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US4774127A Expired / Lapsed US ⏱️ 0.0 years remaining

Fabrication of a multilayer conductive pattern on a dielectric substrate

Assignee: Tektronix Inc
•
Filing: 1987-06-15
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Granted: 1988-09-27
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Expires: 2007-06-15
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Abstract

Abstract A pattern of conductive material is formed on a substrate of dielectric material. The substrate comprises a layer of flexible dielectric material having a layer of dimensionally-stable material adhered to one main face. The pattern is formed on the opposite main face of the layer of flexible dielectric material.

Inventors

  • 👤 John J. Reagan
  • 👤 Peggy J. Parks
  • 👤 Nancy L. Miller
  • 👤 Robert L. Beckman

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-25 03:59
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K1/00; H05K1/02; H05K1/03; H05K1/0393; H05K1/05; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09563; H05K3/0011; H05K3/0017; H05K3/0023; H05K3/10; H05K3/108; H05K3/38; H05K3/388; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/31504; Y10T428/31678; Y10T428/31681; Y10T428/31721

Claims Analysis

Total Claims: 24
Claim 1
Independent Claim 74 words
A method of manufacturing an intermediate structure in the fabrication of a multilayer pattern of conductive material on a substrate of dielectric material, comprising the steps of: (a) providing a substrate of dielectric material having first and second main faces and having a layer of dimensionally-stable material adhered to said first main face, and (b) forming a layer of metal on the second main face of the substrate in accordance with a predetermined pattern.
Claim 2
Independent Claim 74 words
A method of manufacturing an intermediate structure in the fabrication of a multilayer pattern of conductive material on a substrate of dielectric material, comprising the steps of: (a) providing a substrate of dielectric material having first and second main faces and having a layer of dimensionally-stable material adhered to said first main face, and (b) forming a layer of metal on the second main face of the substrate in accordance with a predetermined pattern.
Claim 3
Dependent Claim 21 words
A method according to claim 1, further comprising the step of electrolytically depositing metal on the layer form in step (b).
Claim 4
Dependent Claim 47 words
A method according to claim 1, wherein step (b) is performed by depositing a continuous layer of metal on the second main face and patterning the layer of metal, and the method further comprises the step of electrolytically depositing metal on the layer formed in step (b).
Claim 5
Dependent Claim 22 words
A method according to claim 3, wherein the continuous layer of metal is deposited on the second main face by evaporative deposition.
Claim 6
Dependent Claim 73 words
A method according to claim 1, further comprising the steps of: (c) forming a layer of dielectric material over the layer of metal, the layer of dielectric material having at least one opening through which the layer formed in step (b) is exposed, and (d) forming a second layer of metal over the layer of dielectric material, the second layer of metal extending into the opening and contacting the first-mentioned layer of metal.
Claim 7
Dependent Claim 21 words
A method according to claim 5, further comprising the step of electrolytically depositing metal on the layer formed in step (d).
Claim 8
Dependent Claim 24 words
A method according to claim 6, comprising the step of removing the layer of dimensionally-stable material from the first main face of the substrate.
Claim 9
Independent Claim 73 words
A method of manufacturing an intermediate structure in the fabrication of a multilayer pattern of conductive material on a substrate of dielectric material, comprising the steps of: (a) providing a substrate of dielectric material having first and second main faces, (b) adhering a layer of dimensionallystable material to said first main face, and (c) forming a layer of metal on the second main face of the substrate in accordance with a predetermined pattern.
Claim 10
Independent Claim 73 words
A method of manufacturing an intermediate structure in the fabrication of a multilayer pattern of conductive material on a substrate of dielectric material, comprising the steps of: (a) providing a substrate of dielectric material having first and second main faces, (b) adhering a layer of dimensionallystable material to said first main face, and (c) forming a layer of metal on the second main face of the substrate in accordance with a predetermined pattern.
Claim 11
Dependent Claim 25 words
A method according to claim 8, comprising the step of subsequently removing the layer of dimensionally-stable material from said first main face of the substrate.
Claim 12
Dependent Claim 45 words
In combination, a substrate of dielectric material having first and second main faces and having a layer of dimensionally-stable material adhered to said first main face, and a layer of metal on the second main face of the substrate in accordance with a predetermined pattern.
Claim 13
Dependent Claim 45 words
In combination, a substrate of dielectric material having first and second main faces and having a layer of dimensionally-stable material adhered to said first main face, and a layer of metal on the second main face of the substrate in accordance with a predetermined pattern.
Claim 14
Dependent Claim 22 words
A substrate of dielectric material having a multilayer pattern of conductive material thereon, manufactured by a method in accordance with claim 1.
Claim 15
Independent Claim 140 words
