US4663190A
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Process for producing semiconductor element
Assignee: Resonac Corp
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Filing: 1984-03-08
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Granted: 1987-05-05
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Expires: 2004-03-08
Abstract
Abstract A semiconductor element excellent in moisture resistance and thermal fatigue properties can be produced by forming a seal coating on at least part of the surface of semiconductor material, said seal coating being a cured resin obtained from an epoxy resin composition comprising (i) an epoxy resin, (ii) an organic dibasic acid dihydrazide and (iii) an imidazole.
Inventors
- 👤 Koei Fujita
- 👤 Yuji Aimono
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 20:39
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W74/47; C; C08; C08G; C08G59/00; C08G59/18; C08G59/40; C08G59/4007; C08G59/4014; C08G59/4035; C08G59/50; C08G59/56; H10W72/00; H10W74/473; H10W76/00; H10W76/40; H10W76/42; H10W76/47
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
120 words
A process for producing a semiconductor element which comprises forming a seal coating on at least part of the surface of a body of semiconductor material, said seal coating being a cured resin obtained from an epoxy resin composition comprising (i) an epoxy resin having at least one epoxy group in its molecule, (ii) an organic dibasic acid dihydrazide in an amount of 3 to 20 moles per 100 moles of the epoxy compound, and (iii) an imidazole of the formula: ##STR3## wherein R 1 is hydrogen, a methyl, ethyl or a hydroxymethyl group; and R 2 is a methyl, ethyl or a phenyl group, in an amount of 1 to 7 moles per 100 moles of the epoxy resin.
Claim 2
Dependent Claim
120 words
A process for producing a semiconductor element which comprises forming a seal coating on at least part of the surface of a body of semiconductor material, said seal coating being a cured resin obtained from an epoxy resin composition comprising (i) an epoxy resin having at least one epoxy group in its molecule, (ii) an organic dibasic acid dihydrazide in an amount of 3 to 20 moles per 100 moles of the epoxy compound, and (iii) an imidazole of the formula: ##STR3## wherein R 1 is hydrogen, a methyl, ethyl or a hydroxymethyl group; and R 2 is a methyl, ethyl or a phenyl group, in an amount of 1 to 7 moles per 100 moles of the epoxy resin.
Claim 3
Dependent Claim
16 words
A process according to claim 1, wherein the epoxy resin is an epichlorhydrin-bisphenol type epoxy resin.
Claim 4
Dependent Claim
16 words
A process according to claim 1, wherein the epoxy resin is a novolac type epoxy resin.
Claim 5
Dependent Claim
33 words
A process according to claim 1, wherein the organic dibasic adid dihydrazide is obtained from a dibasic acid selected from the group consisting of succinic acid, malonic acid, adipic acid and isophthalic acid.
Claim 6
Dependent Claim
15 words
A process according to claim 1, wherein the imidazole is 2-ethyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole or 2-ethyl-4,5-dihydroxymethylimidazole.
Claim 7
Dependent Claim
23 words
A process according to claim 1, wherein the semiconductor material is a diode, a thyristor, a power transistor or a metal-oxide semiconductor transistor.
Claim 8
Dependent Claim
117 words
A semiconductor element comprising a body of semiconductor material provided with a layer of cured resin over at least part of the surface thereof, said cured resin having been obtained from an epoxy resin composition comprising (i) an epoxy resin having at least one epoxy group in its molecule, (ii) an organic dibasic acid dihydrazide in an amount of 3 to 20 moles per 100 moles of the epoxy resin, and (iii) an imidazole of the formula: ##STR4## wherein R 1 is hydrogen, a methyl, ethyl or a hydroxymethyl group; and R 2 is a lower methyl, ethyl or a phenyl group, in an amount of 1 to 7 moles per 100 moles of the epoxy resin.
