Patent US5006792A successfully refreshed from Google Patents.
US5006792A
Expired / Lapsed
US
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Flip-chip test socket adaptor and method
Assignee: Texas Instruments Inc
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Filing: 1989-03-30
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Granted: 1991-04-09
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Expires: 2009-03-30
Abstract
Abstract A test set socket adapter (20) comprises a substrate (28), a plurality of cantilever beams (32) and a package (30). A bare chip (22) may be inserted into and held by the test socket adapter (20) for insertion into a standard test socket. The cantilevers (32) are designed to deflect and compensate for variations in solder bumps (26) on the bare chip (22). The deflection of the cantilever beams (32) allows a positive contact between the solder bumps (26) and the cantilever beams for an AC and a burn-in test.
Inventors
- 👤 Satwinder Malhi
- 👤 Oh K. Kwon
- 👤 Shivaling S. Mahant-Shetti
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 17:24
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/02; H05K7/10; H05K7/1053; H05K7/1061; G; G01; G01R; G01R1/00; G01R1/02; G01R1/04; G01R1/0408; G01R1/0433; G01R1/0483; G01R1/06; G01R1/067; G01R1/06711; G01R1/06716; G01R1/06727
Claims Analysis
Total Claims: 32
Claim 1
Independent Claim
66 words
A socket adaptor for testing a bare integrated circuit chip having solder bump leads, comprising: a substrate constructed and arranged to receive and hold the chip; a plurality of pressure-sensitive contacts on said substrate matched to solder bump leads on the chip, said contacts comprising cantilever beams formed from a semiconductor material; and a package for holding said substrate such that the chip may be tested.
Claim 2
Dependent Claim
66 words
A socket adaptor for testing a bare integrated circuit chip having solder bump leads, comprising: a substrate constructed and arranged to receive and hold the chip; a plurality of pressure-sensitive contacts on said substrate matched to solder bump leads on the chip, said contacts comprising cantilever beams formed from a semiconductor material; and a package for holding said substrate such that the chip may be tested.
Claim 3
Dependent Claim
39 words
The socket adaptor of claim 1, wherein said substrate comprises: a silicon substrate having a first conductivity-type; a first silicon layer having a second conductivity-type formed over said substrate; and a second silicon layer formed over said first layer.
Claim 4
Dependent Claim
14 words
The socket adaptor of claim 2, wherein said substrate comprises an n type conductivity.
Claim 5
Dependent Claim
16 words
The socket adaptor of claim 2, wherein said first layer comprises a p ++ type layer.
Claim 6
Dependent Claim
21 words
The socket adaptor of claim 4, wherein said p ++ layer is doped up to 10 20 atoms per cubic centimeter.
Claim 7
Dependent Claim
14 words
The socket adaptor of claim 2, wherein said first layer is 15 microns thick.
Claim 8
Dependent Claim
15 words
The socket adaptor of claim 2, wherein said second layer comprises an n type layer.
Claim 9
Dependent Claim
15 words
The socket adaptor of claim 2, wherein said second layer comprises a p type layer.
Claim 10
Dependent Claim
17 words
The socket adaptor of claim 2, wherein said contacts comprise cantilever beams formed from said second layer.
Claim 11
Dependent Claim
30 words
The socket adaptor of claim 1, wherein said package comprises: a container fixed to said substrate; and a conductor fixed to each of said contacts and extending through said container.
Claim 12
Dependent Claim
21 words
The socket adaptor of claim 1, further comprising a nest fixed to said substrate to help align said solder bump leads.
Claim 13
Dependent Claim
60 words
A socket adaptor for testing a bare integrated circuit chip, comprising: a substrate constructed to receive and hold the chip; a plurality of pressure-sensitive bumped contacts on said substrate matched to pads on the chip, said contacts comprising cantilever beams formed from a semiconductor material; and a package for holding said substrate such that the bare chip may be tested.
