Patent US4887544A successfully refreshed from Google Patents.
US4887544A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Vacuum well process
Assignee: Hughes Missile Systems Co
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Filing: 1988-03-14
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Granted: 1989-12-19
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Expires: 2008-03-14
Abstract
Abstract A system and process, including a combination of a solder well and a vacuum system wherein micro through holes are filled with solder. A PC board or the like is supported for contact with solder on one side and with a vacuum apparatus for the application of a vacuum to the other side so that solder is drawn into the through holes for establishing electrically conductive connections therethrough.
Inventors
- 👤 Patrick O. Nunally
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 17:59
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/0085; H05K3/0088; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0305; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09572; H05K2201/096; H05K2203/00; H05K2203/08; H05K2203/082; H05K3/40; H05K3/4038
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
105 words
An apparatus for micro miniature feedthrough coupling of a substrate having an upper and a lower planar side and having micro through holes, said apparatus comprising: means for supporting said substrate; means for applying a continuous quantity of molten solder to only said lower planar side of said substrate; and means for applying a vacuum to said upper planar side of said substrate directly opposite said molten solder while it is applied to said lower planar side of said substrate, said vacuum forcing a quantity of said molten solder into said through holes for filling said through holes with a quantity of said molten solder.
Claim 2
Independent Claim
105 words
An apparatus for micro miniature feedthrough coupling of a substrate having an upper and a lower planar side and having micro through holes, said apparatus comprising: means for supporting said substrate; means for applying a continuous quantity of molten solder to only said lower planar side of said substrate; and means for applying a vacuum to said upper planar side of said substrate directly opposite said molten solder while it is applied to said lower planar side of said substrate, said vacuum forcing a quantity of said molten solder into said through holes for filling said through holes with a quantity of said molten solder.
Claim 3
Dependent Claim
25 words
The apparatus according to claim 1, wherein said means for applying said molten solder to said lower side of said substrate comprises a wave well.
Claim 4
Dependent Claim
16 words
The apparatus according to claim 1, wherein said means for supporting said substrate comprises a conveyer.
Claim 5
Dependent Claim
26 words
The apparatus according to claim 1, wherein said vacuum means includes means for applying a ramp up and ramp down of the level of said vacuum.
Claim 6
Dependent Claim
25 words
The apparatus according to claim 4, wherein said means for applying said molten solder to said lower side of said substrate comprises a wave well.
Claim 7
Dependent Claim
16 words
The apparatus according to claim 5, wherein said means for supporting said substrate comprises a conveyer.
Claim 8
Independent Claim
117 words
An apparatus for establishing a feedthrough coupling via a micro through hole of a substrate having an upper and a lower planar side and a plurality of micro through holes, said apparatus comprising: means for supporting said substrate; wave well means for applying a continuous quantity of molten solder to only said lower planar side of said substrate; and vacuum means for applying a vacuum to said upper planar side of said substrate from directly opposite the molten solder while it is applied to said lower planar side of said substrate for forcing a quantity of said molten solder into said micro through hole for filling said micro through hole with a quantity of said molten solder.
Claim 9
Independent Claim
117 words
An apparatus for establishing a feedthrough coupling via a micro through hole of a substrate having an upper and a lower planar side and a plurality of micro through holes, said apparatus comprising: means for supporting said substrate; wave well means for applying a continuous quantity of molten solder to only said lower planar side of said substrate; and vacuum means for applying a vacuum to said upper planar side of said substrate from directly opposite the molten solder while it is applied to said lower planar side of said substrate for forcing a quantity of said molten solder into said micro through hole for filling said micro through hole with a quantity of said molten solder.
Claim 10
Dependent Claim
16 words
The apparatus according to claim 7, wherein said means for supporting said substrate comprises a conveyer.
Claim 11
Dependent Claim
26 words
The apparatus according to claim 7, wherein said vacuum means includes means for applying a ramp up and ramp down of the level of said vacuum.
Claim 12
Dependent Claim
16 words
The apparatus according to claim 9, wherein said means for supporting said substrate comprises a conveyer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-12-18 | 1993-06-19 | 1993-12-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-12-18 | 1997-06-19 | 1997-12-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-12-18 | 2001-06-19 | 2001-12-19 | $7700.00 | Window Closed / Lapsed |