Claim 9
Dependent Claim
117 words
A semiconductor element comprising a body of semiconductor material provided with a layer of cured resin over at least part of the surface thereof, said cured resin having been obtained from an epoxy resin composition comprising (i) an epoxy resin having at least one epoxy group in its molecule, (ii) an organic dibasic acid dihydrazide in an amount of 3 to 20 moles per 100 moles of the epoxy resin, and (iii) an imidazole of the formula: ##STR4## wherein R 1 is hydrogen, a methyl, ethyl or a hydroxymethyl group; and R 2 is a lower methyl, ethyl or a phenyl group, in an amount of 1 to 7 moles per 100 moles of the epoxy resin.
Claim 10
Dependent Claim
85 words
An epoxy resin composition comprising (i) an epoxy resin having at least one epoxy group in its molecule, (ii) an organic dibasic acid dihydrazide in an amount of 3 to 20 moles per 100 moles of the epoxy resin, and (iii) an imidazole of the formula: ##STR5## wherein R 1 is a hydrogen, a methyl, ethyl or a hydroxymethyl group; and R 2 is methyl, ethyl or a phenyl group, in an amount of 1 to 7 moles per 100 moles of the epoxy resin.
Claim 11
Dependent Claim
85 words
An epoxy resin composition comprising (i) an epoxy resin having at least one epoxy group in its molecule, (ii) an organic dibasic acid dihydrazide in an amount of 3 to 20 moles per 100 moles of the epoxy resin, and (iii) an imidazole of the formula: ##STR5## wherein R 1 is a hydrogen, a methyl, ethyl or a hydroxymethyl group; and R 2 is methyl, ethyl or a phenyl group, in an amount of 1 to 7 moles per 100 moles of the epoxy resin.
Claim 12
Dependent Claim
15 words
A composition according to claim 8, wherein the epoxy resin is an epichlorhydrin-bisphenol epoxy resin.
Claim 13
Dependent Claim
16 words
A composition according to claim 8, wherein the epoxy resin is a novolac type epoxy resin.
Claim 14
Dependent Claim
33 words
A composition according to claim 8, wherein the organic dibasic acid dihydrazide is obtained from a dibasic acid selected from the group consisting of succinic acid, malonic acid, adipic acid and isophthalic acid.
Claim 15
Dependent Claim
15 words
A composition according to claim 8, wherein the imidazole is 2-ethyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole or 2-ethyl-4,5-dihydroxymethylimidazole.
Claim 16
Dependent Claim
24 words
A semiconductor element according to claim 7, wherein the semiconductor material is a diode, a thyristor, a power transistor or a metal-oxide semiconductor transistor.
Claim 17
Dependent Claim
19 words
A process according to claim 1, wherein R 1 is a methyl group and R 2 is phenyl group.
Claim 18
Dependent Claim
21 words
A process according to claim 2, wherein the epichlorohydrin-bisphenol epoxy resin is obtained from bisphenol A or bisphenol F and epichlorohydrin.
Claim 19
Dependent Claim
25 words
A process according to claim 3, wherein the novolac epoxy resin is obtained from a phenol novolac resin or a cresol novolac resin and epichlorohydrin.
Claim 20
Dependent Claim
21 words
A semiconductor element according to claim 7, wherein R 1 is a methyl group and R 2 is a phenyl group.
Claim 21
Dependent Claim
20 words
A composition according to claim 8, wherein R 1 is a methyl group and R 2 is a phenyl group.
Claim 22
Dependent Claim
21 words
A composition according to claim 9, wherein the epichlorohydrin-bisphenol epoxy resin is obtained from bisphenol A or bisphenol F and epichlorohydrin.
Claim 23
Dependent Claim
25 words
A composition according to claim 10, wherein the novolac epoxy resin is obtained from a phenol novolac resin or a cresol novolac resin and epichlorohydrin.
References Cited (Backward Citations)
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1990-05-04 | 1990-11-03 | 1991-05-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-05-04 | 1994-11-03 | 1995-05-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-05-04 | 1998-11-03 | 1999-05-05 | $7700.00 | Window Closed / Lapsed |