Patent US4891688A successfully refreshed from Google Patents.
US4891688A
Expired / Lapsed
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Very high-acceleration tolerant circuit card packaging structure
Assignee: Raytheon Co
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Filing: 1988-01-21
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Granted: 1990-01-02
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Expires: 2008-01-21
Abstract
Abstract A very high acceleration tolerant packaging structure 10 for protecting electronic circuit elements such as printed circuit cards 35 or ceramic cards. A rigid housing 15 has at least one planar member 35 for supporting electronic circuitry thereon, mounted within the housing so as to divide the interior of the housing into at least two chambers 50, 52. Each chamber is completely filled with a substantially incompressible fluid 60 so as to leave no air spaces or voids. The fluid in one chamber communicates with the fluid in another chamber only at a controllable rate. Preferably the planar members 35 have substantially the same shape as the cross sectional shape of the interior of the packaging system.
Inventors
- 👤 Ernest P. Longerich
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 16:27
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/14; H05K7/1422; H05K7/1427; H05K7/1434; B; B41; B41J; B41J2/00; B41J2/005; B41J2/01; B41J2/17; B41J2/175; B41J2/17593; H05K7/20; H05K7/20218; H05K7/20236
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
85 words
A very high acceleration tolerant circuit packaging structure comprising: a housing, said housing including rigid side walls and rigid end walls; at least one planar member for supporting electronic circuitry thereon, said planar member being suitably formed for mounting within said housing, said housing being divided into at least two chambers by said at least one planar member; an incompressible fluid, said fluid completely filling all of said chambers; and means for compressing for thermal expansion of said fluid said compensating means includes an orifice.
Claim 2
Dependent Claim
85 words
A very high acceleration tolerant circuit packaging structure comprising: a housing, said housing including rigid side walls and rigid end walls; at least one planar member for supporting electronic circuitry thereon, said planar member being suitably formed for mounting within said housing, said housing being divided into at least two chambers by said at least one planar member; an incompressible fluid, said fluid completely filling all of said chambers; and means for compressing for thermal expansion of said fluid said compensating means includes an orifice.
Claim 3
Dependent Claim
29 words
The structure as claimed in claim 1 wherein said means for compensating for thermal expansion of said fluid includes at least one orifice extending through each said planar member.
Claim 4
Dependent Claim
41 words
The structure as claimed in claim 2 wherein said means for compensating for thermal expansion of said fluid further includes, a housing orifice extending through said housing, said housing orifice extending through said housing being in fluid communication with a reservoir.
Claim 5
Dependent Claim
18 words
The structure of claim 1 wherein said housing is cylindrical about an axis perpendicular to said planar members.
Claim 6
Dependent Claim
13 words
The structure of claim 1 wherein said housing is a cast aluminum housing.
Claim 7
Dependent Claim
22 words
The structure of claim 1 wherein at least one of said planar members is a semiconductor wafer having electronic circuitry disposed thereon.
Claim 8
Dependent Claim
41 words
The structure of claim 1 further comprising: a plurality of opened electronic packages, said opened electronic packages being mounted on at least one of said planar members such that voids existing in closed electronic packages are filled by said incompressible fluid.
Claim 9
Dependent Claim
34 words
The structure as claimed in claim 1 wherein the density of said incompressible fluid is matched to the density of said planar members such that said planar members exhibit neutral buoyancy within said housing.
Claim 10
Dependent Claim
41 words
The structure as claimed in claim 8 wherein said means for compensating for thermal expansion of said fluid includes at least one orifice extending through each said planar member, said orifice being sized to accommodate chamber purge and fill flow rates.
Claim 11
Dependent Claim
39 words
The structure as claimed in claim 1 wherein incompressible fluid includes micro-spheres that adjust the density of said incompressible fluid to match the density of said planar members such that said planar members exhibit neutral buoyancy within said housing.
Claim 12
Dependent Claim
41 words
The structure as claimed in claim 10 wherein said means for compensating for thermal expansion of said fluid includes at least one orifice extending through each said planar member, said orifice being signed to accommodate chamber purge and fill flow rates.
References Cited (Backward Citations)
US3851221A
Cited
US4399484A
Cited
US4450505A
Cited
US4468717A
Cited
US4694378A
Cited
US4739443A
Cited
US4706091A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-01-01 | 1993-07-03 | 1994-01-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-01-01 | 1997-07-03 | 1998-01-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-01-01 | 2001-07-03 | 2002-01-02 | $7700.00 | Window Closed / Lapsed |