Patent US4908736A successfully refreshed from Google Patents.
US4908736A
Expired / Lapsed
US
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Self packaging chip mount
Assignee: Intersil Corp
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Filing: 1988-08-23
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Granted: 1990-03-13
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Expires: 2008-08-23
Abstract
Abstract A method of self packaging an integrated circuit chip (10) on a printed circuit board (14) where conductive leads (16) form an electrical connection with interconnect leads (12) on the printed circuit board (14). A centering frame (22) placed on the printed circuit board serves to align the leads (12 and 16). A cooling cap (34) which dissipates heat from the integrated circuit chip (10) is placed over the centering frame (22) and integrated circuit chip (10). In one embodiment, the leads (12 and 16) form a pressure fit and the cooling cap (34) forces the pressure-fit electrical connections. In another embodiment, the leads (12 and 16) make rubbing contact with each other.
Inventors
- 👤 Harold F. Webster
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:40
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/325; H10W72/00; H10W72/071; H10W72/0711; H10W72/072; H10W72/07231; H10W72/07236
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
77 words
An integrated circuit chip assembly for use in a self packaging chip mount, comprising: an integrated circuit chip, said integrated circuit chip having side surfaces and terminals on a bottom side; a compliant backing member disposed about, and in contact with, a periphery of said bottom and side surfaces of said integrated circuit chip; and conductive leads secured to said terminals and extending over said compliant backing member on both the said bottom side and side surfaces.
Claim 2
Dependent Claim
77 words
An integrated circuit chip assembly for use in a self packaging chip mount, comprising: an integrated circuit chip, said integrated circuit chip having side surfaces and terminals on a bottom side; a compliant backing member disposed about, and in contact with, a periphery of said bottom and side surfaces of said integrated circuit chip; and conductive leads secured to said terminals and extending over said compliant backing member on both the said bottom side and side surfaces.
Claim 3
Dependent Claim
21 words
An integrated circuit chip assembly as recited in claim 1 wherein said conductive leads are cemented to said compliant backing member.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-03-12 | 1993-09-11 | 1994-03-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-03-12 | 1997-09-11 | 1998-03-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-03-12 | 2001-09-11 | 2002-03-13 | $7700.00 | Window Closed / Lapsed |