A method of manufacturing a structure comprising a substrate of dielectric material and a multilayer pattern of conductive material attached thereto, comprising the steps of: (a) providing a substrate of dielectric material having first and second main faces and having a layer of dimensionally-stable material adhered to said first main face and also having a layer of metal on the second main face of the substrate in accordance with a predetermined pattern, (b) forming a layer of dielectric material over the layer of metal on the second main face of the substrate, the layer of dielectric material having at least one opening through which the layer of metal is exposed, and (c) forming a second layer of metal over the dielectric material, the metal of the second layer extending into the opening and contacting the metal of the first layer.
Claim 16
Independent Claim 140 words
A method of manufacturing a structure comprising a substrate of dielectric material and a multilayer pattern of conductive material attached thereto, comprising the steps of: (a) providing a substrate of dielectric material having first and second main faces and having a layer of dimensionally-stable material adhered to said first main face and also having a layer of metal on the second main face of the substrate in accordance with a predetermined pattern, (b) forming a layer of dielectric material over the layer of metal on the second main face of the substrate, the layer of dielectric material having at least one opening through which the layer of metal is exposed, and (c) forming a second layer of metal over the dielectric material, the metal of the second layer extending into the opening and contacting the metal of the first layer.
Claim 17
Independent Claim 107 words
A method of manufacturing an article comprising a sheet of material that lacks dimensional stability, the sheet having a registration feature and being acted upon at a location that is determined by reference to the location of the registration feature, said method comprising the steps of: providing a sheet of a first material that lacks dimensional stability, the sheet of the first material having a sheet of a second, dimensionally-stable material adhered to one main face thereof and also having a registration feature, and acting upon the sheet of the first material at a location that is determined by reference to the location of the registration feature.
Claim 18
Independent Claim 107 words
A method of manufacturing an article comprising a sheet of material that lacks dimensional stability, the sheet having a registration feature and being acted upon at a location that is determined by reference to the location of the registration feature, said method comprising the steps of: providing a sheet of a first material that lacks dimensional stability, the sheet of the first material having a sheet of a second, dimensionally-stable material adhered to one main face thereof and also having a registration feature, and acting upon the sheet of the first material at a location that is determined by reference to the location of the registration feature.
Claim 19
Independent Claim 93 words
A method of manufacturing a flexible printed circuit board having a multilayer pattern of conductive material on a substrate of dielectric material comprising the steps of: first providing the substrate of dielectric material having first and second main faces with a layer of dimensionally stable material adhered to the first main face to maintain dimensional stability of the flexible printed circuit board during the manufacturing process; then forming the multilayer pattern of conductive material on the second main face; and finally removing the layer of dimensionally stable material from the first main face.
Claim 20
Independent Claim 93 words
A method of manufacturing a flexible printed circuit board having a multilayer pattern of conductive material on a substrate of dielectric material comprising the steps of: first providing the substrate of dielectric material having first and second main faces with a layer of dimensionally stable material adhered to the first main face to maintain dimensional stability of the flexible printed circuit board during the manufacturing process; then forming the multilayer pattern of conductive material on the second main face; and finally removing the layer of dimensionally stable material from the first main face.
Claim 21
Dependent Claim 14 words
A flexible printed circuit board manufactured in accordance with the method of claim 14.
Claim 22
Independent Claim 92 words
A method of manufacturing a flexible printed circuit board having a multilayer pattern of conductive material on a substrate of dielectric material comprising the steps of: first providing the substrate of dielectric material having first and second main faces with a layer of dimensionally stable material adhered to the first main face to maintain dimensional stability of the flexible printed circuit board during the manufacturing process; then forming the multilayer pattern of conductive material on the second main face; and finally forming the layer of dimensionally stable material into a circuit pattern.
Claim 23
Independent Claim 92 words
A method of manufacturing a flexible printed circuit board having a multilayer pattern of conductive material on a substrate of dielectric material comprising the steps of: first providing the substrate of dielectric material having first and second main faces with a layer of dimensionally stable material adhered to the first main face to maintain dimensional stability of the flexible printed circuit board during the manufacturing process; then forming the multilayer pattern of conductive material on the second main face; and finally forming the layer of dimensionally stable material into a circuit pattern.
Claim 24
Dependent Claim 14 words
A flexible printed circuit board manufactured in accordance with the method of claim 16.

References Cited (Backward Citations)

US3936575A Cited
US3985928A Cited
US3934067A Cited
US3955024A Cited
US4201616A Cited
US4671984A Cited
US4675246A Cited
US4680220A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1991-09-27 1992-03-28 1992-09-27 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1995-09-27 1996-03-28 1996-09-27 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1999-09-27 2000-03-28 2000-09-27 $7700.00 Window Closed / Lapsed

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