One-pack adhesive

Abstract

Abstract PURPOSE:To provide a one-pack adhesive which has excellent adhesion, hardly causes blistering and is freed from the problem of sagging, by incorporating a highly heat-conductive inorg. filler and a lowly heat-conductive inorg. filler in an epoxy resin. CONSTITUTION:A one-pack adhesive contains an epoxy resin (A), a hardener (B) such as a 2-methylimidazole / isocyanuric acid adduct, a highly heat-conductive inorg. filler (C) such as silica and a lowly heat-conductive inorg. filler (D) such as CaCO3 as main ingredients. When the filler C alone is used, oil absorption is so low that no appropriate thixotropy can be exhibited and sagging during curing is liable to occur, while when the filler D alone is used, oil absorption is so high that the workability is reduced because of high thixotropy and a small quantity of air is blistered by the curing heat of the adhesive because of low heat conductivity. By using the fillers C and D in combination, the above disadvantages can be eliminated. It is necessary that 20-80wt% (based on the total quantity of the fillers) filler C is incorporated.

Inventors

• 👤 Teru Okunoyama
• 👤 奥野山　輝
• 👤 Hiroshi Inaba
• 👤 稲葉　洋志

Bibliographic Details