Patent US4942190A successfully refreshed from Google Patents.
US4942190A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thermosetting insulating resin paste
Assignee: Mitsubishi Electric Corp
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Filing: 1988-10-21
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Granted: 1990-07-17
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Expires: 2008-10-21
Abstract
Abstract A thermosetting insulating resin paste including 100 parts by weight of an epoxy resin containing a diglycidyl type liquid epoxy resin as a main component and based on the parts by weight of the epoxy resin, 0.5 to 10 parts by weight of dicyandiamide as a setting agent. It further contains 1 to 15 parts by weight of a phenoxy resin, 0.1 to 8 parts by weight of 2-phenyl-4-methyl-5-hydroxymethylimidazole and/or 2-phenyl-4,5-dihydroxymethylimidazole as a setting accelerator as well as 50 to 200 parts by weight of a thermally conductive filler. This insulating resin paste exhibits a long pot life and can be set in a short time at a low temperature without generating any voids during the setting, so that it enables the die bonding process in the production of semiconductor devices to be performed as part of the production line. It also allows a smaller device to be used in this process.
Inventors
- 👤 Masakazu Murayama
- 👤 Ken Kimura
- 👤 Hiroyuki Nakajima
- 👤 Yasuko Ohno
- 👤 Eiki Zidai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 15:17
CPC Classifications
C; C08; C08L; C08L63/00; C08G; C08G59/00; C08G59/18; C08G59/68; C08G59/686; C08K; C08K3/00; C08K3/01; C08K3/013; C08K5/00; C08K5/16; C08K5/34; C08K5/3442; C08K5/3445
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
87 words
A thermosetting insulting resin paste comprising: 100 parts by weight of an epoxy resin containing a diglycidyl liquid epoxy resin as a main component; and based on the parts by weight of said epoxy resin; 0.5 to 10 parts by weight of dicyandiamide as a setting agent; 1 to 15 parts by weight of a phenoxy resin; 0.1 to 8 parts by weight of at least one of 2-phenyl-4-methyl-5-dihydroxymethylimidazole and 2-phenyl-4,5-dihydroxymethylimidazole as a setting accelerator; and 50 to 200 parts by weight of a thermally conductive filler.
Claim 2
Dependent Claim
87 words
A thermosetting insulting resin paste comprising: 100 parts by weight of an epoxy resin containing a diglycidyl liquid epoxy resin as a main component; and based on the parts by weight of said epoxy resin; 0.5 to 10 parts by weight of dicyandiamide as a setting agent; 1 to 15 parts by weight of a phenoxy resin; 0.1 to 8 parts by weight of at least one of 2-phenyl-4-methyl-5-dihydroxymethylimidazole and 2-phenyl-4,5-dihydroxymethylimidazole as a setting accelerator; and 50 to 200 parts by weight of a thermally conductive filler.
Claim 3
Dependent Claim
27 words
A resin paste as claimed in claim 1 wherein the content of said diglycidyl liquid epoxy resin is 70 wt. % or more of the epoxy resin.
Claim 4
Dependent Claim
27 words
A resin paste as claimed in claim 1 wherein the content of said diglycidyl liquid epoxy resin is 80 wt. % or more of the epoxy resin.
Claim 5
Dependent Claim
44 words
A resin paste as claimed in claim 1 wherein said diglycidyl type liquid epoxy resin comprises at least one member selected from the group consisting of diglycidyl bisphenol A, diglycidyl bisphenol F, diglycidyl bisphenol S, 1,2-cyclohexane dicarboxylic acid diglycidyl ester, and polyglycol diglycidyl ether.
Claim 6
Dependent Claim
24 words
A resin paste as claimed in claim 1 wherein said epoxy resin contains no more than 20 wt. % of an alicyclic epoxy resin.
Claim 7
Dependent Claim
28 words
A resin paste as claimed in claim 1 wherein the mixed amount of said dicyandiamide which serves as the setting agent is 1 to 5 parts by weight.
Claim 8
Dependent Claim
27 words
A resin paste as claimed in claim 1 wherein the average particle diameter of the dicyandiamide which serves as the setting agent is 0.5 to 20 μm.
Claim 9
Dependent Claim
23 words
A resin paste as claimed in claim 1 wherein the mixed amount of said setting accelerator is 1 to 5 parts by weight.
Claim 10
Dependent Claim
24 words
A resin paste as claimed in claim 1 wherein the mixed amount of said thermally conductive filler is 80 to 150 parts by weight.
Claim 11
Dependent Claim
23 words
A resin paste as claimed in claim 1 wherein the average particle diameter of said thermally conductive filler is 20 μm or less.
Claim 12
Dependent Claim
23 words
A resin paste as claimed in claim 1 wherein the average particle diameter of said thermally conductive filler is 0.1 to 10 μm.
Claim 13
Dependent Claim
34 words
A resin paste as claimed in claim 1 wherein said thermally conductive filler consists of pulverized ceramics comprising oxides of magnesium, aluminum, silicon or titanium or boron nitride, boron carbide, silicon carbide, aluminum nitride.
Claim 14
Dependent Claim
18 words
A resin paste as claimed in claim 1 wherein said thermally conductive filler consists of pulverized carbon black.
Claim 15
Dependent Claim
22 words
A resin paste as claimed in claim 1 wherein said thermally conductive filler consists of pulverized metal comprising nickel, aluminum or tin.
Claim 16
Dependent Claim
22 words
A resin paste as claimed in claim 1 wherein the average molecular weight of said phenoxy resin ranges from 15,000 to 60,000.
Claim 17
Dependent Claim
26 words
A resin paste as claimed in claim 1 wherein said diglycidyl liquid epoxy resin has a hydrolytic halogen atom content of no more than 600 ppm.
Claim 18
Dependent Claim
28 words
A resin paste as claimed in claim 5 wherein said alicyclic epoxy resin includes diesters of aliphatic dibasic acids, epoxy cyclohexylmethylepoxycyclohexane carboxylic acid ester or vinyl cyclohexene dioxide.
Claim 19
Dependent Claim
24 words
A resin paste as claimed in claim 17 wherein said diesters of aliphatic dibasic acids include bis(epoxy cyclohexylmethyl) esters of adipic or succinic acid.
Claim 20
Dependent Claim
26 words
A resin paste as claimed in claim 1 wherein said thermally conductive filler comprises a material having a thermal conductivity of at least 2×10 -3 cal/cm.sec.deg.
Claim 21
Dependent Claim
25 words
A resin paste as claimed in claim 1 wherein said resin paste sets at a temperature of 150° C. to 180° C. within two minutes.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-07-16 | 1994-01-15 | 1994-07-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-07-16 | 1998-01-15 | 1998-07-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-07-16 | 2002-01-15 | 2002-07-17 | $7700.00 | Window Closed / Lapsed |