Claim 14
Dependent Claim
60 words
A socket adaptor for testing a bare integrated circuit chip, comprising: a substrate constructed to receive and hold the chip; a plurality of pressure-sensitive bumped contacts on said substrate matched to pads on the chip, said contacts comprising cantilever beams formed from a semiconductor material; and a package for holding said substrate such that the bare chip may be tested.
Claim 15
Dependent Claim
38 words
The adaptor of claim 12, wherein said substrate comprises: a silicon substrate having a first conductivity-type; a first silicon layer having a second conductivity-type formed over said substrate; and a second silicon layer formed over said first layer.
Claim 16
Dependent Claim
13 words
The adaptor of claim 13, wherein said substrate comprises an n type conductivity.
Claim 17
Dependent Claim
15 words
The adaptor of claim 13, wherein said first layer comprises a p ++ type layer.
Claim 18
Dependent Claim
20 words
The adaptor of claim 15, wherein said p ++ layer is doped up to 10 20 atoms per cubic centimeter.
Claim 19
Dependent Claim
13 words
The adaptor of claim 13, wherein said first layer is 15 microns thick.
Claim 20
Dependent Claim
14 words
The adaptor of claim 13, wherein said second layer comprises an n type layer.
Claim 21
Dependent Claim
14 words
The adaptor of claim 13, wherein said second layer comprises a p type layer.
Claim 22
Dependent Claim
16 words
The adaptor of claim 13, wherein said contacts comprise cantilever beams formed from said second layer.
Claim 23
Dependent Claim
29 words
The adaptor of claim 12, wherein said package comprises: a container fixed to said substrate; and a conductor fixed to each of said contacts and extending through said container.
Claim 24
Dependent Claim
21 words
The adaptor of claim 12, further comprising a nest fixed to said substrate to help align said pads with said contacts.
Claim 25
Independent Claim
63 words
A method for testing a bare chip, comprising the steps of: forming a test socket adaptor for receiving and holding the chip, said test socket adaptor including a plurality of pressure-sensitive contacts, said contacts comprising cantilever beams formed from a semiconductor material; positioning the chip in said adaptor; and plugging said adaptor in a test socket to allow the chip to be tested.
Claim 26
Independent Claim
63 words
A method for testing a bare chip, comprising the steps of: forming a test socket adaptor for receiving and holding the chip, said test socket adaptor including a plurality of pressure-sensitive contacts, said contacts comprising cantilever beams formed from a semiconductor material; positioning the chip in said adaptor; and plugging said adaptor in a test socket to allow the chip to be tested.
Claim 27
Dependent Claim
56 words
The method of claim 23, wherein the step of forming a test socket adaptor comprises: forming a substrate comprising said plurality of pressure-sensitive contacts to match electrical contacts on the bare chip; fixing said substrate to a package, constructed and arranged to plug into said test socket; and electrically connecting said pressure-sensitive contacts to said package.
Claim 28
Dependent Claim
49 words
The method of claim 24, wherein the step of forming a substrate comprises: forming a silicon substrate having a first conductivity-type; forming a first silicon layer having a second conductivity-type over said substrate; and forming a second silicon layer over said first layer, said second layer comprising said contacts.
Claim 29
Dependent Claim
33 words
The method of claim 24, wherein the step of forming a substrate further comprises fixing a nest to said substrate to help align electrical contacts on the bare chip to said pressure-sensitive contacts.
Claim 30
Dependent Claim
50 words
The method of claim 24, wherein the step of positioning comprises: aligning the electrical contacts on the bare chip with said pressure-sensitive contacts; and applying a force to the chip to deflect said pressure-sensitive contacts to provide an electrical connection to each of the electrical contacts on the bare chip.
Claim 31
Dependent Claim
17 words
The method of claim 24, wherein the electrical contacts on the bare chip are solder bump leads.
Claim 32
Dependent Claim
15 words
The method of claim 24, wherein the electrical contacts on the bare chip are pads.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-04-08 | 1994-10-08 | 1995-04-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-04-08 | 1998-10-08 | 1999-04-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-04-08 | 2002-10-08 | 2003-04-09 | $7700.00 | Window Closed / Lapsed |