the chemical reduction in the admixture of both the primary and secondary metals both metals having been initially introduced in a higher oxidation state than their oxidation states in the resultant colloidal composition.
Claim 2
Dependent Claim 148 words
A colloidal composition useful in the metallization of an electrically non-conductive substrate wherein said colloidal composition is the reaction product resulting from the admixture in a liquid medium comprising at least one primary metal and at least one secondary metal, said metals being in positive oxidation states, and wherein said primary metal is selected from the group consisting of copper, nickel, iron, and cobalt and mixtures thereof and wherein said secondary metal is selected from the group consisting of aluminum, gallium, indium, germanium, lead, antimony, bismuth, chromium, tin, thallium, and mixtures thereof, and further wherein said primary metal and said secondary metal in said resultant colloidal composition are in a reduced oxidation state derived through the chemical reduction in the admixture of both the primary and secondary metals both metals having been initially introduced in a higher oxidation state than their oxidation states in the resultant colloidal composition.
Claim 3
Independent Claim 111 words
A method for improving the stability of a colloidal dispersion comprising a primary metal selected from the group consisting of copper, nickel, cobalt, and iron including the step comprising of the admixing of a secondary metal selected from the group consisting of aluminum, gallium, indium, germanium, lead, antimony, bismuth, chromium, tin, thallium, and mixtures thereof, and further wherein said primary metal and said secondary metal in said resultant colloidal composition are in a reduced oxidation state derived through the chemical reduction in the admixture of both the primary and secondary metals, both metals having been initially introduced in a higher oxidation state than their oxidation states in the resultant colloidal dispersion.
Claim 4
Independent Claim 111 words
A method for improving the stability of a colloidal dispersion comprising a primary metal selected from the group consisting of copper, nickel, cobalt, and iron including the step comprising of the admixing of a secondary metal selected from the group consisting of aluminum, gallium, indium, germanium, lead, antimony, bismuth, chromium, tin, thallium, and mixtures thereof, and further wherein said primary metal and said secondary metal in said resultant colloidal composition are in a reduced oxidation state derived through the chemical reduction in the admixture of both the primary and secondary metals, both metals having been initially introduced in a higher oxidation state than their oxidation states in the resultant colloidal dispersion.

References Cited (Backward Citations)

US3958048A Cited
US3993799A Cited
US4265942A Cited
US4309454A Cited
US4327125A Cited
US3993801A Cited
US3993848A Cited
US4087586A Cited
US4325983A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1994-04-22 1994-10-22 1995-04-23 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1998-04-22 1998-10-22 1999-04-23 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2002-04-22 2002-10-22 2003-04-23 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag