US4987100A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Flexible carrier for an electronic device
Assignee: International Business Machines Corp
•
Filing: 1989-10-30
•
Granted: 1991-01-22
•
Expires: 2009-10-30
Abstract
Abstract The disclosure describes a form of packaging for an electronic device and a method of achieving it in order to overcome the problem of damage because of cycles in environmental temperature. A thin, flexible foil functioning as a carrier of electrically conductive material selected from the group including Invar, copper-Invar-copper and Kovar is coated with a preselected polyimide, on which is formed a thin metallized coating of chromium, in the order to 200 Angstroms, and copper, in the order of 80,000 Angstroms. A predetermined electrical circuit is formed out of this metallized coating by a photolithographic process and is connected electrically to the flexible metal foil by vias through the polyimide coating. At least one electronic device is bonded to the electrical circuit at a predetermined location to operate functionally with the circuit, and both the device and the circuit are connected electrically by the vias to the thin, metal carrier which functions as a power plane for the package.
Inventors
- 👤 Donald G. McBride
- 👤 Theron L. Ellis
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 17:41
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/451; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/05; H05K1/056; H10W70/60; H10W70/67; H10W70/688; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49155
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
75 words
The method of making an electronic package assembly, comprising the steps of: providing a flexible carrier of an electrically conductive material; forming a layer on said flexible carrier of an electrically insulating material; forming vias in said layer of electrically insulating material at predetermined locations through to communicate with said flexible carrier; metallizing said layer of electrically insulating material to include said vias; and forming an electronic circuit from said metallization of said insulating material.
Claim 2
Independent Claim
75 words
The method of making an electronic package assembly, comprising the steps of: providing a flexible carrier of an electrically conductive material; forming a layer on said flexible carrier of an electrically insulating material; forming vias in said layer of electrically insulating material at predetermined locations through to communicate with said flexible carrier; metallizing said layer of electrically insulating material to include said vias; and forming an electronic circuit from said metallization of said insulating material.
Claim 3
Dependent Claim
30 words
The method of making an electronic package assembly as described in claim 1 wherein said step of forming vias in said insulating material includes the steps of masking and etching.
Claim 4
Dependent Claim
24 words
The method of making an electronic package assembly as described in claim 2 wherein said step metallizing said insulating material comprises an evaporation process.
Claim 5
Dependent Claim
34 words
The method of making an electronic package assembly as described in claim 3 wherein said step of forming an electronic circuit from the metallization of said layer of insulating material comprises a photolithographic process.
Claim 6
Dependent Claim
82 words
The method of making an electronic package assembly as described in claim 4 wherein said insulating material includes a polyimide: said metallizing step includes the use of a chromium and copper chromium material with thicknesses in the range of 200 Angstroms and 80,000 Angstroms, respectively; and bonding a electronic device to said electronic circuit using a Controlled Collapse Chip Connection process; so that said flexible carrier is functionally operable as a power plane for said electrical circuit and for said electronic device.
Claim 7
Dependent Claim
46 words
The method of making an electronic package assembly as described in claim 5 including the step of providing stress relief between said flexible carrier and a second level carrier by locating pre-formed bent leads over said electrically insulating layer, where said carrier has been selectively removed.
Claim 8
Dependent Claim
49 words
The method of making an electronic package assembly as described in claim 5 including the step of providing stress relief between said flexible carrier and a second level carrier by locating an elastic cross section of circuitry over said electrically insulating layer, where said carrier has been selectively removed.
Claim 9
Dependent Claim
35 words
The method of making an electronic package assembly as described in claim 1 wherein said step of forming a layer of said flexible carrier includes the forming of said carrier from a material including NI/FE.
Claim 10
Dependent Claim
35 words
The method of making an electronic package assembly as described in claim 1 wherein said step of forming a layer of said flexible carrier includes the forming of said carrier from a material including CU-NI/FE-CU.
Claim 11
Dependent Claim
35 words
The method of making an electronic package assembly as described in claim 1 wherein said step of forming a layer of said flexible carrier includes the forming of said carrier from a material including NI/CO/FE/MG.
Claim 12
Dependent Claim
35 words
The method of making an electronic package assembly as described in claim 1 wherein said step of forming a layer of said flexible carrier includes the forming of said carrier from a material including CU-NI/CO/FE/MG-CU.
References Cited (Backward Citations)
US3118016A
Cited
US3469684A
Cited
US3777220A
Cited
US3969754A
Cited
US4052787A
Cited
US4189524A
Cited
US4420767A
Cited
US4231154A
Cited
US4413308A
Cited
US4396457A
Cited
US4480288A
Cited
US4509096A
Cited
US4489923A
Cited
US4591659A
Cited
US4640866A
Cited
US4716124A
Cited
US4626805A
Cited
US4755417A
Cited
US4810563A
Cited
US4681654A
Cited
US4791239A
Cited
US4791248A
Cited
US4774127A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-01-21 | 1994-07-23 | 1995-01-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-01-21 | 1998-07-23 | 1999-01-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-01-21 | 2002-07-23 | 2003-01-22 | $7700.00 | Window Closed / Lapsed |