US5000811A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Precision buttable subunits via dicing
Assignee: Xerox Corp
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Filing: 1989-11-22
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Granted: 1991-03-19
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Expires: 2009-11-22
Abstract
Abstract A buttable edge surface in a substrate is fabricated by sawing a back cut in a base surface of the substrate and then cutting a section cut through the upper surface of the back cut to intersect the back cut. The location of the section cut defines the buttable edge surface of the substrate. The section cut divides the substrate into a plurality of subunits which can be butted together to form an elongated array of butted subunits. The cutting blade preferably is a resinoid blade.
Inventors
- 👤 Michael R. Campanelli
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 18:22
CPC Classifications
H; H10; H10P; H10P52/00; B; B41; B41J; B41J2/00; B41J2/005; B41J2/01; B41J2/135; B41J2/145; H10D; H10D62/00; H10D62/10; H10D62/117; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1062; Y10T156/1064; Y10T156/1075
Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
93 words
A method of fabricating a buttable edge surface in a substrate having an upper surface and a base surface, the method comprising the steps of: sawing at least one back cut of a predetermined depth in the base surface of the substrate; and cutting at least one section cut through the upper surface to intersect the corresponding at least one back cut without forming a surface passivation damage-inhibiting groove in the upper surface prior to cutting the section cut, the location of the section cut defining the buttable edge surface of the substrate.
Claim 2
Independent Claim
93 words
A method of fabricating a buttable edge surface in a substrate having an upper surface and a base surface, the method comprising the steps of: sawing at least one back cut of a predetermined depth in the base surface of the substrate; and cutting at least one section cut through the upper surface to intersect the corresponding at least one back cut without forming a surface passivation damage-inhibiting groove in the upper surface prior to cutting the section cut, the location of the section cut defining the buttable edge surface of the substrate.
Claim 3
Independent Claim
125 words
A method of fabricating a printhead formed from a linear array of butted subunits comprising the steps of: forming at least one back cut of a predetermined depth in a base surface of a substrate; dividing the substrate into at least two subunits by cutting at least one section cut through an opposite upper surface of the substrate to intersect the corresponding at least one back cut without forming a surface passivation damage-inhibiting groove in the upper surface of the substrate prior to cutting the section cut, said at least one section cut forming a buttable edge surface in each subunit; and butting the buttable edge surface of each subunit against a corresponding buttable edge surface of an adjacent subunit to form said linear array.
Claim 4
Independent Claim
125 words
A method of fabricating a printhead formed from a linear array of butted subunits comprising the steps of: forming at least one back cut of a predetermined depth in a base surface of a substrate; dividing the substrate into at least two subunits by cutting at least one section cut through an opposite upper surface of the substrate to intersect the corresponding at least one back cut without forming a surface passivation damage-inhibiting groove in the upper surface of the substrate prior to cutting the section cut, said at least one section cut forming a buttable edge surface in each subunit; and butting the buttable edge surface of each subunit against a corresponding buttable edge surface of an adjacent subunit to form said linear array.
Claim 5
Dependent Claim
19 words
The method of claim 2 wherein the substrate includes a channel substrate bonded on top of a heater substrate.
Claim 6
Dependent Claim
27 words
The method of claim 3 wherein the back cut formed in the base surface of the substrate is located in a base surface of the heater substrate.
Claim 7
Dependent Claim
26 words
The method of claim 4 wherein the predetermined depth of the back cut in the heater substrate is less than the thickness of the heater substrate.
Claim 8
Dependent Claim
21 words
The method of claim 2 wherein the width of the back cut is greater than the width of the section cut.
Claim 9
Dependent Claim
22 words
The method of claim 2 wherein the section cut is perpendicular to the upper surface to form a vertical buttable edge surface.
Claim 10
Dependent Claim
22 words
The method of claim 2 further comprising the step of collecting debris in the back cut while butting adjacent buttable edge surfaces.
Claim 11
Dependent Claim
21 words
The method of claim 2 wherein the back cut provides a clearance for a cutting blade which cuts the section cut.
Claim 12
Dependent Claim
57 words
The method of claim 2 further comprising the steps of locating the base surface of the substrate on a support surface after sawing the at least one back cut in the substrate; and using a cutting blade to cut the at least one section cut to depth that intersects the back cut without intersecting the support surface.
Claim 13
Dependent Claim
49 words
The method of claim 10 wherein the base surface is adhered to the support surface with an adhesive layer, and the back cut provides a clearance for the cutting blade between the section cut and the adhesive layer to eliminate penetration of the adhesive layer by the cutting blade.
Claim 14
Dependent Claim
14 words
The method of claim 10 wherein the cutting blade is a resinoid cutting blade.
Claim 15
Dependent Claim
19 words
The method of claim 2 wherein the back cut is formed by sawing the base surface of the substrate.
Claim 16
Dependent Claim
19 words
The method of claim 2 wherein the back cut is formed by etching the base surface of the substrate.
Claim 17
Independent Claim
81 words
A method of fabricating a buttable edge surface in a substrate having an upper surface and a base surface, the method comprising the steps of: sawing at least one back cut of a predetermined depth in the base surface of the substrate; and cutting at least one section cut through the upper surface with a resinoid cutting blade to intersect the corresponding at least one back cut, the location of the section cut defining the buttable edge surface of the substrate.
Claim 18
Independent Claim
81 words
A method of fabricating a buttable edge surface in a substrate having an upper surface and a base surface, the method comprising the steps of: sawing at least one back cut of a predetermined depth in the base surface of the substrate; and cutting at least one section cut through the upper surface with a resinoid cutting blade to intersect the corresponding at least one back cut, the location of the section cut defining the buttable edge surface of the substrate.
Claim 19
Independent Claim
110 words
A method of fabricating a printhead formed from a linear array of butted subunits comprising the steps of: forming at least one back cut of a predetermined depth in a base surface of a substrate; dividing the substrate into at least two subunits by cutting at least one section cut through an opposite upper surface of the substrate with a resinoid cutting blade to intersect the corresponding at least one back cut, said at least one section cut forming a buttable edge surface in each subunit; and butting the buttable edge surface of each subunit against a corresponding buttable edge surface of an adjacent subunit to form said linear array.
Claim 20
Independent Claim
110 words
A method of fabricating a printhead formed from a linear array of butted subunits comprising the steps of: forming at least one back cut of a predetermined depth in a base surface of a substrate; dividing the substrate into at least two subunits by cutting at least one section cut through an opposite upper surface of the substrate with a resinoid cutting blade to intersect the corresponding at least one back cut, said at least one section cut forming a buttable edge surface in each subunit; and butting the buttable edge surface of each subunit against a corresponding buttable edge surface of an adjacent subunit to form said linear array.
Claim 21
Dependent Claim
19 words
The method of claim 16 wherein the substrate includes a channel substrate bonded on top of a heater substrate.
Claim 22
Dependent Claim
27 words
The method of claim 17 wherein the back cut formed in the base surface of the substrate is located in a base surface of the heater substrate.
Claim 23
Dependent Claim
26 words
The method of claim 18 wherein the predetermined depth of the back cut in the heater substrate is less than the thickness of the heater substrate.
Claim 24
Dependent Claim
21 words
The method of claim 16 wherein the width of the back cut is greater than the width of the section cut.
Claim 25
Dependent Claim
22 words
The method of claim 16 wherein the section cut is perpendicular to the upper surface to form a vertical buttable edge surface.
Claim 26
Dependent Claim
22 words
The method of claim 16 further comprising the step of collecting debris in the back cut while butting adjacent buttable edge surfaces.
Claim 27
Dependent Claim
22 words
The method of claim 16 wherein the back cut provides a clearance for the resinoid cutting blade which cuts the section cut.
Claim 28
Dependent Claim
59 words
The method of claim 16 further comprising the steps of locating the base surface of the substrate on a support surface after sawing the at least one back cut in the substrate; and using the resinoid cutting blade to cut the at least one section cut to a depth that intersects the back cut without intersecting the support surface.
Claim 29
Dependent Claim
51 words
The method of claim 24 wherein the base surface is adhered to the support surface with an adhesive layer, and the back cut provides a clearance for the resinoid cutting blade between the section cut and the adhesive layer to eliminate penetration of the adhesive layer by the resinoid cutting blade.
Claim 30
Dependent Claim
19 words
The method of claim 16 wherein the back cut is formed by sawing the base surface of the substrate.
Claim 31
Dependent Claim
19 words
The method of claim 16 wherein the back cut is formed by etching the base surface of the substrate.
Claim 32
Dependent Claim
23 words
The method of claim 15 wherein substantially no cracking of the upper surface of the substrate occurs during cutting through the upper surface.
Claim 33
Dependent Claim
23 words
The method of claim 16 wherein substantially no cracking of the upper surface of the subsbtrate occurs during cutting through the upper surface.
Claim 34
Dependent Claim
27 words
The method of claim 15 wherein a window cut is formed in the upper surface and aligned with the back cut prior to performing the section cut.
Claim 35
Dependent Claim
27 words
The method of claim 16 wherein a window cut is formed in the upper surface and aligned with the back cut prior to performing the section cut.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-03-18 | 1994-09-17 | 1995-03-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-03-18 | 1998-09-17 | 1999-03-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-03-18 | 2002-09-17 | 2003-03-19 | $7700.00 | Window Closed / Lapsed |