Patent US4897508A successfully refreshed from Google Patents.
US4897508A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Metal electronic package
Assignee: Advanced Technology Interconnect Inc
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Filing: 1988-02-10
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Granted: 1990-01-30
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Expires: 2008-02-10
Abstract
Abstract A metal package for housing an electronic device wherein the electronic device is attached to a severable die attach pad. The die attach pad is bonded to the base of the package with a thermally conductive medium. The base is bonded to the die attach pad and to the leadframe at the same time to reduce the thermal degradation of the sealants. In other embodiments, apertures are provided in the base component to enhance cooling of the electronic device and in the cover component to vent reaction by-products.
Inventors
- 👤 Deepak Mahulikar
- 👤 Sheldon H. Butt
- 👤 Jacob Crane
- 👤 Anthony M. Pasqualoni
- 👤 Edward F. Smith
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 11:14
CPC Classifications
H; H10; H10W; H10W95/00; H10W40/00; H10W40/10; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H10W40/70; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W76/60; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/681; H10W70/682; H10W70/685; H10W72/00; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/381; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/5525; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 40
Claim 1
Independent Claim
130 words
A process for assembling a package containing an enclosure to house an electronic device, comprising the steps of: providing an electrically conductive leadframe, said leadframe having first and second surfaces and comprised of a plurality of lead fingers disposed about a centrally positioned die attach pad, said electronic device bonded to said die attach pad and electrically connected to said leads; providing a first, second and third bonding means; providing a base component; providing a cover component; bonding said base component to said first surface of said leadframe with said first bonding means and at essentially the same time bonding said base component to said die attach pad with said third bonding means; and bonding said cover component to said second surface of said leadframe with said second bonding means.
Claim 2
Dependent Claim
130 words
A process for assembling a package containing an enclosure to house an electronic device, comprising the steps of: providing an electrically conductive leadframe, said leadframe having first and second surfaces and comprised of a plurality of lead fingers disposed about a centrally positioned die attach pad, said electronic device bonded to said die attach pad and electrically connected to said leads; providing a first, second and third bonding means; providing a base component; providing a cover component; bonding said base component to said first surface of said leadframe with said first bonding means and at essentially the same time bonding said base component to said die attach pad with said third bonding means; and bonding said cover component to said second surface of said leadframe with said second bonding means.
Claim 3
Dependent Claim
26 words
The process of claim 1 including severing said die attach pad from said leadframe prior to the step of bonding said cover component to said leadframe.
Claim 4
Dependent Claim
13 words
The process of claim 2 providing said third bonding means is thermally conductive.
Claim 5
Dependent Claim
16 words
The process of claim 3 further providing said third bonding means is a silver filled epoxy.
Claim 6
Dependent Claim
20 words
The process of claim 1 providing said first and second sealing means are either sealing glass is or polymer adhesives.
Claim 7
Dependent Claim
15 words
The process of claim 5 wherein said first and second sealing means are essentially identical.
Claim 8
Dependent Claim
16 words
The process of claim 6 including said first and second sealing means are heat curable epoxies.
Claim 9
Dependent Claim
47 words
The process of claim 7 providing said cover component is bonded to said second surface of said leadframe by said second bonding means at essentially the same time as said base component is bonded to said first surface of said leadframe and to said die attach pad.
Claim 10
Dependent Claim
44 words
The process of claim 8 including the additional step of providing a first aperture in said base component prior to bonding said die attach pad, said first aperture sized smaller than said die attach pad so said die attach pad seals said first aperture.
Claim 11
Dependent Claim
33 words
The process of claim 9 providing said third sealing means is ring shaped and positioned about the edge of said first aperture and disposed between said base component and said die attach pad.
Claim 12
Dependent Claim
32 words
The process of claim 1 including providing a second aperture in said cover component and sealing said second aperture subsequent to sealing said cover component to said second surface of said leadframe.
Claim 13
Dependent Claim
24 words
The process of claim 11 including introducing a thermally conductive medium to said enclosure through said second aperture prior to sealing said second aperture.
Claim 14
Dependent Claim
20 words
The process of claim 12 including selecting said thermally conductive medium to be an electrically nonconductive gas, liquid or powder.
Claim 15
Dependent Claim
16 words
The process of claim 11 including sealing said second aperture with an epoxy or solder plug.
Claim 16
Dependent Claim
25 words
The process of claim 14 including sealing said second aperture with a solder plug, said solder comprised essentially of an alloy of lead and tin.
Claim 17
Dependent Claim
125 words
A package containing an enclosure for housing an electronic device, comprising: a base component containing a first aperture; a cover component; a leadframe with first and second opposing sides disposed between said base component and said cover component, said leadframe containing a plurality of leads disposed about a centrally positioned die attach pad, said die attach pad positioned to seal said first aperture and adapted to support said electronic device, said electronic device electrically connected to said leads; a first bonding means to seal said base component to said first side of said leadframe; a second bonding means to seal said cover component to said second side of said leadframe; and a third bonding means to seal said die attach pad to said base component.
Claim 18
Dependent Claim
125 words
A package containing an enclosure for housing an electronic device, comprising: a base component containing a first aperture; a cover component; a leadframe with first and second opposing sides disposed between said base component and said cover component, said leadframe containing a plurality of leads disposed about a centrally positioned die attach pad, said die attach pad positioned to seal said first aperture and adapted to support said electronic device, said electronic device electrically connected to said leads; a first bonding means to seal said base component to said first side of said leadframe; a second bonding means to seal said cover component to said second side of said leadframe; and a third bonding means to seal said die attach pad to said base component.
Claim 19
Dependent Claim
29 words
The package of claim 16 wherein said third bonding means encircles the edge of said first aperture and is disposed between said base component and said die attach pad.
Claim 20
Dependent Claim
29 words
The package of claim 17 wherein said third bonding means is thermally conductive and selected from the group consisting of solder glasses, thermosetting polymer adhesives and thermoplastic polymer adhesives.
Claim 21
Dependent Claim
15 words
The package of claim 18 wherein said third bonding means is a silver filled epoxy.
Claim 22
Dependent Claim
31 words
The package of claim 19 wherein said first and second bonding means are electrically nonconductive and selected from the group consisting of solder glasses, thermosetting polymer adhesives and thermoplastic polymer adhesives.
Claim 23
Dependent Claim
15 words
The package of claim 20 wherein said first and second bonding means are essentially identical.
Claim 24
Dependent Claim
16 words
The package of claim 21 wherein said first and second bonding means are heat curable epoxies.
Claim 25
Dependent Claim
138 words
A package containing an enclosure for housing an electronic device, comprising: a base component; a cover component containing an aperture sealed with a plug; a leadframe with first and second opposing sides disposed between said base component and said cover component, said leadframe containing a plurality of leads disposed about a centrally positioned die attach pad and adapted to support said electronic device, said electronic device electrically connected to said leads; a first bonding means to seal said base component to said first side of said leadframe; a second bonding means to seal said cover component to said second side of said leadframe; and a thermally conductive third bonding means to seal said die attach to said base component, said third bonding means selected from the group consisting of solder glasses, thermosetting polymer adhesives and thermoplastic polymer adhesives.
Claim 26
Dependent Claim
138 words
A package containing an enclosure for housing an electronic device, comprising: a base component; a cover component containing an aperture sealed with a plug; a leadframe with first and second opposing sides disposed between said base component and said cover component, said leadframe containing a plurality of leads disposed about a centrally positioned die attach pad and adapted to support said electronic device, said electronic device electrically connected to said leads; a first bonding means to seal said base component to said first side of said leadframe; a second bonding means to seal said cover component to said second side of said leadframe; and a thermally conductive third bonding means to seal said die attach to said base component, said third bonding means selected from the group consisting of solder glasses, thermosetting polymer adhesives and thermoplastic polymer adhesives.
Claim 27
Dependent Claim
30 words
The package of claim 23 wherein said first and second means are electrically nonconductive and selected from the group consisting of solder glasses, thermosetting polymer adhesives and thermoplastic polymer adhesives.
Claim 28
Dependent Claim
15 words
The package of claim 24 wherein said first and second bonding means are essentially identical.
Claim 29
Dependent Claim
15 words
The package of claim 25 wherein said enclosure is filled with a thermally conductive medium.
Claim 30
Dependent Claim
24 words
The package of claim 26 wherein said thermally conductive medium is electrically nonconductive and selected from the group consisting of gases, liquids and powders.
Claim 31
Dependent Claim
12 words
The package of claim 27 wherein said thermally conductive medium is helium.
Claim 32
Dependent Claim
145 words
A package containing an enclosure to house an electronic device, comprising: a base component containing a first aperture; a cover component containing a second aperture, said second aperture sealed with a plug; a leadframe with first and second opposing sides disposed between said base component and said cover component, said leadframe containing a plurality of leads disposed about a centrally positioned die attach pad, said die attach pad positioned to seal said first aperture and adapted to support said electronic device, said electronic device electrically connected to said leads; a first bonding means to seal said base component to said first side of said leadframe; a second bonding means to seal said cover component to said second side of said leadframe; and a third bonding means positioned about the edge of said first aperture and disposed between said base component and said die attach component.
Claim 33
Dependent Claim
145 words
A package containing an enclosure to house an electronic device, comprising: a base component containing a first aperture; a cover component containing a second aperture, said second aperture sealed with a plug; a leadframe with first and second opposing sides disposed between said base component and said cover component, said leadframe containing a plurality of leads disposed about a centrally positioned die attach pad, said die attach pad positioned to seal said first aperture and adapted to support said electronic device, said electronic device electrically connected to said leads; a first bonding means to seal said base component to said first side of said leadframe; a second bonding means to seal said cover component to said second side of said leadframe; and a third bonding means positioned about the edge of said first aperture and disposed between said base component and said die attach component.
Claim 34
Dependent Claim
29 words
The package of claim 29 wherein said third bonding means is thermally conductive and selected from the group consisting of solder glasses, thermosetting polymer adhesives and thermoplastic polymer adhesives.
Claim 35
Dependent Claim
31 words
The package of claim 30 wherein said first and second bonding means are electrically nonconductive and selected from the group consisting of solder glasses, thermosetting polymer adhesives and thermoplastic polymer adhesives.
Claim 36
Dependent Claim
15 words
The package of claim 31 wherein said first and second bonding means are essentially identical.
Claim 37
Dependent Claim
18 words
The package of claim 29 wherein said plug sealing said second aperture is a solder or polymer adhesive.
Claim 38
Dependent Claim
16 words
The package of claim 33 wherein said plug is a solder comprised of lead and tin.
Claim 39
Dependent Claim
17 words
The package of claim 29 wherein said enclosure is filled with a thermally conductive, electrically insulating medium.
Claim 40
Dependent Claim
12 words
The package of claim 35 wherein said enclosure is filled with helium.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-01-29 | 1993-07-31 | 1994-01-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-01-29 | 1997-07-31 | 1998-01-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-01-29 | 2001-07-31 | 2002-01-30 | $7700.00 | Window Closed / Lapsed |