Patent US4887760A successfully refreshed from Google Patents.
US4887760A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Bonding sheet for electronic component and method of bonding electronic component using the same
Assignee: Toshiba Corp
•
Filing: 1987-08-27
•
Granted: 1989-12-19
•
Expires: 2007-08-27
Abstract
Abstract The bonding sheet of the present invention comprises a substrate having an opening, and a low-melting point bonding metal which closes the opening or is arranged on the peripheral portion of the opening, to project in the opening. According to a bonding sheet of the present invention, a low-melting point bonding metal is interposed between a conductor pattern of a substrate and electrode terminals of an electronic component, and is bonded by thermocompression at a low temperature without melting the low-melting point bonding metal, so that bonding of a large number of electrode terminals can be completed by a single bonding operation.
Inventors
- 👤 Thunekazu Yoshino
- 👤 Hiroshi Morita
- 👤 Hirotaka Nakano
- 👤 Nobuo Hayashi
- 👤 Yuko Kubota
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 10:49
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H10; H10W; H10W70/00; H10W70/01; H10W70/04; H10W70/047; H10W72/00; H10W72/071; H10W72/072; H10W90/00; H10W90/401; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10378; H05K2201/10424; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0108; H05K2203/04; H05K2203/0405; H05K3/346; H05K3/40; H05K3/4038; H05K3/4084; H10W72/07231; H10W72/07232; H10W72/07236; H10W72/20; H10W72/251; H10W72/252; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
49 words
A bonding sheet for an electronic component, comprising: a substrate having an opening, and a plurality of low-melting point bonding metal strips disposed at and projecting from a peripheral portion of said opening of said substrate, toward an inner portion of said opening but not completely closing said opening.
Claim 2
Dependent Claim
49 words
A bonding sheet for an electronic component, comprising: a substrate having an opening, and a plurality of low-melting point bonding metal strips disposed at and projecting from a peripheral portion of said opening of said substrate, toward an inner portion of said opening but not completely closing said opening.
Claim 3
Dependent Claim
19 words
A sheet according to claim 1, wherein said low-melting point bonding metal strips comprise a low-melting point adherent alloy.
Claim 4
Dependent Claim
42 words
A sheet according to claim 2, wherein said low-melting point adherent alloy contains, as major constituents, a low-melting point solder alloy, and an element for improving bonding strength at an interface between said alloy and an electronic component to be bonded thereto.
Claim 5
Dependent Claim
32 words
A sheet according to claim 3, wherein said low-melting point solder alloy contains, as major constituents, In and two elements selected from the group consisting of Pb, Sn, Zn, Cd, and Bi.
Claim 6
Dependent Claim
19 words
A sheet according to claim 3, wherein said element for improving the bonding strength at the interface is Sb.
Claim 7
Dependent Claim
50 words
A sheet according to claim 2, wherein said low-melting point adherent alloy contains, as major components, a low-melting point solder alloy, an element for improving bonding strength at an interface between said alloy and an electronic component to be bonded thereto, and an element having a strong affinity with oxygen.
Claim 8
Dependent Claim
32 words
A sheet according to claim 6, wherein said low-melting point solder alloy contains, as major components, In and two elements selected from the group consisting of Pb, Sn, Zn, Cd, and Bi.
Claim 9
Dependent Claim
19 words
A sheet according to claim 6, wherein said element for improving the bonding strength at the interface is Sb.
Claim 10
Dependent Claim
33 words
A sheet according to claim 6, wherein said element having the strong affinity with oxygen is an element selected from the group consisting of Zn, Al, Ti, Si, Cr, Be, and rare-earth elements.
Claim 11
Dependent Claim
28 words
A sheet according to claim 2, wherein said low-melting point adherent alloy has a softening point of approximately 130° C. and a melting point of approximately 160° C.
Claim 12
Dependent Claim
13 words
A bonding sheet as in claim 1, wherein said substrate is not transparent.
Claim 13
Independent Claim
99 words
A method of bonding an electronic component comprising: a first step of arranging, between electrode terminals of the electronic component and a conductor pattern to be electrically connected to said terminals, a bonding sheet for an electronic component, comprising a substrate having an opening, and a low-melting point bonding metal plurality of disposed at and projecting from a peripheral portion of said opening of said substrate, toward an inner portion of said opening but not completely closing said opening; and a second step of bonding said electrode terminals and said conductor pattern through said low-melting point bonding metal strips.
Claim 14
Independent Claim
99 words
A method of bonding an electronic component comprising: a first step of arranging, between electrode terminals of the electronic component and a conductor pattern to be electrically connected to said terminals, a bonding sheet for an electronic component, comprising a substrate having an opening, and a low-melting point bonding metal plurality of disposed at and projecting from a peripheral portion of said opening of said substrate, toward an inner portion of said opening but not completely closing said opening; and a second step of bonding said electrode terminals and said conductor pattern through said low-melting point bonding metal strips.
Claim 15
Dependent Claim
15 words
A method according to claim 12, wherein said conductor pattern comprises a transparent conductive film.
Claim 16
Dependent Claim
31 words
A method according to claim 13, wherein said transparent conductive film is of a material selected from the group consisting of SnO 2 , In 2 O 3 , and ITO.
Claim 17
Dependent Claim
16 words
A method according to claim 12, wherein said electronic component is a semiconductor integrated circuit element.
Claim 18
Dependent Claim
18 words
A method according to claim 15, wherein said electrode terminals of said electronic component are formed of Al.
Claim 19
Dependent Claim
22 words
A method according to claim 15, wherein said electrode terminals of said electronic component comprise a multilayered structure of Al and Sn.
Claim 20
Dependent Claim
22 words
A method according to claim 15, wherein said electrode terminals of said electronic component comprise a multilayered structure of Al and Au.
Claim 21
Dependent Claim
28 words
A method according to claim 12, wherein said low-melting point adherent alloy has a softening point of approximately 130° C. and a melting point of approximately 160° C.
Claim 22
Dependent Claim
45 words
A method as in claim 12, wherein said substrate is not transparent, and comprising the further step of, before said second step, inspecting a proper alignment between said electrode pattern and said conductive pattern, by visually inspecting through said opening which is not completely closed.
Claim 23
Dependent Claim
22 words
A method as in claim 12, wherein said first step includes attaching said bonding metal strips to a surface of said substrate.
Claim 24
Dependent Claim
41 words
A method according to claim 21, wherein the second step includes the steps of heating said low-melting point bonding metal strips to a temperature below the melting point thereof, and thermocompression-bonding said electrode terminals and said conductor pattern to each other.
Claim 25
Dependent Claim
29 words
A method according to claim 22, wherein said low-melting point bonding metal strips are heated to a temperature ranging from its softening point to its melting point, and half-molten.
References Cited (Backward Citations)
US3568301A
Cited
DE1919567A1
Cited
FR2112466A1
Cited
GB1371738A
Cited
JPS5330448A
Cited
US4067104A
Cited
JPS57134294A
Cited
US4705205A
Cited
EP0171662A2
Cited
US4646435A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-12-18 | 1993-06-19 | 1993-12-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-12-18 | 1997-06-19 | 1997-12-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-12-18 | 2001-06-19 | 2001-12-19 | $7700.00 | Window Closed / Lapsed |