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US4983250A
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Method of laser patterning an electrical interconnect
Assignee: Microelectronics and Computer Technology Corp
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Filing: 1989-06-16
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Granted: 1991-01-08
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Expires: 2009-06-16
Abstract
Abstract Forming an electrical interconnect by applying an adhesion layer over a substrate, applying an electrical conductor layer over the adhesion layer, and applying a reacting layer over the electrical conductor layer. A laser beam is directed over the reacting layer in a desired pattern to interdiffuse the reacting and conductor layers and form a reaction product. The reaction product is used as an etch mask for etching away the reacting layer, the conductor layer, and the adhesion layer outside of the reaction product.
Inventors
- 👤 Ju-Don T. Pan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 20:05
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/01; H10W20/031; H05; H05K; H05K3/00; H05K3/02; H05K3/06; H05K3/061; H05K3/062; H10P; H10P14/00; H10P14/40; H10P14/412; H05K2203/00; H05K2203/10; H05K2203/107; H05K3/38; H05K3/388; H05K3/46; H05K3/4644; H05K3/467
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
96 words
A method of forming an electrical interconnect comprising, applying an adhesion layer over a substrate, applying an electrical conductor layer over the adhesion layer, applying a reacting layer over the electrical conductor layer, directing a laser beam over the reacting layer in a desired pattern inducing the reacting layer and the conductor layer to interdiffuse and form a reaction product of the reacting and conductor layers, and applying an etchant after the interdiffusion such that the reacting layer etches at a different rate than the reaction product, so that the desired conductor pattern can be formed.
Claim 2
Independent Claim
96 words
A method of forming an electrical interconnect comprising, applying an adhesion layer over a substrate, applying an electrical conductor layer over the adhesion layer, applying a reacting layer over the electrical conductor layer, directing a laser beam over the reacting layer in a desired pattern inducing the reacting layer and the conductor layer to interdiffuse and form a reaction product of the reacting and conductor layers, and applying an etchant after the interdiffusion such that the reacting layer etches at a different rate than the reaction product, so that the desired conductor pattern can be formed.
Claim 3
Dependent Claim
19 words
The method of claim 1 including, applying a dielectric layer to the substrate prior to applying the adhesion layer.
Claim 4
Dependent Claim
31 words
The method of claim 1 Wherein the laser beam is applied in pulses to induce local interdiffusion between the reacting and the conductor layers without harming the other layers with heat.
Claim 5
Dependent Claim
20 words
The method of claim 1 wherein the etching of the reacting, conductor, and adhesion layers is performed separately and sequentially.
Claim 6
Dependent Claim
20 words
The method of claim 1 wherein the reacting layer and the top surface region of the conductor layer are interdiffused.
Claim 7
Dependent Claim
127 words
The method of claim 1 including, applying a dielectric layer over the substrate and resultant reaction product, and applying a second adhesion layer over the dielectric layer, applying a second electrical conductor layer over the second adhesion layer, applying a second reacting layer over the second electrical conductor layer, directing a laser beam over the second reacting layer in a desired pattern inducing the second reacting and second conductor layers to interdiffuse and form a second reaction product of the second reacting and second conductor layers, and applying an etchant after the interdiffusion of the second reacting and second conductor layers such that the second reacting layer etches at a different rate than the second reaction product, so that the desired second conductor pattern can be formed.
Claim 8
Dependent Claim
12 words
The method in claim 6 including, patterning the dielectric layer with vias.
Claim 9
Independent Claim
89 words
A method of forming an electrical interconnect comprising, applying an adhesive electrical conductor layer over the substrate, applying a reacting layer over the electrical conductor layer, directing a laser beam over the reacting layer in a desired pattern inducing the reacting layer and the conductor layer to interdiffuse and form a reaction product of the reacting and conductor layers, and applying an etchant after the interdiffusion such that the reacting layer etches at a different rate than the reaction product, so that the desired conductor pattern can be formed.
Claim 10
Independent Claim
89 words
A method of forming an electrical interconnect comprising, applying an adhesive electrical conductor layer over the substrate, applying a reacting layer over the electrical conductor layer, directing a laser beam over the reacting layer in a desired pattern inducing the reacting layer and the conductor layer to interdiffuse and form a reaction product of the reacting and conductor layers, and applying an etchant after the interdiffusion such that the reacting layer etches at a different rate than the reaction product, so that the desired conductor pattern can be formed.
Claim 11
Dependent Claim
21 words
The method of claim 8 including, applying a dielectric layer to the substrate prior to applying the adhesive electrical conductor layer.
Claim 12
Dependent Claim
33 words
The method of claim 8 wherein the laser beam is applied in pulses to induce local interdiffusion between the reacting and the adhesive electrical conductor layers without harming the other layers with heat.
Claim 13
Dependent Claim
21 words
The method of claim 8 wherein the etching of the reacting and adhesive electrical conductor layers is performed separately and sequentially.
Claim 14
Dependent Claim
22 words
The method of claim 8 wherein the reacting layer and the top surface region of the adhesive electrical conductor layer are interdiffused.
Claim 15
Dependent Claim
117 words
The method of claim 8 including, applying a dielectric layer over the substrate and resultant reaction product, and applying a second electrical conductor layer over the dielectric layer, applying a second reacting layer over the second electrical conductor layer, directing a laser beam over the second reacting layer in a desired pattern inducing the second reacting and second conductor layers to interdiffuse and form a second reaction product of the second reacting and second conductor layers, and applying an etchant after the interdiffusion of the second reacting and second conductor layers such that the second reacting layer etches at a different rate than the second reaction product so that the desired second conductor pattern can be formed.
Claim 16
Dependent Claim
12 words
The method of claim 13 including, patterning the dielectric layer with vias.
Claim 17
Dependent Claim
21 words
The method of claim 13 including, applying a second adhesive layer between the dielectric layer and the second electrical conductor layer.
Claim 18
Dependent Claim
12 words
The method of claim 15 including, patterning the dielectric layer with vias.
Claim 19
Dependent Claim
21 words
The method of claim 8 wherein the reacting layer is selected from a group consisting of chromium, titanium, nickel, and silicon.
Claim 20
Dependent Claim
13 words
The method of claim 17 wherein the adhesive electrical layer consists of aluminum.
Claim 21
Independent Claim
132 words
A method of forming an electrical interconnect comprising, applying a dielectric layer over a substrate, applying an adhesion layer selected from a group consisting of chromium, titanium, nickel, tantalum, titanium-tungsten, and nichrome over the dielectric, applying an electrical conductor layer selected from a group consisting of copper, gold, aluminum, silver and nickel over the adhesion layer, applying a reacting layer Selected from a group consisting of chromium, titanium, nickel, and silicon over the electrical layer, directing a laser beam over the reacting and conductor layers to interdiffuse and form a reaction product of the reacting and conductor layers, and etching away the reacting layer, the conductor layer and the adhesion layer outside of the regions masked by reaction product, separately and sequentially, leaving reaction product in the desired pattern on the dielectric.
Claim 22
Independent Claim
132 words
A method of forming an electrical interconnect comprising, applying a dielectric layer over a substrate, applying an adhesion layer selected from a group consisting of chromium, titanium, nickel, tantalum, titanium-tungsten, and nichrome over the dielectric, applying an electrical conductor layer selected from a group consisting of copper, gold, aluminum, silver and nickel over the adhesion layer, applying a reacting layer Selected from a group consisting of chromium, titanium, nickel, and silicon over the electrical layer, directing a laser beam over the reacting and conductor layers to interdiffuse and form a reaction product of the reacting and conductor layers, and etching away the reacting layer, the conductor layer and the adhesion layer outside of the regions masked by reaction product, separately and sequentially, leaving reaction product in the desired pattern on the dielectric.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-01-07 | 1994-07-09 | 1995-01-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-01-07 | 1998-07-09 | 1999-01-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-01-07 | 2002-07-09 | 2003-01-08 | $7700.00 | Window Closed / Lapsed |