US4891685A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Rectifying P-N junction having improved breakdown voltage characteristics and method for fabricating same
Assignee: Arris Technology Inc
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Filing: 1988-01-11
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Granted: 1990-01-02
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Expires: 2008-01-11
Abstract
Abstract A rectifier is fabricated from a P-N junction having a P-type semiconductor layer and an adjacent N-type semiconductor layer. A mesa structure is formed in at least one of said layers. Impurities are deposited at the top of the mesa to form a high concentration region in the surface thereof. The impurities are diffused from the top surface of the mesa toward the P-N junction, whereby the mesa geometry causes the diffusion to take on a generally concave shape as it penetrates into the mesa. The distance between the perimeter of the high concentration region and the wafer substrate is therefore greater than the distance between the central portion of said region and the wafer substrate, providing improved breakdown voltage characteristics and a lower surface field. Breakdown voltage can be measured during device fabrication and precisely controlled by additional diffusions to drive the high concentration region to the required depth.
Inventors
- 👤 Willem G. Einthoven
- 👤 Muni M. Mitchell
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:35
CPC Classifications
H; H10; H10D; H10D62/00; H10D62/10; H10D62/102; H10D62/103; H10D62/104; H10D62/60; H10D8/00; H10D8/01; H10D8/045; H10D8/422; Y; Y10; Y10S; Y10S438/00; Y10S438/965; Y10S438/978
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
244 words
A rectifier having a rectifying P-N junction with improved breakdown voltage characteristics, comprising: a mesa in at least the epitaxial layer of an epitaxially grown P-N wafer with the top of the mesa at the top surface of the epitaxial layer and the side wall of the mesa sloping outwardly from the top of the mesa toward the wafer substrate and extending into said substrate; a high concentration semiconductor region in the surface of the epitaxial layer, said high concentration region having the same polarity as the remainder of said epitaxial layer and the opposite polarity as said substrate, and covering an area sufficient to extend across the top of said mesa whereby a junction between said high concentration region and the remainder of said epitaxial layer intersects the side wall of said mesa; and an oxide layer on the side wall of said mesa to passivate said mesa, said oxide layer covering the P-N junction between said epitaxial layer and said substrate and said junction between said high concentration region and the remainder of said epitaxial layer; said high concentration region extending from the top of said mesa into said epitaxial layer, but not beyond the base of said mesa; and the high concentration region having a generally concave shape at the side wall of the mesa such that the distance between the high concentration region and the wafer substrate gradually increases in the direction of the sloping side wall of the mesa.
Claim 2
Dependent Claim
244 words
A rectifier having a rectifying P-N junction with improved breakdown voltage characteristics, comprising: a mesa in at least the epitaxial layer of an epitaxially grown P-N wafer with the top of the mesa at the top surface of the epitaxial layer and the side wall of the mesa sloping outwardly from the top of the mesa toward the wafer substrate and extending into said substrate; a high concentration semiconductor region in the surface of the epitaxial layer, said high concentration region having the same polarity as the remainder of said epitaxial layer and the opposite polarity as said substrate, and covering an area sufficient to extend across the top of said mesa whereby a junction between said high concentration region and the remainder of said epitaxial layer intersects the side wall of said mesa; and an oxide layer on the side wall of said mesa to passivate said mesa, said oxide layer covering the P-N junction between said epitaxial layer and said substrate and said junction between said high concentration region and the remainder of said epitaxial layer; said high concentration region extending from the top of said mesa into said epitaxial layer, but not beyond the base of said mesa; and the high concentration region having a generally concave shape at the side wall of the mesa such that the distance between the high concentration region and the wafer substrate gradually increases in the direction of the sloping side wall of the mesa.
Claim 3
Dependent Claim
24 words
The rectifier of claim 1 wherein the depth of said high concentration region is set to establish a desired breakdown voltage for the rectifier.
Claim 4
Dependent Claim
15 words
The rectifier of claim 1 wherein said mesa is in the shape of a frustum.
Claim 5
Dependent Claim
28 words
A rectifier as set forth in claim 1 wherein said epitaxial layer and said substrate form a substantially flat P-N junction which intersects the sidewall of said mesa.
Claim 6
Dependent Claim
33 words
The rectifier of claim 1 further comprising a metal layer overlaying said high concentration region and said oxide layer on at least part of the mesa side wall to provide a field shield.
Claim 7
Dependent Claim
17 words
A rectifier as set forth in claim 1 wherein said oxide layer is a grown oxide layer.
Claim 8
Dependent Claim
23 words
A rectifier as set forth in claim 1 wherein said remainder of said epitaxial layer is shaped to be entirely depleted at breakdown.
Claim 9
Dependent Claim
196 words
An article of manufacture resulting from the steps of: providing a semiconductor junction having a semiconductor layer of a first polarity and an adjacent lightly doped semiconductor layer of a second polarity in a semiconductor wafer having <100> crystal orientation; forming a mesa in said lightly doped layer having walls defined by said <100> crystal orientation that slope outwardly from a top surface thereof toward said junction; forming a high concentration region extending entirely across the top surface of the mesa, said high concentration region being of the same semiconductor type as the lightly doped layer, whereby the junction between said high concentration region and the remainder of said lightly doped layer intersects the outwardly sloping walls of said mesa; and diffusing the high concentration region deeper into the mesa toward said junction but not below the base of the mesa, relying on the outward slope of the mesa geometry to cause the diffusion to take on a generally concave shape as it penetrates into the mesa, with the distance between the diffused high concentration region and the junction being greater adjacent the sloping walls of the mesa than in the central core of the mesa.
Claim 10
Dependent Claim
196 words
An article of manufacture resulting from the steps of: providing a semiconductor junction having a semiconductor layer of a first polarity and an adjacent lightly doped semiconductor layer of a second polarity in a semiconductor wafer having <100> crystal orientation; forming a mesa in said lightly doped layer having walls defined by said <100> crystal orientation that slope outwardly from a top surface thereof toward said junction; forming a high concentration region extending entirely across the top surface of the mesa, said high concentration region being of the same semiconductor type as the lightly doped layer, whereby the junction between said high concentration region and the remainder of said lightly doped layer intersects the outwardly sloping walls of said mesa; and diffusing the high concentration region deeper into the mesa toward said junction but not below the base of the mesa, relying on the outward slope of the mesa geometry to cause the diffusion to take on a generally concave shape as it penetrates into the mesa, with the distance between the diffused high concentration region and the junction being greater adjacent the sloping walls of the mesa than in the central core of the mesa.
Claim 11
Dependent Claim
193 words
An article of manufacture resulting from the steps of: forming a mesa shape in at least the epitaxial layer of an epitaxially grown P-N wafer with the top of the mesa at the top surface of the epitaxial layer and the side wall of the mesa sloping outwardly from the top of the mesa toward the wafer substrate; forming a high concentration semiconductor region in the surface of the epitaxial layer, said region covering an area sufficient to extend across the top of said mesa, whereby a junction between said high concentration region and the remainder of said epitaxial layer intersects the side wall of said mesa; and driving said high concentration region from the top of said mesa deeper into said epitaxial layer, but not beyond the base of said mesa relying on the outward slope of the mesa geometry to cause the high concentration region to take on a generally concave shape as it penetrates into the epitaxial layer within the mesa, with the distance between the high concentration region and the wafer substrate being greater adjacent the sloping walls of the mesa than in the central portion of said mesa.
Claim 12
Dependent Claim
193 words
An article of manufacture resulting from the steps of: forming a mesa shape in at least the epitaxial layer of an epitaxially grown P-N wafer with the top of the mesa at the top surface of the epitaxial layer and the side wall of the mesa sloping outwardly from the top of the mesa toward the wafer substrate; forming a high concentration semiconductor region in the surface of the epitaxial layer, said region covering an area sufficient to extend across the top of said mesa, whereby a junction between said high concentration region and the remainder of said epitaxial layer intersects the side wall of said mesa; and driving said high concentration region from the top of said mesa deeper into said epitaxial layer, but not beyond the base of said mesa relying on the outward slope of the mesa geometry to cause the high concentration region to take on a generally concave shape as it penetrates into the epitaxial layer within the mesa, with the distance between the high concentration region and the wafer substrate being greater adjacent the sloping walls of the mesa than in the central portion of said mesa.
Claim 13
Dependent Claim
234 words
A rectifier having a rectifying P-N junction with improved breakdown voltage characteristics, comprising: a P-N junction formed from a P-type semiconductor layer and an adjacent N-type semiconductor layer, said layers defining a mesa with a top of the mesa in a top one of the layers, and a side wall of the mesa sloping outwardly from the top of the mesa toward the other layer and extending into said other layer; a high concentration region in the top layer of the mesa, said high concentration region having the same polarity as but a higher concentration than the remainder of the top layer and the opposite polarity as said other layer, and covering an area sufficient to extend across the top of said mesa, whereby a junction between said high concentration region and the remainder of said top layer intersects the side wall of said mesa; and a grown oxide layer on the side wall of said mesa to passivate said mesa, said oxide layer covering the P-N junction and said junction between said high concentration region and the remainder of said top layer, said high concentration region extending from the top of said mesa into said top layer with a generally concave shape at the side wall of the mesa such that the distance between the high concentration region and the P-N junction gradually increases in the direction of side wall of the mesa.
Claim 14
Dependent Claim
234 words
A rectifier having a rectifying P-N junction with improved breakdown voltage characteristics, comprising: a P-N junction formed from a P-type semiconductor layer and an adjacent N-type semiconductor layer, said layers defining a mesa with a top of the mesa in a top one of the layers, and a side wall of the mesa sloping outwardly from the top of the mesa toward the other layer and extending into said other layer; a high concentration region in the top layer of the mesa, said high concentration region having the same polarity as but a higher concentration than the remainder of the top layer and the opposite polarity as said other layer, and covering an area sufficient to extend across the top of said mesa, whereby a junction between said high concentration region and the remainder of said top layer intersects the side wall of said mesa; and a grown oxide layer on the side wall of said mesa to passivate said mesa, said oxide layer covering the P-N junction and said junction between said high concentration region and the remainder of said top layer, said high concentration region extending from the top of said mesa into said top layer with a generally concave shape at the side wall of the mesa such that the distance between the high concentration region and the P-N junction gradually increases in the direction of side wall of the mesa.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-01-01 | 1993-07-03 | 1994-01-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-01-01 | 1997-07-03 | 1998-01-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-01-01 | 2001-07-03 | 2002-01-02 | $7700.00 | Window Closed / Lapsed |