← Back to Patent Explorer
US4450505A Expired / Lapsed US ⏱️ 0.0 years remaining

Apparatus for cooling integrated circuit chips

Assignee: Unisys Corp
•
Filing: 1982-06-09
•
Granted: 1984-05-22
•
Expires: 2002-06-09
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A multichip thermal conduction module has improved cooling in a housing having a board including chips mounted on the board. The housing is divided so as to form first and second cooling portions. The chips are in the first cooling portion. Several bellows extend into the first cooling portion so that each bellows is urged into deflecting contact with a respective chip. A plurality of heat conducting strands are mounted in each bellows and extend into the second cooling portion. A fluid coolant is directed to flow across the heat conducting strands.

Inventors

  • 👤 Faquir C. Mittal
  • 👤 Joseph S. Mathias

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-07 16:27
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H05K7/2039; H05K7/20436; H05K7/20445; H05K7/20454; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H10W40/70; H10W40/77; H10W40/772

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 199 words
An integrated circuit chips cooling apparatus, comprising: a housing including a board having integrated circuit chips mounted thereon, said chips having a substantially planar surface; means mounted in the housing and forming first and second cooling portions, said chips being in said first portion, said second cooling portion including an entrance chamber separated from an exit chamber by a plate having a plurality of apertures formed therein; first means being a flexible bellows having a first end connected to said mounted means and a second end extending into said first cooling portion and conforming contact with said planar surface said bellows having an inside width; second means being a bunch of heat conducting strands having a first end connected to said bellows and a second end extending into said second cooling portion and terminating adjacent said apertures, said first end of said bunch of strands having a first width and said second end having a second width wider than said first width, said first width being less than said inside width and said second width being at least as wide as said inside width; a fluid inlet in said entrance chamber; and a fluid outlet in said exit chamber.
Claim 2
Dependent Claim 199 words
An integrated circuit chips cooling apparatus, comprising: a housing including a board having integrated circuit chips mounted thereon, said chips having a substantially planar surface; means mounted in the housing and forming first and second cooling portions, said chips being in said first portion, said second cooling portion including an entrance chamber separated from an exit chamber by a plate having a plurality of apertures formed therein; first means being a flexible bellows having a first end connected to said mounted means and a second end extending into said first cooling portion and conforming contact with said planar surface said bellows having an inside width; second means being a bunch of heat conducting strands having a first end connected to said bellows and a second end extending into said second cooling portion and terminating adjacent said apertures, said first end of said bunch of strands having a first width and said second end having a second width wider than said first width, said first width being less than said inside width and said second width being at least as wide as said inside width; a fluid inlet in said entrance chamber; and a fluid outlet in said exit chamber.
Claim 3
Dependent Claim 23 words
The apparatus of claim 1 including: means connected to said inlet and outlet for moving a fluid coolant through said second cooling portion.
Claim 4
Dependent Claim 14 words
The apparatus of claim 1 including: an inert fluid in said first cooling portion.

References Cited (Backward Citations)

US4156458A Cited
US4138692A Cited
US4203129A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1987-05-22 1987-11-21 1988-05-22 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1991-05-22 1991-11-21 1992-05-22 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1995-05-22 1995-11-21 1996-05-22 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag