Method of making a semiconductor-insulator-semiconductor structure

Claim 1

A process for fabricating a semiconductor device, said semiconductor device comprising semiconductor substrate and on top of said semiconductor substrate, alternating layers of insulating layer and semiconductor layer in which 1. The semiconductor substrate comprises at least one Group III-V semiconductor compound; 2. The insulating layer comprises epitaxial insulating film of cubic Group II fluoride which is substantially twin-free and substantially single crystal, and the cubic Group II fluoride is selected from the group consisting of Ca x Sr 1-x F 2 and Ba y Sr 1-y F 2 where x and y vary from 0 to 1; and 3. The semiconductor layer comprises an epitaxial semiconductor film of at least one Group III-V semiconductor compound, said semiconductor film being substantially twin-free and substantially single crystal said process comprising the steps of: (a) introducing the semiconductor substrate into a vacuum chamber and reducing the background pressure to a subatmosphere pressure, (b) exposing the semiconductor substrate surface to a molecular beam cleaning procedure, (c) directing at least one molecular beam of the cubic Group II fluoride upon the semiconductor surface at a certain rate while maintaining the semiconductor surface at a certain growth temperature range so as to form an epitaxial insulating layer, (d) directing molecular beams comprising the elements of a III-V compound semiconductor onto the surface of the insulating layer; characterized in that (e) the molecular beam cleaning procedure is carried out in the temperature range from 400 to 700 degrees C. and a molecular beam of the Group V element is maintained on the surface of the semiconductor material so as to maintain the stoichiometry of the surface while removing any impurity layers on the semiconductor material surface, and (f) the growth temperature range is the temperature range 150 degrees C. below the decomposition temperature of the III-V semiconductor and the growth rate is at least 250 Angstroms per hour so as to grow a substantially single crystal, twin-free layer of cubic Group II fluoride on part of the surface of the III-V semiconductor and in which immediately before step (a), molecular beam cleaning procedure is carried out with a semiconductor surface temperature of approximately 600±50 degrees C. under an arsenic molecular beam.